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STHS2375ADW6E

STMicroelectronics

STHS2375ADW6E by STMicroelectronics

STHS2375ADW6E by STMicroelectronics is a compact power management IC with an operating voltage range of 0-57V and a max current of 0.45mA. It features an industrial temp grade (-40 °C to 85°C) and comes in a thin, rectangular package. Ideal for power supply support applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,542 parts In-Stock

1+ parts

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100+ parts

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4,542

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Vyrian

USA . 2,628 parts In-Stock

1+ parts

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1k+ parts

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2,628

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Anansix

USA . 914 parts In-Stock

1+ parts

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914

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 38 parts In-Stock

1+ parts

$21.504

100+ parts

-

1k+ parts

$19.354

10k+ parts

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38

$21.504

-

$19.354

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MKK Technologies

India . 1,300 parts In-Stock

1+ parts

$40.437

100+ parts

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1,300

$40.437

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DigiPath Technology Company

USA . 1,300 parts In-Stock

1+ parts

$40.437

100+ parts

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1,300

$40.437

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Parana Technologies

USA . 2,165 parts In-Stock

1+ parts

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100+ parts

$25.711

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2,165

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$25.711

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Corphita

USA . 87 parts In-Stock

1+ parts

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87

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Overview

Elevate your design with the STHS2375ADW6E from STMicroelectronics, a trusted leader in power management solutions. This versatile IC delivers reliable performance across a wide temperature range, ensuring your applications run smoothly in any environment. With its compact footprint and advanced features, it optimizes efficiency while reducing space requirements. Experience unmatched quality and support, empowering your projects for success in industrial and commercial applications!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various applications, making it suitable for industrial environments.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient manufacturing processes, reducing space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape provides a standardized footprint, facilitating easy integration into existing designs.

Nominal Supply Voltage (Vsup): 48 V

With a nominal supply voltage of 48 V, this IC is ideal for a wide range of power management applications.

Power Supplies (V): 48

The specification of 48 V power supplies allows for compatibility with common industrial and telecommunication systems.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options, allowing for versatile circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make this component suitable for space-constrained applications without sacrificing performance.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature of 85 °C ensures reliability and stability in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this IC suitable for outdoor and extreme temperature applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and reliable electrical connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible layout options in PCB design, enhancing design adaptability.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm contributes to overall PCB thickness reduction while maintaining performance.

Width: 3.1 mm

With a width of just 3.1 mm, this IC supports compact electronic designs, ideal for portable devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being categorized as a power supply support circuit highlights its integral role in power management solutions.

Minimum Supply Voltage (Vsup): 0 V

A minimum supply voltage of 0 V allows for flexible operation and integration into a range of systems.

Length: 4.3 mm

A length of 4.3 mm contributes to compact sizes, enabling efficient space usage on smaller PCBs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grade, this IC is suitable for harsh environments ensuring consistent performance.

Maximum Supply Current (Isup): 0.45 mA

With a low maximum supply current of 0.45 mA, this IC is energy efficient, minimizing power consumption.

Terminal Form: GULL WING

The gull wing terminal form provides excellent solderability and reliability in connections.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch is compatible with modern PCB designs for high-density layouts.

Maximum Supply Voltage (Vsup): 57 V

Supporting a maximum supply voltage of 57 V enhances its applicability in high-voltage systems.

Adjustable Threshold: YES

The adjustable threshold feature allows customization for specific application requirements, enhancing design flexibility.

Technical Specifications

Power Management ICs STHS2375ADW6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3.1 mm

Trade Compliance

STHS2375ADW6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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