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STGF30H60DF

STMicroelectronics

STGF30H60DF by STMicroelectronics

STGF30H60DF by STMicroelectronics is an N-CHANNEL IGBT with VCEsat of 2.4V, IC of 60A, and Pmax of 37W. Ideal for power control applications due to its fast turn-off time (toff) of 234ns and high collector-emitter voltage rating of 600V. Package style: FLANGE MOUNT, suitable for isolated case connections in various industrial settings.

Median Price

$3.440

Lifecycle Status

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5

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1k+

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DigiKey

USA . 1 parts In-Stock

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$3.440

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Digiode

USA . 1,489 parts In-Stock

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$2.793

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1,489

$2.793

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Vyrian

USA . 2,295 parts In-Stock

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Anansix

USA . 143 parts In-Stock

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ComSIT Distribution GmbH

Germany . 56 parts In-Stock

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IDEA Electronic Components Group

UK . 927 parts In-Stock

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$1.124

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$1.012

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927

$1.124

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$1.012

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MKK Technologies

India . 660 parts In-Stock

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$2.114

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DigiPath Technology Company

USA . 660 parts In-Stock

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$2.114

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$2.191

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$1.994

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$1.797

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Corphita

USA . 2,973 parts In-Stock

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$2.646

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Microchip USA

USA . 500 parts In-Stock

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$18.980

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$18.980

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Component Stockers USA

USA . 378 parts In-Stock

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$99.990

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Perfect Parts

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Parana Technologies

USA . 1,086 parts In-Stock

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$1.344

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Overview

Elevate your power control applications with the STGF30H60DF Insulated Gate Bipolar Transistor by STMicroelectronics. Crafted with precision and quality, this N-CHANNEL transistor offers a seamless experience with its single configuration and built-in diode, allowing for efficient power management. With a maximum collector-emitter voltage of 600V and a maximum gate-emitter voltage of 20V, this transistor ensures reliable performance even in challenging environments. Trust STMicroelectronics to deliver cutting-edge solutions that drive innovation and enhance productivity.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good insulation properties and can withstand high temperatures, making it suitable for power control applications.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs generally have lower conduction losses and higher efficiency compared to P-channel IGBTs, making them a preferred choice for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode helps in reducing switching losses and providing protection against reverse polarity, enhancing the overall performance and reliability of the IGBT.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring optimal performance and efficiency in controlling high power loads.

Maximum VCEsat: 2.4 V

Low VCEsat value indicates lower voltage drop across the collector-emitter junction, resulting in reduced power dissipation and improved efficiency of the IGBT.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and connection in various power control systems, providing flexibility and ease of integration.

Nominal Turn Off Time (toff): 234 ns

Fast turn-off time helps in minimizing switching losses and improving efficiency in power control applications, ensuring precise control of power flow.

No. of Terminals: 3

3 terminals provide the necessary connections for gate, collector, and emitter, allowing for easy control and operation of the IGBT in power control circuits.

Maximum Power Dissipation (Abs): 37 W

High maximum power dissipation capability ensures the IGBT can handle high power loads without overheating or performance degradation, making it suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers secure and stable mounting options for the IGBT, ensuring reliable operation and long-term performance in power control systems.

Maximum Operating Temperature: 175 °C

High maximum operating temperature rating allows the IGBT to operate efficiently in elevated temperature environments, increasing its versatility and reliability in a wide range of applications.

Maximum Collector-Emitter Voltage: 600 V

High maximum collector-emitter voltage rating enables the IGBT to handle high voltage levels, making it suitable for power control applications requiring high voltage output.

Transistor Element Material: SILICON

Silicon material offers excellent thermal stability and electrical conductivity, ensuring reliable performance and durability of the IGBT in power control applications.

Maximum Gate-Emitter Voltage: 20 V

High maximum gate-emitter voltage rating allows for effective gate control and switching operation of the IGBT, ensuring precise power control and performance consistency.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature rating enables the IGBT to operate efficiently in cold environments, providing reliable performance and stability in a wide range of operating conditions.

Maximum Collector Current (IC): 60 A

High maximum collector current rating allows the IGBT to handle high current flows, making it suitable for power control applications with high current requirements.

Maximum Gate-Emitter Threshold Voltage: 7 V

Low gate-emitter threshold voltage ensures efficient gate control and switching operation of the IGBT, improving overall performance and reliability in power control applications.

Terminal Position: SINGLE

Single terminal position simplifies the connection and control of the IGBT in power control circuits, ensuring ease of installation and operation in various applications.

Case Connection: ISOLATED

Isolated case connection provides protection against electrical leakage and improves safety in power control systems, reducing the risk of damage or malfunction due to external factors.

Nominal Turn On Time (ton): 64 ns

Fast turn-on time allows for quick response and precise control of power flow in power control applications, ensuring efficient operation and optimal performance of the IGBT.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) STGF30H60DF attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

234 ns

Nominal Turn On Time (ton):

64 ns

Maximum VCEsat:

2.4 V

Trade Compliance

STGF30H60DF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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