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BQ79616PAPTQ1

Texas Instruments

BQ79616PAPTQ1 by Texas Instruments

BQ79616PAPTQ1 by Texas Instruments is a Power Management IC with operating temperatures from -40 to 125°C. It features Nickel Palladium Gold terminal finish, suitable for automotive applications. This IC supports power supply circuits and has a peak reflow temperature of 260°C.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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VNN

France . 18,600 parts In-Stock

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Vyrian

USA . 5,731 parts In-Stock

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Digiode

USA . 1,173 parts In-Stock

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Nova Conductors

Japan . 300 parts In-Stock

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300

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One Stop Electronics

USA . 869 parts In-Stock

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$2.500

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869

$2.500

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Semicontronic

India . 760 parts In-Stock

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$2.500

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$2.438

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$2.425

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760

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Ampacity Inc.

Singapore . 1,241 parts In-Stock

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$7.500

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Parana Technologies

USA . 338 parts In-Stock

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$9.821

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$10.391

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338

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DigiPath Technology Company

USA . 2,361 parts In-Stock

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$10.814

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ChromeModa Solutions

Germany . 1,224 parts In-Stock

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$11.035

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$9.049

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IDEA Electronic Components Group

UK . 733 parts In-Stock

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$11.035

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$10.483

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$9.932

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733

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Advanced Electronics

New Zealand . 3,959 parts In-Stock

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$11.595

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$11.015

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AZTECH Wire

Italy . 197 parts In-Stock

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$12.391

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Corohmni

South Africa . 729 parts In-Stock

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Continental Prestige Electronics

USA . 5,219 parts In-Stock

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Microchip USA

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Corphita

USA . 2,286 parts In-Stock

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Argo Parts USA

USA . 470 parts In-Stock

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470

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Experience the superior quality and reliability of Texas Instruments with the BQ79616PAPTQ1 Power Management IC. Designed for automotive applications, this innovative product offers unmatched performance in power supply support circuitry. With a wide operating temperature range and advanced terminal finish, this IC ensures optimal functionality even in challenging environments. Trust Texas Instruments to deliver cutting-edge solutions that exceed your expectations and provide unparalleled value for your power management needs.

Feature Benefit Bullets

Maximum Operating Temperature: 125 °C

This high maximum operating temperature ensures the product can withstand harsh environmental conditions, making it reliable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function efficiently even in extremely cold environments, increasing its versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of high-quality terminal finish enhances the product's durability and ensures reliable electrical connections for optimal performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit, this product is designed to efficiently manage and regulate power, making it essential for various electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds helps in preventing thermal damage during the soldering process, ensuring the product's longevity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C allows for reliable solder joints, ensuring the product's longevity and performance under demanding conditions.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means this product meets strict industry standards for reliability and performance in automotive applications, making it a trusted choice for automotive power management.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product is less prone to moisture damage during storage and handling, ensuring its reliability and longevity in various environments.

Technical Specifications

Power Management ICs BQ79616PAPTQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Peak Reflow Temperature (C):

260

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

BQ79616PAPTQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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