Loading...

STHS2375LDW6F

STMicroelectronics

STHS2375LDW6F by STMicroelectronics

STHS2375LDW6F by STMicroelectronics is a compact power management IC designed for industrial applications, operating b/w -40 °C and 85°C. It supports a nominal voltage of 48V with a max of 57V and features an adjustable threshold. Its small outline package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,950

-

-

-

-

Digiode

USA . 1,773 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,773

-

-

-

-

Anansix

USA . 575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

575

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,603 parts In-Stock

1+ parts

$6.382

100+ parts

-

1k+ parts

$5.744

10k+ parts

-

1,603

$6.382

-

$5.744

-

MKK Technologies

India . 1,763 parts In-Stock

1+ parts

$12.001

100+ parts

-

1k+ parts

-

10k+ parts

-

1,763

$12.001

-

-

-

DigiPath Technology Company

USA . 1,763 parts In-Stock

1+ parts

$12.001

100+ parts

-

1k+ parts

-

10k+ parts

-

1,763

$12.001

-

-

-

Parana Technologies

USA . 768 parts In-Stock

1+ parts

-

100+ parts

$7.631

1k+ parts

-

10k+ parts

-

768

-

$7.631

-

-

Corphita

USA . 617 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

617

-

-

-

-

Overview

Unlock superior power management with the STHS2375LDW6F from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability and efficiency, this compact IC ensures optimal performance across various applications, from industrial automation to consumer electronics. With a wide operating temperature range and robust construction, it delivers consistent power support while saving energy. Experience the perfect blend of quality and value, empowering your designs with unmatched precision and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent durability and resistance to environmental factors, ensuring reliable performance.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, making it suitable for modern electronics.

Package Shape: RECTANGULAR

The rectangular shape is efficient for space utilization in PCB layouts, enabling better design flexibility.

Nominal Supply Voltage (Vsup): 48 V

A nominal supply voltage of 48 V is ideal for industrial and telecommunications applications, ensuring efficient power delivery.

Power Supplies (V): 48

Supports power supplies at 48 V, providing consistent performance for high-voltage applications.

No. of Terminals: 8

Eight terminals facilitate versatile connectivity and functionality, enhancing circuit integration capabilities.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it suitable for space-constrained applications and contribute to reduced overall system size.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in demanding environments and enhances the IC's durability.

Minimum Operating Temperature: -40 °C

Operational capabilities in low temperatures make it suitable for industrial applications in varied climates.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures superior solderability and long-term reliability, reducing the probability of connection failure.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options, enhancing design adaptability.

Maximum Seated Height: 1.2 mm

A low maximum seated height contributes to space-saving designs while maintaining performance standards.

Width: 3.1 mm

Compact width is ideal for high-density PCB layouts, ensuring better design efficiency.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specifically designed for power supply support, increasing the IC's versatility across numerous applications.

Minimum Supply Voltage (Vsup): 0 V

The capability to operate down to 0 V provides design flexibility and allows for easier integration into various power management systems.

Length: 4.3 mm

Short length ensures compatibility with compact circuit board designs for more streamlined electronics.

Temperature Grade: INDUSTRIAL

Industrial temperature grade assures reliability and performance in challenging conditions, making it trusted for long-term applications.

Maximum Supply Current (Isup): 0.45 mA

Low supply current maximizes efficiency, contributing to lower power consumption in applications.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and are compatible with automated electronics assembly processes.

Terminal Pitch: 0.65 mm

Tight terminal pitch allows for increased component density on PCBs, optimizing space and performance.

Maximum Supply Voltage (Vsup): 57 V

An extensive maximum supply voltage range supports a wide array of applications, from consumer electronics to industrial systems.

Adjustable Threshold: YES

Adjustable threshold feature enables customization for specific application requirements, allowing for greater design control.

Technical Specifications

Power Management ICs STHS2375LDW6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3.1 mm

Trade Compliance

STHS2375LDW6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19