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STHS2377ADW6F

STMicroelectronics

STHS2377ADW6F by STMicroelectronics

STHS2377ADW6F by STMicroelectronics is a compact power management IC designed for industrial applications, operating b/w -40 °C to 85°C. It supports a nominal voltage of 48V and features an adjustable threshold. With its small outline and dual terminal design, it ensures efficient space utilization in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,719 parts In-Stock

1+ parts

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4,719

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Anansix

USA . 2,562 parts In-Stock

1+ parts

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1k+ parts

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2,562

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Digiode

USA . 1,202 parts In-Stock

1+ parts

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1,202

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,943 parts In-Stock

1+ parts

$11.268

100+ parts

-

1k+ parts

$10.141

10k+ parts

-

1,943

$11.268

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$10.141

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MKK Technologies

India . 1,698 parts In-Stock

1+ parts

$21.189

100+ parts

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1,698

$21.189

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DigiPath Technology Company

USA . 1,698 parts In-Stock

1+ parts

$21.189

100+ parts

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10k+ parts

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1,698

$21.189

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Corphita

USA . 1,946 parts In-Stock

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1,946

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Parana Technologies

USA . 633 parts In-Stock

1+ parts

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100+ parts

$13.473

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633

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$13.473

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Overview

Unlock unparalleled performance with the STHS2377ADW6F from STMicroelectronics, a leader in innovative power management solutions. Designed for demanding applications, this compact IC ensures robust efficiency and reliability across various industrial settings, operating flawlessly in extreme temperatures. With superior build quality and exceptional voltage capabilities, it empowers your designs while maximizing energy savings, making it the ideal choice for forward-thinking engineers. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures excellent durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount allows for compact designs and efficient use of board space, facilitating easier integration into modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape provides optimal space utilization on PCB layouts, making it ideal for high-density designs.

Nominal Supply Voltage (Vsup): 48 V

A nominal supply voltage of 48 V is suitable for a wide range of power management applications, ensuring compatibility with standard power systems.

Power Supplies (V): 48

Designed for a specific power supply voltage, enhancing reliability and performance in applications that require consistent power delivery.

No. of Terminals: 8

With 8 terminals, the IC offers sufficient connectivity options for various applications while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style is designed for space-saving while ensuring ease of handling in manufacturing and assembly processes.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the IC can perform reliably in demanding environments, ideal for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this product suitable for a broad range of applications, including those in cold climates.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures excellent conductivity and corrosion resistance, contributing to the longevity of the component.

Terminal Position: DUAL

Dual terminal positioning allows for flexible mounting options and improved thermal performance on the PCB.

Maximum Seated Height: 1.2 mm

A low seated height enhances the overall profile of the PCB design, making it suitable for space-constrained applications.

Width: 3.1 mm

The narrow width helps in fitting the IC into compact devices, making it beneficial for modern electronics where space is limited.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit means it is specifically designed to manage and stabilize power delivery, enhancing system reliability.

Minimum Supply Voltage (Vsup): 0 V

The ability to handle a minimum supply voltage of 0 V makes this product versatile and helpful in various design scenarios including startup conditions.

Length: 4.3 mm

The compact length contributes to a small overall footprint, making it easier to integrate into modern compact designs.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grades, this IC can operate reliably in harsh conditions, ideal for industrial and outdoor applications.

Maximum Supply Current (Isup): 0.45 mA

A low maximum supply current of 0.45 mA indicates efficient power usage, making it suitable for battery-powered or low-power applications.

Terminal Form: GULL WING

Gull wing terminal forms provide excellent solder joint strength and are easy to solder, ensuring robust connections on the PCB.

Terminal Pitch: 0.65 mm

With a fine terminal pitch of 0.65 mm, the IC is conducive to high-density layouts, meeting the demands of modern electronics.

Maximum Supply Voltage (Vsup): 57 V

A maximum supply voltage of 57 V offers flexibility for applications requiring elevated voltage, expanding its use-case scenarios.

Adjustable Threshold: YES

The adjustable threshold feature allows customization for specific application needs, enhancing versatility and performance adaptability.

Technical Specifications

Power Management ICs STHS2377ADW6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3.1 mm

Trade Compliance

STHS2377ADW6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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