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STHS2376ADW6E

STMicroelectronics

STHS2376ADW6E by STMicroelectronics

STHS2376ADW6E by STMicroelectronics is a power management IC with a nominal voltage of 48V and operates in extreme temperatures from -40 °C to 85°C. It features an 8-terminal gull-wing design for efficient surface mounting. Ideal for industrial applications, it supports adjustable thresholds and has a compact footprint (3.1mm x 4.3mm).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,461 parts In-Stock

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4,461

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Digiode

USA . 1,683 parts In-Stock

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1,683

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Anansix

USA . 864 parts In-Stock

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864

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 546 parts In-Stock

1+ parts

$0.972

100+ parts

-

1k+ parts

$0.875

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546

$0.972

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$0.875

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MKK Technologies

India . 446 parts In-Stock

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$1.829

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446

$1.829

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DigiPath Technology Company

USA . 446 parts In-Stock

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$1.829

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446

$1.829

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Corphita

USA . 3,347 parts In-Stock

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3,347

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Parana Technologies

USA . 1,847 parts In-Stock

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$1.163

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1,847

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$1.163

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Overview

Unlock unparalleled efficiency with the STHS2376ADW6E from STMicroelectronics, a leader in advanced power management solutions. This compact and robust IC is designed to optimize performance across industrial applications, delivering exceptional reliability even in extreme temperatures. With ST's commitment to quality and innovation, you gain a trusted partner that not only enhances your designs but also drives cost savings and energy efficiency. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material enhances durability and thermal performance, making this IC suitable for a wide range of applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easy integration into modern PCBs, simplifying the manufacturing process.

Package Shape: RECTANGULAR

The rectangular shape provides efficient space utilization and fits well in various circuit designs, ensuring versatility.

Nominal Supply Voltage (Vsup): 48 V

With a nominal supply voltage of 48 V, this IC is ideal for industrial and telecom applications which typically operate in this range.

Power Supplies (V): 48

Designed to operate efficiently at 48 V, this IC can provide reliable power management for various high-voltage applications.

No. of Terminals: 8

Eight terminals provide sufficient connectivity options for integration into circuit boards, facilitating versatile configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This small outline, thin profile design supports high-density applications, making it perfect for compact electronic devices.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in industrial environments where heat is a concern.

Minimum Operating Temperature: -40 °C

The ability to operate down to -40 °C makes this IC suitable for harsh environments, such as automotive and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances corrosion resistance and solderability, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning ensures better load distribution and enhances connection stability in circuit designs.

Maximum Seated Height: 1.2 mm

A maximum seated height of only 1.2 mm fits well in low-profile assemblies, perfect for space-constrained applications.

Width: 3.1 mm

A compact width of 3.1 mm allows for tight placements on PCBs, making it ideal for modern electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it provides essential functions that enhance the stability and reliability of electronic systems.

Minimum Supply Voltage (Vsup): 0 V

This IC can function down to 0 V, making it versatile for battery-operated devices that require low-voltage operation.

Length: 4.3 mm

The length of 4.3 mm allows for efficient layout configurations on PCBs, optimizing space utilization without compromising performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading indicates long-term stability and reliability in demanding environments, making it suitable for industrial applications.

Maximum Supply Current (Isup): 0.45 mA

A maximum supply current of 0.45 mA indicates low power consumption, which is beneficial for energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals make for worry-free soldering and assembly, improving overall manufacturing yield and quality.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density mounting, suitable for modern electronics that require compact designs.

Maximum Supply Voltage (Vsup): 57 V

With a maximum supply voltage of 57 V, this IC can accommodate a variety of applications with higher voltage requirements.

Adjustable Threshold: YES

The adjustable threshold feature offers flexibility in design configurations, allowing designers to tailor performance to specific applications.

Technical Specifications

Power Management ICs STHS2376ADW6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3.1 mm

Trade Compliance

STHS2376ADW6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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