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STGWA75M65DF2

STMicroelectronics

STGWA75M65DF2 by STMicroelectronics

STGWA75M65DF2 from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control. It features a max VCEsat of 2.1V, supports up to 120A collector current, and operates in temperatures from -55 °C to 175 °C. Ideal for high-performance applications requiring robust thermal management.

Median Price

$5.832

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 600 parts In-Stock

1+ parts

$8.600

100+ parts

$4.330

1k+ parts

$3.860

10k+ parts

-

600

$8.600

$4.330

$3.860

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Avnet

USA . 1,620 parts In-Stock

1+ parts

-

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1,620

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Arrow

USA . 600 parts In-Stock

1+ parts

-

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$3.064

10k+ parts

$3.026

600

-

-

$3.064

$3.026

EBV Elektronik

Germany . 300 parts In-Stock

1+ parts

-

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300

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Distributors (In-Stock)

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TME

Poland . 141 parts In-Stock

1+ parts

$6.570

100+ parts

$4.690

1k+ parts

-

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141

$6.570

$4.690

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Digiode

USA . 2,042 parts In-Stock

1+ parts

$6.584

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-

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2,042

$6.584

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Vyrian

USA . 8,426 parts In-Stock

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8,426

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Cyclops Electronics Ltd

UK . 480 parts In-Stock

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480

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Anansix

USA . 105 parts In-Stock

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105

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,117 parts In-Stock

1+ parts

$0.623

100+ parts

-

1k+ parts

$0.561

10k+ parts

-

2,117

$0.623

-

$0.561

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MKK Technologies

India . 862 parts In-Stock

1+ parts

$1.171

100+ parts

-

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862

$1.171

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DigiPath Technology Company

USA . 862 parts In-Stock

1+ parts

$1.171

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-

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862

$1.171

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Corphita

USA . 3,497 parts In-Stock

1+ parts

$6.237

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3,497

$6.237

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QUARKTWIN TECHNOLOGY LTD

USA . 8,180 parts In-Stock

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8,180

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Microchip USA

USA . 6,030 parts In-Stock

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6,030

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Authorized Procurement Solutions

USA . 1,599 parts In-Stock

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1,599

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Epart123

USA . 510 parts In-Stock

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$8.750

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510

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$8.750

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GreenTree Electronics

Israel . 480 parts In-Stock

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480

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Eastek

USA . 330 parts In-Stock

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330

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Perfect Parts

USA . 269 parts In-Stock

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269

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Parana Technologies

USA . 105 parts In-Stock

1+ parts

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$0.745

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105

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$0.745

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Overview

Unlock superior power management with the STGWA75M65DF2 IGBT from STMicroelectronics, a leader in semiconductor innovation. Designed for efficiency and reliability, this N-channel transistor excels in power control applications, ensuring robust performance even in extreme temperatures. Its built-in diode enhances versatility while minimizing losses, making it perfect for industries like renewable energy, automotive, and industrial automation. Experience unparalleled quality and value with STMicroelectronics’ commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and ensures protection against environmental factors, making it suitable for various industrial applications.

Polarity or Channel Type: N-CHANNEL

N-channel devices generally offer higher efficiency and lower conduction losses, which makes this IGBT ideal for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode allows for easier integration in power control circuits, improving overall efficiency and reliability.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT excels in regulating power flows in various electronic systems.

Maximum VCEsat: 2.1 V

A low collector-emitter saturation voltage of 2.1 V minimizes power loss and enhances efficiency in power conversion systems.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on circuit boards, facilitating easier assembly and integration.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides robust mechanical support, ensuring reliable electrical connections, especially in high-power applications.

Nominal Turn Off Time (toff): 292 ns

Fast turn-off time allows for rapid switching, improving overall performance in high-frequency applications.

No. of Terminals: 3

With three terminals, it simplifies the circuit design and enables easy connections in various configurations.

Maximum Power Dissipation (Abs): 468 W

High power dissipation capability translates to better performance in demanding applications, ensuring that the device can handle significant loads.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides additional stability and thermal dissipation, making it suitable for heavy-duty applications.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature rating enhances reliability and adaptability in extreme environments.

Maximum Collector-Emitter Voltage: 650 V

A high collector-emitter voltage rating makes this IGBT suitable for use in high-voltage applications, ensuring versatility in design.

Transistor Element Material: SILICON

Silicon as the element material ensures a good balance of performance and cost, being widely used in power electronics.

Maximum Gate-Emitter Voltage: 20 V

A high gate-emitter voltage capability allows for better driving options, making it suitable for various control schemes.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature expands application range, enabling use in harsh and challenging environments.

Maximum Collector Current (IC): 120 A

Ability to handle high collector current ensures reliability in power applications demanding high current throughput.

Maximum Gate-Emitter Threshold Voltage: 7 V

A moderate gate-emitter threshold voltage ensures compatibility with a variety of gate drive circuits, enhancing overall design flexibility.

Terminal Position: SINGLE

Single terminal position simplifies circuit layout and enhances design efficiency.

Nominal Turn On Time (ton): 73 ns

Fast turn-on time aids in high-frequency switching applications, contributing to greater overall system responsiveness.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGWA75M65DF2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

292 ns

Nominal Turn On Time (ton):

73 ns

Maximum VCEsat:

2.1 V

Trade Compliance

STGWA75M65DF2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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