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STHS2375AM6E

STMicroelectronics

STHS2375AM6E by STMicroelectronics

STHS2375AM6E by STMicroelectronics is a versatile power management IC with a nominal voltage of 48V and operates in extreme temperatures from -40 °C to 85°C. It features an adjustable threshold and supports up to 57V, making it ideal for industrial applications. Its compact design (4.8mm x 3.8mm) ensures efficient surface mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,203 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,203

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-

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Vyrian

USA . 2,693 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,693

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-

-

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Anansix

USA . 2,242 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

-

2,242

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,784 parts In-Stock

1+ parts

$21.639

100+ parts

-

1k+ parts

$19.475

10k+ parts

-

1,784

$21.639

-

$19.475

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MKK Technologies

India . 1,735 parts In-Stock

1+ parts

$40.691

100+ parts

-

1k+ parts

-

10k+ parts

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1,735

$40.691

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-

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DigiPath Technology Company

USA . 1,735 parts In-Stock

1+ parts

$40.691

100+ parts

-

1k+ parts

-

10k+ parts

-

1,735

$40.691

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-

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Corphita

USA . 4,647 parts In-Stock

1+ parts

-

100+ parts

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4,647

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Parana Technologies

USA . 2,351 parts In-Stock

1+ parts

-

100+ parts

$25.873

1k+ parts

-

10k+ parts

-

2,351

-

$25.873

-

-

Overview

Elevate your power management solutions with the STHS2375AM6E from STMicroelectronics—a trusted leader in cutting-edge technology. This robust IC delivers unparalleled reliability and efficiency, operating seamlessly across extreme temperatures. Ideal for industrial applications, it ensures optimal performance while saving space with its sleek design. Experience enhanced power supply support that not only meets but exceeds your expectations, driving your projects toward success with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY ensures a lightweight, durable design suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact design and efficient use of board space.

Package Shape: RECTANGULAR

Rectangular package shape is optimal for efficient PCB layout and integration with other components.

Nominal Supply Voltage (Vsup): 48 V

Operating at a nominal supply voltage of 48 V makes it ideal for high-voltage power management applications.

Power Supplies (V): 48

Designed to support 48 V power supplies, making it a versatile option for various systems.

No. of Terminals: 8

With 8 terminals, the IC provides sufficient connectivity for multiple functions in compact designs.

Package Style (Meter): SMALL OUTLINE

The small outline style is suitable for space-constrained applications while maintaining performance.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability and stability in higher-temperature environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is well-suited for harsh and extreme conditions.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layout options and easier integration.

Maximum Seated Height: 1.75 mm

A low maximum seated height supports low-profile designs, critical in modern electronics.

Width: 3.8 mm

Compact width of 3.8 mm enables high-density PCB designs without compromising performance.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it is essential for ensuring stable and efficient power management.

Minimum Supply Voltage (Vsup): 0 V

Starting from 0 V ensures compatibility with a wide range of systems, enhancing flexibility.

Length: 4.8 mm

The length of 4.8 mm strikes a balance between compactness and functionality.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees performance and reliability in demanding environments.

Maximum Supply Current (Isup): 0.45 mA

0.45 mA maximum supply current indicates low power consumption, enhancing energy efficiency.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical support, ensuring robust connections.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is suitable for various PCB designs, allowing for versatile placement options.

Maximum Supply Voltage (Vsup): 57 V

A maximum supply voltage of 57 V extends the application range to high-power systems.

Adjustable Threshold: YES

Adjustable threshold features enhance the product’s configurability for different application requirements.

Technical Specifications

Power Management ICs STHS2375AM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

Length:

4.8 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.8 mm

Trade Compliance

STHS2375AM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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