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STGWF30NC60S

STMicroelectronics

STGWF30NC60S by STMicroelectronics

STGWF30NC60S by STMicroelectronics is an N-channel IGBT ideal for power control applications. It features a max VCEsat of 1.9V, supports up to 35A collector current, and operates at temperatures from -55 °C to 150°C. Its robust design ensures efficient performance in demanding environments.

Median Price

$5.050

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 492 parts In-Stock

1+ parts

$5.050

100+ parts

$2.200

1k+ parts

$2.090

10k+ parts

-

492

$5.050

$2.200

$2.090

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,334 parts In-Stock

1+ parts

$4.028

100+ parts

-

1k+ parts

-

10k+ parts

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4,334

$4.028

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-

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Vyrian

USA . 5,201 parts In-Stock

1+ parts

-

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5,201

-

-

-

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Anansix

USA . 1,690 parts In-Stock

1+ parts

-

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1,690

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-

-

-

Bristol Electronics

USA . 410 parts In-Stock

1+ parts

-

100+ parts

$1.647

1k+ parts

$1.447

10k+ parts

-

410

-

$1.647

$1.447

-

Dan-Mar Components

USA . 410 parts In-Stock

1+ parts

-

100+ parts

-

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410

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,744 parts In-Stock

1+ parts

$0.660

100+ parts

-

1k+ parts

$0.594

10k+ parts

-

1,744

$0.660

-

$0.594

-

MKK Technologies

India . 1,037 parts In-Stock

1+ parts

$1.240

100+ parts

-

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1,037

$1.240

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DigiPath Technology Company

USA . 1,037 parts In-Stock

1+ parts

$1.240

100+ parts

-

1k+ parts

-

10k+ parts

-

1,037

$1.240

-

-

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Corphita

USA . 3,226 parts In-Stock

1+ parts

$3.816

100+ parts

-

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3,226

$3.816

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Ampacity Inc.

Singapore . 411 parts In-Stock

1+ parts

$7.840

100+ parts

-

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411

$7.840

-

-

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Microchip USA

USA . 5,832 parts In-Stock

1+ parts

$18.116

100+ parts

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5,832

$18.116

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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A-Z Elektronik GmbH

Germany . 6,914 parts In-Stock

1+ parts

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6,914

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Perfect Parts

USA . 1,202 parts In-Stock

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1,202

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Parana Technologies

USA . 934 parts In-Stock

1+ parts

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100+ parts

$0.789

1k+ parts

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934

-

$0.789

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Kepictronics

USA . 500 parts In-Stock

1+ parts

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500

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Overview

Elevate your power control solutions with the STGWF30NC60S from STMicroelectronics, a trusted leader in semiconductor innovation. This N-channel IGBT combines exceptional reliability and efficiency, making it ideal for diverse applications from industrial drives to renewable energy systems. With superior thermal performance and robust construction, it ensures optimal operation even under extreme conditions. Choose STMicroelectronics for unparalleled quality and support!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good insulation and durability, making the product suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel configurations generally offer better performance and efficiency in power applications, making this IGBT a reliable choice.

Configuration: SINGLE

A single configuration allows for easier integration into circuits, making it a versatile option for power control applications.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT can handle high voltage and current, ensuring performance in demanding applications.

Maximum VCEsat: 1.9 V

A low VCEsat indicates low conduction losses, improving efficiency in power conversion systems.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCB layouts, aiding in more compact design solutions.

Terminal Form: THROUGH-HOLE

Through-hole connections provide robust mechanical support and ensure reliable electrical contacts in a variety of environments.

Nominal Turn Off Time (toff): 555 ns

A relatively short turn-off time enhances the overall switch performance, contributing to faster operation in switching applications.

No. of Terminals: 3

The three-terminal design simplifies the layout and connectivity in circuit applications, ensuring ease of use.

Maximum Power Dissipation (Abs): 79 W

With high power dissipation capability, this IGBT can handle demanding loads without overheating, improving reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount design facilitates easy thermal management, enhancing the device's cooling capabilities during operation.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows this IGBT to perform in extreme conditions, increasing its applicability in tough environments.

Maximum Collector-Emitter Voltage: 600 V

Able to accommodate up to 600 V, this IGBT is suitable for high-voltage applications, ensuring safety and performance.

Transistor Element Material: SILICON

Using silicon as the base material guarantees consistent reliability and performance in high-power applications.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V offers flexibility in driving requirements, ensuring compatibility with various control circuits.

Minimum Operating Temperature: -55 °C

The capability to operate at low temperatures makes this IGBT suitable for extreme environmental conditions and outdoor applications.

Maximum Collector Current (IC): 35 A

With a maximum collector current of 35 A, this IGBT is robust enough to handle substantial loads in power applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A manageable threshold voltage enhances switching control and efficiency, ensuring excellent performance in power applications.

Terminal Finish: MATTE TIN

The matte tin finish improves solderability and resistance to corrosion, ensuring longevity in various circuit environments.

Terminal Position: SINGLE

A single terminal position simplifies the design and integration into circuits, making installation easier.

Case Connection: ISOLATED

Isolated case connections prevent unwanted electrical interaction, ensuring enhanced performance and reliability.

Nominal Turn On Time (ton): 30 ns

A very short turn-on time increases switching speed, making this IGBT suitable for high-frequency applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWF30NC60S attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

555 ns

Nominal Turn On Time (ton):

30 ns

Maximum VCEsat:

1.9 V

Trade Compliance

STGWF30NC60S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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