Loading...

STGF3HF60HD

STMicroelectronics

STGF3HF60HD by STMicroelectronics

STGF3HF60HD by STMicroelectronics is a powerful N-channel IGBT designed for efficient power control applications. It features a max VCEsat of 2.95V, supports up to 600V collector-emitter voltage, and operates in temperatures from -55 °C to 150 °C. Ideal for high-performance switching tasks, it ensures reliable operation with minimal losses.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,709 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,709

-

-

-

-

Anansix

USA . 2,749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,749

-

-

-

-

Digiode

USA . 1,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,138

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,314 parts In-Stock

1+ parts

$0.959

100+ parts

-

1k+ parts

$0.863

10k+ parts

-

2,314

$0.959

-

$0.863

-

MKK Technologies

India . 498 parts In-Stock

1+ parts

$1.803

100+ parts

-

1k+ parts

-

10k+ parts

-

498

$1.803

-

-

-

DigiPath Technology Company

USA . 498 parts In-Stock

1+ parts

$1.803

100+ parts

-

1k+ parts

-

10k+ parts

-

498

$1.803

-

-

-

AZTECH Wire

Italy . 682 parts In-Stock

1+ parts

$10.880

100+ parts

-

1k+ parts

-

10k+ parts

-

682

$10.880

-

-

-

Corphita

USA . 2,961 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,961

-

-

-

-

Parana Technologies

USA . 1,459 parts In-Stock

1+ parts

-

100+ parts

$1.146

1k+ parts

-

10k+ parts

-

1,459

-

$1.146

-

-

Overview

Elevate your power control solutions with the STGF3HF60HD IGBT from STMicroelectronics. Renowned for excellence, STMicroelectronics delivers superior quality and reliability in every product, assuring you of exceptional performance. This versatile N-Channel IGBT is designed for efficiency and resilience, making it ideal for a range of applications—from renewable energy systems to industrial drives. Trust in STMicroelectronics for innovative technologies that empower your projects while enhancing energy savings and operational effectiveness.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs offer lower on-state voltage and higher efficiency, making them ideal for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

A built-in diode enhances response times and reduces circuit complexity, making it easier to implement in various power control scenarios.

Transistor Application: POWER CONTROL

Designed specifically for power control, this IGBT is suitable for a range of applications including motor drives and inverters.

Maximum VCEsat: 2.95 V

A low VCEsat contributes to high efficiency, minimizing power losses during operation and improving overall circuit performance.

Package Shape: RECTANGULAR

The rectangular package shape can facilitate efficient PCB layout and space management in compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical strength and reliable connections, essential for high-power applications.

Nominal Turn Off Time (toff): 140 ns

A relatively short turn-off time allows for fast switching, making this IGBT suitable for high-frequency applications.

No. of Terminals: 3

Having three terminals simplifies circuit design while allowing for effective control of power delivery.

Maximum Power Dissipation (Abs): 18 W

The capability to dissipate up to 18 watts means this IGBT can handle demanding applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style promotes enhanced heat sinking and thermal management, essential for maintaining performance under load.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures allows for reliable performance in harsh environments, improving system resilience.

Maximum Collector-Emitter Voltage: 600 V

A high collector-emitter voltage rating ensures that this IGBT can be used in applications that require handling high-voltage power.

Transistor Element Material: SILICON

Silicon as the primary material provides good thermal and electrical performance, contributing to overall efficiency.

Maximum Gate-Emitter Voltage: 20 V

This high gate-emitter voltage rating allows for versatility in driving the IGBT, catering to various control circuit designs.

Minimum Operating Temperature: -55 °C

The ability to operate in extremely low temperatures makes this IGBT suitable for applications in cold environments.

Maximum Collector Current (IC): 7.5 A

A maximum collector current of 7.5 A makes this IGBT ideal for medium-power applications, balancing efficiency and performance.

Maximum Gate-Emitter Threshold Voltage: 5.75 V

A moderate gate-emitter threshold voltage ensures consistent switching performance and minimizes unwanted triggering.

Terminal Position: SINGLE

A single terminal position simplifies PCB design and integration into existing circuits.

Case Connection: ISOLATED

Isolation of the case connection enhances safety and reduces the risk of short circuits, improving overall reliability.

Nominal Turn On Time (ton): 15 ns

With a nominal turn on time of just 15 ns, this IGBT enables rapid switching, critical for high-performance applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGF3HF60HD attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

5.75 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

140 ns

Nominal Turn On Time (ton):

15 ns

Maximum VCEsat:

2.95 V

Trade Compliance

STGF3HF60HD Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20