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STG3685BJR

STMicroelectronics

STG3685BJR by STMicroelectronics

STG3685BJR by STMicroelectronics is a CMOS SPDT switch ideal for military applications, featuring a max supply voltage of 4.3V and low on-state resistance of 0.5Ω. It operates in extreme temps from -55 °C to 125 °C with fast switching times (50ns on, 30ns off). Its compact design ensures efficient space utilization in advanced electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,678 parts In-Stock

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4,678

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Vyrian

USA . 203 parts In-Stock

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203

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Anansix

USA . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 968 parts In-Stock

1+ parts

$7.470

100+ parts

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$6.723

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968

$7.470

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$6.723

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MKK Technologies

India . 694 parts In-Stock

1+ parts

$14.048

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694

$14.048

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DigiPath Technology Company

USA . 694 parts In-Stock

1+ parts

$14.048

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694

$14.048

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Corphita

USA . 2,758 parts In-Stock

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Parana Technologies

USA . 1,482 parts In-Stock

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$8.932

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1,482

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$8.932

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Overview

Elevate your design with the STG3685BJR from STMicroelectronics, a trusted pioneer in high-performance semiconductor solutions. This versatile multiplexer excels in demanding applications where reliability and efficiency are paramount, thanks to its robust military-grade specifications. With rapid switching times and a compact profile, it seamlessly integrates into your projects, ensuring optimal performance while saving space. Unlock unparalleled value and elevate your innovation with STMicroelectronics’ quality assurance!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for efficient use of board space and simplifies the manufacturing process.

No. of Functions: 2

Having multiple functions enables versatility and reduces the need for additional components in a circuit.

Package Shape: RECTANGULAR

The rectangular package shape can facilitate denser PCB layouts and better fitting in compact designs.

Nominal Supply Voltage (Vsup): 2.7 V

The nominal supply voltage ensures reliable operation in standard voltage applications.

Power Supplies (V): 1.4/4.3

Wide operating voltage range increases compatibility with various systems and power supplies.

No. of Terminals: 9

A higher number of terminals can provide more connectivity options for robust circuit designs.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style minimizes space while maintaining performance, ideal for high-density applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in demanding environments.

Minimum Operating Temperature: -55 °C

Withstand extremely low temperatures, making it suitable for harsh and military applications.

Terminal Finish: TIN SILVER COPPER

The robust terminal finish enhances solderability and reliability in various environments.

Terminal Position: BOTTOM

Bottom terminal positioning simplifies connections and is ideal for compact layouts.

Output (V): SEPARATE OUTPUT

Separate output allows for independent control of different outputs, enhancing design flexibility.

Maximum Seated Height: 0.8 mm

Low seated height is beneficial for ultra-thin device designs.

Width: 1.47 mm

A narrow width facilitates integration into tight spaces on PCBs.

Other IC type: SPDT

Single Pole Double Throw (SPDT) functionality provides adaptable switching capabilities.

Minimum Supply Voltage (Vsup): 1.4 V

Low minimum supply voltage enhances flexibility for low-power applications.

Maximum On-state Resistance (Ron): 0.5 ohm

Low on-state resistance minimizes power loss and enhances signal integrity.

Maximum Switch-on Time: 50 ns

Fast switch-on time supports high-speed applications and reduces latency.

Length: 1.64 mm

Compact length aligns with modern trends for smaller components and efficient designs.

Maximum Switch-off Time: 30 ns

Rapid switch-off time enables high-frequency operation, benefiting digital communication systems.

Temperature Grade: MILITARY

Designed for military specifications, this component ensures durability and reliability under extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high performance, making it suitable for portable applications.

Terminal Form: BALL

Ball terminal form enhances connection reliability and facilitates surface mounting.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for high-density interconnections, making it suitable for compact designs.

Maximum Supply Voltage (Vsup): 4.3 V

A relatively high maximum supply voltage ensures flexibility in circuit design and power requirements.

Nominal Off-state Isolation: 64 dB

High off-state isolation helps prevent unwanted signal interference, enhancing overall circuit performance.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make switching prevents short circuits and ensures safe operation in complex circuits.

Technical Specifications

Multiplexers & Switches STG3685BJR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Additional Features:

2-CHANNEL MUX/DEMUX

Other IC type:

JESD-30 Code:

R-XBGA-B9

JESD-609 Code:

e1

Length:

1.64 mm

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

9

Nominal Off-state Isolation:

64 dB

Maximum On-state Resistance (Ron):

.5 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA9,3X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

1.4/4.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Maximum Switch-off Time:

30 ns

Maximum Switch-on Time:

50 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width (mm):

1.47 mm

Trade Compliance

STG3685BJR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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