Loading...

STHS2375LM6E

STMicroelectronics

STHS2375LM6E by STMicroelectronics

STHS2375LM6E by STMicroelectronics is a versatile power management IC with a nominal voltage of 48V and operates in industrial temperatures from -40 °C to 85°C. It features an adjustable threshold and supports up to 57V, making it ideal for various power supply applications. Its compact 8-terminal design ensures efficient surface mounting in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,158 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,158

-

-

-

-

Anansix

USA . 1,449 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,449

-

-

-

-

Digiode

USA . 769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

769

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 378 parts In-Stock

1+ parts

$1.460

100+ parts

-

1k+ parts

$1.314

10k+ parts

-

378

$1.460

-

$1.314

-

MKK Technologies

India . 1,944 parts In-Stock

1+ parts

$2.746

100+ parts

-

1k+ parts

-

10k+ parts

-

1,944

$2.746

-

-

-

DigiPath Technology Company

USA . 1,944 parts In-Stock

1+ parts

$2.746

100+ parts

-

1k+ parts

-

10k+ parts

-

1,944

$2.746

-

-

-

Parana Technologies

USA . 2,090 parts In-Stock

1+ parts

-

100+ parts

$1.746

1k+ parts

-

10k+ parts

-

2,090

-

$1.746

-

-

Corphita

USA . 2,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,045

-

-

-

-

Overview

Elevate your power management solutions with the STHS2375LM6E from STMicroelectronics, a leader in innovative semiconductor technology. Designed for industrial applications, this high-quality IC ensures reliable performance across a wide temperature range, making it perfect for demanding environments. With its compact design and efficiency, it enhances system reliability while reducing energy consumption, empowering your projects with unmatched value and dependability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making this IC reliable for industrial applications.

Surface Mount: YES

Being surface mount allows for easier and more compact PCB designs, facilitating high-density applications.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for space efficiency, enabling effective integration into diverse circuit designs.

Nominal Supply Voltage (Vsup): 48 V

The nominal supply voltage of 48 V is ideal for systems requiring moderate power, ensuring compatibility with standard power supply configurations.

Power Supplies (V): 48

This power rating indicates suitability for various industrial equipment, promoting versatility in application.

No. of Terminals: 8

With 8 terminals, this IC offers a good balance between function and complexity, providing essential connectivity without overcrowding.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes space used on the PCB, facilitating compact designs for modern electronics.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in challenging environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Operating temperatures down to -40 °C expand the application range, making this IC suitable for extreme environmental conditions.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options, enhancing design versatility.

Maximum Seated Height: 1.75 mm

A low seated height of 1.75 mm enables integration in slim designs, supporting modern miniaturization trends.

Width: 3.8 mm

The compact width of 3.8 mm is conducive to high-density layouts, making it suitable for space-sensitive applications.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This classification indicates its primary function to manage power efficiently, essential for maintaining optimal operation in electronic devices.

Minimum Supply Voltage (Vsup): 0 V

A minimum supply voltage of 0 V allows for compatibility with a wide range of power sources, enhancing flexibility during design.

Length: 4.8 mm

The length of 4.8 mm contributes to the compact nature of the module, supporting dense PCB layouts.

Temperature Grade: INDUSTRIAL

Graded for industrial use, this IC is designed to withstand harsher conditions, ensuring longevity and reliability.

Maximum Supply Current (Isup): 0.45 mA

A maximum supply current of 0.45 mA indicates low power consumption, which is critical for energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability, enhancing reliability during operation.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between ease of soldering and compact design, suitable for diverse applications.

Maximum Supply Voltage (Vsup): 57 V

Supporting a maximum supply voltage of 57 V, this IC accommodates a wide range of high-voltage applications.

Adjustable Threshold: YES

The adjustable threshold feature allows customization of the circuit according to specific application requirements, enhancing flexibility.

Technical Specifications

Power Management ICs STHS2375LM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

Length:

4.8 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.8 mm

Trade Compliance

STHS2375LM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20