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STHS2376LDW6F

STMicroelectronics

STHS2376LDW6F by STMicroelectronics

STHS2376LDW6F by STMicroelectronics is a compact power management IC with an operating voltage range of 0-57V and a max current of 0.45mA. It features an industrial temp grade (-40 °C to 85°C) and comes in a thin, rectangular package. Ideal for power supply support applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,820 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,820

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Vyrian

USA . 2,205 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,205

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Anansix

USA . 2,062 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,062

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,352 parts In-Stock

1+ parts

$12.252

100+ parts

-

1k+ parts

$11.026

10k+ parts

-

1,352

$12.252

-

$11.026

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MKK Technologies

India . 2,069 parts In-Stock

1+ parts

$23.038

100+ parts

-

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10k+ parts

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2,069

$23.038

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DigiPath Technology Company

USA . 2,069 parts In-Stock

1+ parts

$23.038

100+ parts

-

1k+ parts

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10k+ parts

-

2,069

$23.038

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-

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Parana Technologies

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$14.649

1k+ parts

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10k+ parts

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2,000

-

$14.649

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Corphita

USA . 536 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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536

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Overview

Elevate your projects with the STHS2376LDW6F from STMicroelectronics, a trusted leader in power management solutions. Designed for maximum reliability and efficiency, this compact IC excels in demanding environments with a wide operating temperature range. Its robust construction ensures longevity, making it ideal for industrial applications. Experience unparalleled performance and peace of mind, knowing you’re backed by a pioneer in innovation and quality. Optimize your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and resistance to environmental factors, making the IC suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact circuit designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes PCB space and allows for efficient layout and design flexibility.

Nominal Supply Voltage (Vsup): 48 V

Operating at a nominal supply voltage of 48 V, this IC is ideal for standard industrial applications.

Power Supplies (V): 48

Designed for a consistent power supply of 48 V, ensuring reliability in performance.

No. of Terminals: 8

With 8 terminals, it provides sufficient connectivity options for versatile circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile enhances space efficiency and allows for high-density designs.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, it is suitable for high-temperature environments, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 °C to 85°C) makes this IC suitable for harsh conditions and industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish offers excellent conductivity and enhanced reliability over time.

Terminal Position: DUAL

The dual terminal position allows for flexible layout options and facilitates easier connections.

Maximum Seated Height: 1.2 mm

The low seated height is ideal for designs that require slim profiles, enhancing product miniaturization.

Width (mm): 3.1 mm

A compact width of 3.1 mm makes it suitable for constrained spaces while maintaining performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it ensures efficient power management for various applications.

Minimum Supply Voltage (Vsup): 0 V

The ability to operate from 0 V allows for versatility in power management, accommodating multiple operational states.

Length: 4.3 mm

Short length promotes compact designs, making it optimal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures the IC can withstand demanding conditions, increasing its reliability.

Maximum Supply Current (Isup): 0.45 mA

Low maximum supply current enhances energy efficiency, making it suitable for power-sensitive applications.

Terminal Form: GULL WING

Gull wing terminals facilitate efficient soldering and minimize mechanical stress during installation.

Terminal Pitch: 0.65 mm

A tight terminal pitch allows for compact PCB designs while ensuring solid electrical connections.

Maximum Supply Voltage (Vsup): 57 V

Supporting a maximum supply voltage of 57 V enhances its capability to handle diverse power management scenarios.

Adjustable Threshold: YES

The adjustable threshold feature provides flexibility in design, allowing users to customize performance for specific applications.

Technical Specifications

Power Management ICs STHS2376LDW6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3.1 mm

Trade Compliance

STHS2376LDW6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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