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STGW80V60F

STMicroelectronics

STGW80V60F by STMicroelectronics

STGW80V60F by STMicroelectronics is an N-CHANNEL IGBT transistor with VCEsat of 2.3V, IC of 120A, and Pmax of 469W. Ideal for power control applications due to its fast turn-off time (262ns) and high collector-emitter voltage (600V). Package style: FLANGE MOUNT.

Median Price

$6.640

Lifecycle Status

EOL

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 337 parts In-Stock

1+ parts

$6.640

100+ parts

$4.510

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$4.510

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$3.230

337

$6.640

$4.510

$4.510

$3.230

DigiKey

USA . 32 parts In-Stock

1+ parts

$6.640

100+ parts

$5.637

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32

$6.640

$5.637

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Distributors (In-Stock)

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Digiode

USA . 2,020 parts In-Stock

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$6.308

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$6.308

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Vyrian

USA . 6,053 parts In-Stock

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6,053

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ACDS - Activité Composants Distribution Service

France . 600 parts In-Stock

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600

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Bristol Electronics

USA . 600 parts In-Stock

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600

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Dan-Mar Components

USA . 600 parts In-Stock

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600

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Anansix

USA . 569 parts In-Stock

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569

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IDEA Electronic Components Group

UK . 2,159 parts In-Stock

1+ parts

$0.966

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-

1k+ parts

$0.869

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2,159

$0.966

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$0.869

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MKK Technologies

India . 244 parts In-Stock

1+ parts

$1.816

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244

$1.816

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DigiPath Technology Company

USA . 244 parts In-Stock

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$1.816

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244

$1.816

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Corphita

USA . 4,545 parts In-Stock

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$5.976

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4,545

$5.976

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QUARKTWIN TECHNOLOGY LTD

USA . 6,236 parts In-Stock

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Microchip USA

USA . 2,858 parts In-Stock

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2,858

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Parana Technologies

USA . 2,204 parts In-Stock

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$1.155

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$1.155

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Overview

Unlock the power of your applications with the STGW80V60F from STMicroelectronics. As a leader in the industry, STMicroelectronics delivers top-quality Insulated Gate Bipolar Transistors like the STGW80V60F that offer exceptional performance and reliability. Ideal for power control applications, this N-CHANNEL transistor provides high efficiency and low VCEsat, ensuring optimal power management. With a maximum operating temperature of 175 °C and a collector-emitter voltage of 600V, this transistor is designed to meet the demands of today's high-power systems. Trust STMicroelectronics to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and faster switching speed, making them efficient for power control applications.

Configuration: SINGLE

Simplifies circuit design and integration, making it easier to use in various power control systems.

Maximum VCEsat: 2.3 V

Low VCEsat minimizes power dissipation and improves efficiency in power control applications.

Package Shape: RECTANGULAR

Allows for easy mounting and integration into circuit boards or heat sinks.

Nominal Turn Off Time (toff): 262 ns

Fast turn-off time helps in reducing switching losses and improving overall performance.

Maximum Power Dissipation (Abs): 469 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating.

Maximum Operating Temperature: 175 °C

Can operate reliably at high temperatures, suitable for demanding industrial applications.

Maximum Collector-Emitter Voltage: 600 V

High voltage rating allows for applications requiring high voltage switching.

Maximum Gate-Emitter Voltage: 20 V

Provides sufficient voltage for proper gate control and switching operations.

Minimum Operating Temperature: -55 °C

Can operate in extremely cold temperatures, suitable for use in diverse environments.

Maximum Collector Current (IC): 120 A

High collector current rating allows for handling large currents in power control circuits.

Maximum Gate-Emitter Threshold Voltage: 7 V

Threshold voltage ensures reliable switching behavior and prevents false triggering.

Nominal Turn On Time (ton): 90 ns

Fast turn-on time helps in achieving quick response times and efficient power switching.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW80V60F attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

262 ns

Nominal Turn On Time (ton):

90 ns

Maximum VCEsat:

2.3 V

Trade Compliance

STGW80V60F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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