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STHS2376AM6F

STMicroelectronics

STHS2376AM6F by STMicroelectronics

STHS2376AM6F by STMicroelectronics is a versatile power management IC with a nominal voltage of 48V and operates in extreme temperatures from -40 °C to 85°C. It features an adjustable threshold and supports up to 57V, making it ideal for industrial applications. Its compact design (3.8mm x 4.8mm) ensures efficient surface mounting in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,913 parts In-Stock

1+ parts

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4,913

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Vyrian

USA . 4,391 parts In-Stock

1+ parts

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4,391

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Anansix

USA . 2,587 parts In-Stock

1+ parts

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2,587

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,253 parts In-Stock

1+ parts

$17.244

100+ parts

-

1k+ parts

$15.519

10k+ parts

-

2,253

$17.244

-

$15.519

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MKK Technologies

India . 1,303 parts In-Stock

1+ parts

$32.425

100+ parts

-

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1,303

$32.425

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DigiPath Technology Company

USA . 1,303 parts In-Stock

1+ parts

$32.425

100+ parts

-

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10k+ parts

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1,303

$32.425

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Corphita

USA . 4,523 parts In-Stock

1+ parts

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4,523

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Parana Technologies

USA . 1,502 parts In-Stock

1+ parts

-

100+ parts

$20.617

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-

10k+ parts

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1,502

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$20.617

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Overview

Unlock your designs with the STHS2376AM6F from STMicroelectronics, a powerhouse in Power Management ICs celebrated for their reliability and performance. Built to endure industrial environments with an operating temperature range from -40 °C to 85°C, this compact solution ensures efficient power supply support. With its adjustable threshold and robust design, it delivers superior energy management, making it ideal for various applications—from automation to automotive—empowering customers to innovate with confidence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy construction ensures reliable performance and longevity in various applications.

Surface Mount: YES

Surface mount design allows for compact placement on PCBs, saving space and enabling high-density layouts.

Package Shape: RECTANGULAR

Rectangular package shape provides an efficient footprint for optimizing circuit board real estate.

Nominal Supply Voltage (Vsup): 48 V

A nominal supply voltage of 48V makes this IC suitable for a wide range of industrial applications.

Power Supplies (V): 48

Capable of operating at 48V power supplies, this IC is ideal for high-voltage power management.

No. of Terminals: 8

With 8 terminals, it provides multiple connection points for flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances space efficiency and ease of integration into compact devices.

Maximum Operating Temperature: 85 °C

Designed to operate at temperatures up to 85 °C, making it suitable for high-temperature environments.

Minimum Operating Temperature: -40 °C

Extensive temperature range (-40 °C to 85°C) ensures reliability in extreme conditions.

Terminal Position: DUAL

Dual terminal positioning facilitates easier soldering and better performance in crowded designs.

Maximum Seated Height: 1.75 mm

Low seated height allows for more streamlined designs, minimizing obstruction in dense layouts.

Width (mm): 3.8 mm

Compact width of 3.8 mm contributes to a small package overall, ideal for space-constrained applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Focusing on power supply support, this IC is tailored for efficient voltage regulation and management.

Minimum Supply Voltage (Vsup): 0 V

Can operate down to 0V, allowing for versatile applications even in low-power scenarios.

Length: 4.8 mm

Compact length of 4.8 mm enhances the ability to fit within tight spaces on a PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification signifies reliability for demanding applications.

Maximum Supply Current (Isup): 0.45 mA

0.45 mA maximum supply current helps to minimize power consumption, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint integrity and simplify automated assembly processes.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is standard for many applications, easing integration into existing designs.

Maximum Supply Voltage (Vsup): 57 V

Supports a maximum supply voltage of 57V, broadening the range of applications it can address.

Adjustable Threshold: YES

Adjustable thresholds offer flexibility in the operation of power management functions, allowing customization for specific needs.

Technical Specifications

Power Management ICs STHS2376AM6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

Length:

4.8 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.8 mm

Trade Compliance

STHS2376AM6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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