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STGW60H60DLFB

STMicroelectronics

STGW60H60DLFB by STMicroelectronics

STGW60H60DLFB by STMicroelectronics is an N-CHANNEL IGBT with 600V VCE, 80A IC, and 375W Pd. It is used for POWER CONTROL applications due to its low VCEsat of 2V and fast turn-on time of 301ns. The device operates in a temperature range from -55 °C to 175°C and comes in a FLANGE MOUNT package style.

Median Price

$5.980

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 20 parts In-Stock

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$5.980

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20

$5.980

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Digiode

USA . 1,238 parts In-Stock

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$5.681

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1,238

$5.681

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Vyrian

USA . 3,057 parts In-Stock

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3,057

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Anansix

USA . 2,809 parts In-Stock

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Cyclops Electronics Ltd

UK . 200 parts In-Stock

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200

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IDEA Electronic Components Group

UK . 228 parts In-Stock

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$1.802

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$1.622

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228

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$1.622

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MKK Technologies

India . 2,184 parts In-Stock

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$3.389

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DigiPath Technology Company

USA . 2,184 parts In-Stock

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$3.389

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$3.389

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Corphita

USA . 3,492 parts In-Stock

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$5.382

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QUARKTWIN TECHNOLOGY LTD

USA . 18,395 parts In-Stock

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18,395

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RC Electronics

USA . 6,687 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Microchip USA

USA . 4,225 parts In-Stock

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Parana Technologies

USA . 1,256 parts In-Stock

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$2.155

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$2.155

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Kepictronics

USA . 600 parts In-Stock

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600

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Overview

Looking for a reliable solution for your power control needs? Look no further than the STGW60H60DLFB by STMicroelectronics. With its high-quality construction and advanced technology, this Insulated Gate Bipolar Transistor (IGBT) offers exceptional performance and durability. Whether you're in the automotive industry or industrial automation, this product's versatility and efficiency make it the perfect choice for a wide range of applications. Experience the value and benefits of this single-channel IGBT with built-in diode, providing you with maximum power dissipation and optimal thermal management. Trust STMicroelectronics to deliver top-notch products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the IGBT lightweight and durable, suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL configuration allows for better efficiency and faster switching times in power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against reverse voltage spikes, improving the reliability of the power control system.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and efficiency.

Maximum VCEsat: 2 V

Low VCEsat value indicates lower power dissipation and higher efficiency in power control operations.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration and mounting in various electronic devices and systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, enhancing the overall reliability of the IGBT.

Maximum Power Dissipation (Abs): 375 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating, making it suitable for high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount package style enables easy installation and heat dissipation, improving overall performance and reliability.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures reliable performance even in harsh environments with elevated temperatures.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating allows the IGBT to handle high voltage levels, making it suitable for a wide range of applications.

Transistor Element Material: SILICON

Silicon material offers high thermal efficiency and stability, ensuring long-term reliability in power control operations.

Maximum Gate-Emitter Voltage: 20 V

The 20 V maximum gate-emitter voltage allows for precise control of the IGBT, ensuring accurate operation in power control applications.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature makes the IGBT suitable for use in cold environments or applications that require wide temperature range operation.

Maximum Collector Current (IC): 80 A

High collector current rating allows the IGBT to handle large currents, making it suitable for high-power applications.

Maximum Gate-Emitter Threshold Voltage: 7 V

The 7 V maximum gate-emitter threshold voltage ensures reliable turn-on and turn-off operation, improving overall efficiency in power control applications.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection, reducing the risk of errors and improving overall reliability.

Nominal Turn On Time (ton): 301 ns

Fast turn-on time of 301 ns allows for quick switching and response in power control applications, improving overall system efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW60H60DLFB attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn On Time (ton):

301 ns

Maximum VCEsat:

2 V

Trade Compliance

STGW60H60DLFB Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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