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STHS2375LDW6E

STMicroelectronics

STHS2375LDW6E by STMicroelectronics

STHS2375LDW6E by STMicroelectronics is a compact power management IC with a 48V nominal voltage, operating b/w -40 °C to 85°C. It features an 8-terminal gull-wing design and supports adjustable thresholds. Ideal for industrial applications requiring reliable power supply support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,593 parts In-Stock

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4,593

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Anansix

USA . 2,403 parts In-Stock

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2,403

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Vyrian

USA . 508 parts In-Stock

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508

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,181 parts In-Stock

1+ parts

$19.673

100+ parts

-

1k+ parts

$17.706

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1,181

$19.673

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$17.706

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MKK Technologies

India . 521 parts In-Stock

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$36.994

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521

$36.994

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DigiPath Technology Company

USA . 521 parts In-Stock

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$36.994

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521

$36.994

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Corphita

USA . 3,238 parts In-Stock

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Parana Technologies

USA . 762 parts In-Stock

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$23.522

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762

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$23.522

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Overview

Unlock unparalleled power management with the STHS2375LDW6E from STMicroelectronics, a leader in innovation and quality. This compact, robust IC ensures optimal performance across diverse applications, from industrial automation to telecommunications. With its wide operating temperature range and high voltage capability, it delivers reliability you can trust. Choose STMicroelectronics for cutting-edge solutions that enhance efficiency and empower your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protects the internal components from environmental factors.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern electronic circuits.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on the PCB, making it convenient for layout and design.

Nominal Supply Voltage (Vsup): 48 V

A nominal supply voltage of 48V is ideal for a wide range of power applications, particularly in industrial settings.

Power Supplies (V): 48

Compatible with 48V power supplies, ensuring flexibility for various power management needs.

No. of Terminals: 8

Eight terminals facilitate multiple connections, enhancing circuit functionality and versatility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style contributes to a low-profile solution, which saves space in compact designs.

Maximum Operating Temperature: 85 °C

An extended maximum operating temperature allows the IC to perform reliably in high-temperature environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures reliability in extreme cold conditions, making it suitable for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish provides excellent electrical conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positions facilitate flexible mounting options, improving the adaptability of the IC in various designs.

Maximum Seated Height: 1.2 mm

A low seated height is beneficial for space-constrained applications, allowing for denser PCB layouts.

Width (mm): 3.1 mm

At 3.1 mm wide, this IC is suitable for compact designs, aiding in miniaturization efforts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit provides essential capabilities for voltage regulation and management in power applications.

Minimum Supply Voltage (Vsup): 0 V

The ability to operate from 0V allows for versatility in applications that may have varying voltage levels.

Length: 4.3 mm

A compact length of 4.3 mm enhances design flexibility and helps to minimize PCB footprint.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures robustness and reliability in demanding and varied environments.

Maximum Supply Current (Isup): 0.45 mA

A low maximum supply current ensures that the device is energy-efficient, which is critical for battery-powered or low-power applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability, facilitating ease of manufacturing and assembly.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm enables high-density component placement, contributing to smaller and more efficient designs.

Maximum Supply Voltage (Vsup): 57 V

The ability to handle up to 57V allows for compatibility with a range of power supply voltages, providing flexibility in application.

Adjustable Threshold: YES

An adjustable threshold offers fine-tuning capabilities for specific applications, enhancing its versatility and performance.

Technical Specifications

Power Management ICs STHS2375LDW6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

48

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.45 mA

Maximum Supply Voltage (Vsup):

57 V

Minimum Supply Voltage (Vsup):

0 V

Nominal Supply Voltage (Vsup):

48 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

3.1 mm

Trade Compliance

STHS2375LDW6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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