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STHS2375ADW6F

STMicroelectronics

STHS2375ADW6F by STMicroelectronics

STHS2375ADW6F by STMicroelectronics is a power management IC with a nominal voltage of 48V and operates in extreme temperatures from -40 °C to 85°C. It features an 8-terminal gull-wing design and supports adjustable thresholds. Ideal for industrial applications, it ensures reliable performance in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,826 parts In-Stock

1+ parts

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1,826

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Digiode

USA . 1,472 parts In-Stock

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1,472

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Anansix

USA . 250 parts In-Stock

1+ parts

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250

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,232 parts In-Stock

1+ parts

$19.844

100+ parts

-

1k+ parts

$17.860

10k+ parts

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2,232

$19.844

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$17.860

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MKK Technologies

India . 273 parts In-Stock

1+ parts

$37.316

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273

$37.316

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DigiPath Technology Company

USA . 273 parts In-Stock

1+ parts

$37.316

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273

$37.316

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Corphita

USA . 3,999 parts In-Stock

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3,999

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Parana Technologies

USA . 413 parts In-Stock

1+ parts

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$23.727

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413

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$23.727

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Overview

Unlock the power of efficiency with the STHS2375ADW6F from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This compact Power Management IC is designed for reliability across industrial applications, delivering exceptional performance even in extreme environments. With its sleek design and robust temperature range, it ensures optimal energy management while maximizing your system's longevity and reliability. Experience unmatched quality and innovation that translates into real-world benefits for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability, making this IC suitable for various applications.

Surface Mount: YES

Surface mount technology allows for streamlined assembly and reduced board space, enhancing design flexibility.

Package Shape: RECTANGULAR

The rectangular shape is optimized for space efficiency on printed circuit boards (PCBs).

Nominal Supply Voltage (Vsup): 48 V

A nominal supply voltage of 48V supports a wide range of power management applications, ensuring compatibility with standard systems.

Power Supplies (V): 48

Supports a stable 48V supply, commonly used in industrial and telecommunications applications.

No. of Terminals: 8

Eight terminals provide multiple connectivity options, enhancing circuit design flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact package style contributes to space-saving designs, ideal for high-density applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this IC is suitable for industrial environments where heat management is crucial.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliability in extreme conditions, making it suitable for outdoor and harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish provides excellent corrosion resistance and reliable connections over time.

Terminal Position: DUAL

Dual terminal positioning offers enhanced design flexibility, allowing for various configuration options.

Maximum Seated Height: 1.2 mm

A low maximum seated height allows for slim circuit designs, making it beneficial for space-constrained applications.

Width: 3.1 mm

Compact width helps to optimize PCB real estate, allowing for more efficient layouts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it enables stable and reliable power management across various systems.

Minimum Supply Voltage (Vsup): 0 V

Capability to operate from a minimum supply voltage of 0V provides design flexibility in low-power applications.

Length: 4.3 mm

The compact length aids in fitting within tight design spaces while still supporting robust performance.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures the IC can withstand the rigors of demanding applications and environments.

Maximum Supply Current (Isup): 0.45 mA

A maximum supply current of 0.45 mA is energy-efficient, reducing power consumption in low-power applications.

Terminal Form: GULL WING

Gull wing leads facilitate easier mounting and soldering processes, enhancing manufacturing efficiency.

Terminal Pitch: 0.65 mm

A pin pitch of 0.65 mm allows for tighter component arrangements, supporting high-density PCB designs.

Maximum Supply Voltage (Vsup): 57 V

The ability to handle a maximum supply voltage of 57V provides flexibility for various applications requiring higher voltage operation.

Adjustable Threshold: YES

Adjustable threshold capabilities allow for fine-tuning in specific applications, enhancing overall versatility.

Technical Specifications

Power Management ICs STHS2375ADW6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3.1 mm

Trade Compliance

STHS2375ADW6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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