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STGW35HF60WD

STMicroelectronics

STGW35HF60WD by STMicroelectronics

STGW35HF60WD from STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max collector-emitter voltage of 600 V, 200 W power dissipation, and fast switching times (ton: 45 ns, toff: 295 ns). Ideal for high-temperature environments with a max operating temp of 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,481 parts In-Stock

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7,481

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Digiode

USA . 3,060 parts In-Stock

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3,060

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Anansix

USA . 2,722 parts In-Stock

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2,722

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Goldney Electronics S.L.

Spain . 897 parts In-Stock

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897

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Chip Stock

USA . 273 parts In-Stock

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273

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,552 parts In-Stock

1+ parts

$0.907

100+ parts

-

1k+ parts

$0.816

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1,552

$0.907

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$0.816

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MKK Technologies

India . 173 parts In-Stock

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$1.706

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173

$1.706

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DigiPath Technology Company

USA . 173 parts In-Stock

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$1.706

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173

$1.706

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AZTECH Wire

Italy . 275 parts In-Stock

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$18.300

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275

$18.300

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A-Z Elektronik GmbH

Germany . 8,138 parts In-Stock

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8,138

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 3,567 parts In-Stock

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3,567

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RC Electronics

USA . 2,703 parts In-Stock

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2,703

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Parana Technologies

USA . 1,844 parts In-Stock

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$1.085

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1,844

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$1.085

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Perfect Parts

USA . 1,174 parts In-Stock

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1,174

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Overview

Unlock unparalleled performance with the STGW35HF60WD from STMicroelectronics, a trusted leader in semiconductor innovation. This N-channel IGBT is engineered for efficiency and reliability, making it ideal for power control applications across industries. With its robust design and built-in diode, it ensures optimal thermal management and superior switching capabilities. Experience the perfect blend of quality and value, empowering your projects to deliver exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and resistance to environmental factors, making it suitable for various industrial applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally offer lower on-state resistance, ensuring efficient switching and high performance, particularly in power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the device's ability to handle reverse voltages, providing additional reliability in power control circuits.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT can efficiently manage and switch significant power loads, making it ideal for energy conversion applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier mounting and integration into various systems, optimizing space within electronic designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, ensuring reliability and stability in high-power applications.

Nominal Turn Off Time (toff): 295 ns

A relatively short turn off time enhances switching efficiency, reducing energy losses and allowing faster response in power electronic circuits.

No. of Terminals: 3

Three terminals simplify the design and connection, ensuring flexibility in circuit design while maintaining performance efficiency.

Maximum Power Dissipation (Abs): 200 W

A high power dissipation capacity allows the IGBT to handle significant loads without overheating, enhancing the reliability of power control systems.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides easier thermal management and facilitates secure mounting in industrial applications, ensuring stable operation.

Maximum Operating Temperature: 150 °C

A high operating temperature limit enables the IGBT to perform reliably under demanding thermal conditions, expanding its application range.

Maximum Collector-Emitter Voltage: 600 V

With a maximum voltage rating of 600 V, this IGBT can effectively operate in high-voltage applications, making it versatile for various power systems.

Transistor Element Material: SILICON

Silicon material offers excellent electrical characteristics and thermal stability, ensuring robust performance in diverse environments.

Maximum Gate-Emitter Voltage: 20 V

A maximum gate-emitter voltage of 20 V allows easier interfacing with control circuits, enhancing flexibility in circuit designs.

Maximum Collector Current (IC): 60 A

With a high maximum collector current rating, this IGBT supports substantial power loads, making it suitable for high-performance applications.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A lower threshold voltage ensures the IGBT can be activated effectively with standard control signals, simplifying control circuit design.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and resistance to corrosion, ensuring reliable electrical connections over time.

Terminal Position: SINGLE

Single terminal position design simplifies the circuit layout, allowing for easier integration while minimizing potential errors during assembly.

Nominal Turn On Time (ton): 45 ns

A fast turn on time enhances switching speed, making this IGBT ideal for high-frequency applications and improving overall system efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGW35HF60WD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Additional Features:

LOW CONDUCTION LOSS

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

295 ns

Nominal Turn On Time (ton):

45 ns

Trade Compliance

STGW35HF60WD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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