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STGP20IH65DF

STMicroelectronics

STGP20IH65DF by STMicroelectronics

STGP20IH65DF by STMicroelectronics is an N-channel IGBT designed for power control applications. It features a max VCEsat of 2.05 V, supports up to 650 V collector-emitter voltage, and has a power dissipation of 159 W. Ideal for high-efficiency switching in industrial systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,438 parts In-Stock

1+ parts

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5,438

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Digiode

USA . 4,260 parts In-Stock

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4,260

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Anansix

USA . 1,082 parts In-Stock

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1,082

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,476 parts In-Stock

1+ parts

$0.311

100+ parts

-

1k+ parts

$0.280

10k+ parts

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1,476

$0.311

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$0.280

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MKK Technologies

India . 1,350 parts In-Stock

1+ parts

$0.585

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1,350

$0.585

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DigiPath Technology Company

USA . 1,350 parts In-Stock

1+ parts

$0.585

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1,350

$0.585

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Microchip USA

USA . 488 parts In-Stock

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$7.077

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488

$7.077

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AZTECH Wire

Italy . 623 parts In-Stock

1+ parts

$10.750

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623

$10.750

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Corphita

USA . 4,245 parts In-Stock

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4,245

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Parana Technologies

USA . 1,860 parts In-Stock

1+ parts

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$0.372

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1,860

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$0.372

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Overview

Elevate your power control solutions with the STGP20IH65DF from STMicroelectronics—a leader in innovative semiconductor technology. This N-channel IGBT delivers exceptional performance and reliability, ensuring efficient energy management across various applications, from industrial drives to renewable energy systems. With robust thermal capabilities and built-in diode protection, you get unmatched durability and efficiency, empowering your designs with seamless operation and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and offers good protection against environmental factors, making the IGBT suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel configuration provides better efficiency and performance in power applications, allowing for lower conduction losses.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for faster switching and improved control in applications such as inverters and converters.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is ideal for managing high voltage and current applications.

Maximum VCEsat: 2.05 V

A low VCEsat value indicates efficient operation with reduced heat generation during use, improving overall system efficiency.

Package Shape: RECTANGULAR

The rectangular shape supports optimal layout and space-saving designs in PCB applications.

Terminal Form: THROUGH-HOLE

Through-hole mounting ensures strong mechanical connections, making the IGBT reliable in high-stress environments.

Nominal Turn Off Time (toff): 159 ns

A fast turn-off time allows for quicker switching speeds, enhancing the performance of high-frequency applications.

No. of Terminals: 3

The three-terminal configuration simplifies circuit designs while supporting robust electrical connections.

Maximum Power Dissipation (Abs): 159 W

High power dissipation capability indicates the IGBT can handle significant power levels without overheating, making it suitable for high-performance tasks.

Package Style (Meter): FLANGE MOUNT

Flange mounting options provide ease of installation and robust positioning within a system, contributing to overall reliability.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature allows for versatile applications in demanding thermal environments.

Maximum Collector-Emitter Voltage: 650 V

High voltage capability enables the IGBT to be effectively employed in high-voltage applications such as renewable energy systems.

Transistor Element Material: SILICON

Silicon as the material provides excellent electrical properties and thermal conduction, enhancing overall performance.

Maximum Gate-Emitter Voltage: 20 V

This high gate-emitter voltage threshold ensures compatibility with standard control circuitry for ease of integration.

Minimum Operating Temperature: -55 °C

A wide operational temperature range ensures reliability even in extreme conditions, expanding potential application fields.

Maximum Collector Current (IC): 40 A

Supports high current applications, making this IGBT suitable for demanding power circuits where performance is critical.

Maximum Gate-Emitter Threshold Voltage: 7 V

An optimal threshold voltage allows for efficient gate control, improving switching performance and response time.

Terminal Position: SINGLE

Single terminal positioning aids in straightforward circuit layout while simplifying manufacturing processes.

Case Connection: COLLECTOR

Collector case connection ensures efficient heat dissipation which is crucial for high-performance applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGP20IH65DF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

650 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

159 ns

Maximum VCEsat:

2.05 V

Trade Compliance

STGP20IH65DF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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