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STHS2377ADW6E

STMicroelectronics

STHS2377ADW6E by STMicroelectronics

STHS2377ADW6E by STMicroelectronics is a power management IC with a nominal voltage of 48V, operating b/w -40 °C to 85°C. It features an 8-terminal gull-wing design and supports adjustable thresholds. Ideal for industrial applications, it ensures efficient power supply management in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,802 parts In-Stock

1+ parts

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4,802

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Anansix

USA . 2,563 parts In-Stock

1+ parts

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2,563

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Digiode

USA . 2,356 parts In-Stock

1+ parts

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2,356

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,598 parts In-Stock

1+ parts

$7.269

100+ parts

-

1k+ parts

$6.542

10k+ parts

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1,598

$7.269

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$6.542

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MKK Technologies

India . 2,046 parts In-Stock

1+ parts

$13.669

100+ parts

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2,046

$13.669

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DigiPath Technology Company

USA . 2,046 parts In-Stock

1+ parts

$13.669

100+ parts

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2,046

$13.669

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Corphita

USA . 3,227 parts In-Stock

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3,227

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Parana Technologies

USA . 2,188 parts In-Stock

1+ parts

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100+ parts

$8.691

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2,188

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$8.691

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Overview

Unlock powerful efficiency with the STHS2377ADW6E from STMicroelectronics. This top-tier Power Management IC combines exceptional reliability with cutting-edge technology, ensuring peak performance in demanding environments. Designed for seamless integration and enhanced longevity, it supports a wide range of applications—from industrial automation to telecommunications. Experience superior quality, reduced energy consumption, and robust temperature resilience, all wrapped in a compact design that maximizes your system's potential.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability, making the IC suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easier integration into compact circuits, saving space and reducing assembly costs.

Package Shape: RECTANGULAR

A rectangular package shape enhances the layout flexibility on printed circuit boards (PCBs).

Nominal Supply Voltage (Vsup): 48 V

The 48 V nominal supply voltage is ideal for industrial and telecommunications applications, ensuring compatibility with standard power systems.

Power Supplies (V): 48

Supports 48 V power supplies, making it suitable for high-performance applications requiring a stable voltage.

No. of Terminals: 8

With 8 terminals, the IC provides ample connection points for effective circuit integration.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design makes this IC perfect for space-constrained applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in high-temperature environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for use in harsh, cold climates.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent solderability and protects against corrosion, enhancing long-term reliability.

Terminal Position: DUAL

Dual terminal positioning aids in flexible PCB design, allowing for efficient use of space.

Maximum Seated Height: 1.2 mm

The low seated height of 1.2 mm helps keep the profile slim and suitable for compact devices.

Width (mm): 3.1 mm

A width of 3.1 mm contributes to the IC's compact design, ideal for space-restricted applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC enhances the overall efficiency and reliability of power management in systems.

Minimum Supply Voltage (Vsup): 0 V

The capability to operate down to 0 V makes the IC versatile for various circuits, including low power and standby modes.

Length: 4.3 mm

With a length of 4.3 mm, the IC maintains a compact footprint necessary for modern electronic designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures performance reliability in challenging operating conditions typically found in industry.

Maximum Supply Current (Isup): 0.45 mA

A maximum supply current of 0.45 mA helps to minimize power consumption, making the IC energy-efficient.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improved mechanical strength, ensuring a secure connection.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density designs without compromising performance.

Maximum Supply Voltage (Vsup): 57 V

The capability of handling up to 57 V makes this IC suitable for high voltage applications, providing a wide operational range.

Adjustable Threshold: YES

The adjustable threshold feature adds design flexibility, allowing customization for specific application needs.

Technical Specifications

Power Management ICs STHS2377ADW6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3.1 mm

Trade Compliance

STHS2377ADW6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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