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STG3690QTR

STMicroelectronics

STG3690QTR by STMicroelectronics

STG3690QTR by STMicroelectronics is a compact CMOS SPDT switch with 4 functions, ideal for military applications. It operates b/w 1.65V and 3.6V, featuring a max on-state resistance of 0.5Ω and excellent isolation of 64 dB. Its thin profile and high temp range (-55 °C to 125 °C) enhance versatility in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,727 parts In-Stock

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Digiode

USA . 1,743 parts In-Stock

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Anansix

USA . 81 parts In-Stock

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81

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Microchip USA

USA . 136 parts In-Stock

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$4.969

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136

$4.969

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AZTECH Wire

Italy . 557 parts In-Stock

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$8.850

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557

$8.850

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IDEA Electronic Components Group

UK . 1,692 parts In-Stock

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$9.414

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$8.473

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$9.414

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$8.473

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MKK Technologies

India . 1,929 parts In-Stock

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$17.703

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$17.703

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DigiPath Technology Company

USA . 1,929 parts In-Stock

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$17.703

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$17.703

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Component Stockers USA

USA . 632 parts In-Stock

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$99.990

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A-Z Elektronik GmbH

Germany . 5,160 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Kepictronics

USA . 1,950 parts In-Stock

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Corphita

USA . 775 parts In-Stock

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Parana Technologies

USA . 187 parts In-Stock

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$11.256

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$11.256

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Overview

Unlock unparalleled performance with the STG3690QTR from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile multiplexer/switch enhances circuit design flexibility and efficiency across various applications, including telecommunications and automotive systems. Boasting superior power management and thermal stability, it ensures reliability even in extreme conditions. Elevate your projects with a component engineered for excellence, delivering unmatched quality and value.

Feature Benefit Bullets

Surface Mount: YES

This surface mount capability allows for easy integration into compact PCB designs, making it ideal for space-constrained applications.

No. of Functions: 4

Having 4 functions provides flexibility in circuit design, making this multiplexer suitable for a variety of applications.

Package Shape: SQUARE

The square package shape offers a balanced footprint, enhancing layout and routing capabilities on the circuit board.

Nominal Supply Voltage (Vsup): 3 V

A nominal supply voltage of 3 V is standard for many digital applications, ensuring compatibility with common logic levels.

Power Supplies (V): 1.8/3.3

Supporting both 1.8 V and 3.3 V power supplies allows for versatility in various circuit configurations.

No. of Terminals: 16

With 16 terminals, this product provides ample connectivity options for complex switching needs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This specialized package style enhances thermal management and allows for dense component placement in modern electronics.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliable performance in demanding environments.

Minimum Operating Temperature: -55 °C

This wide temperature range makes the device suitable for extreme conditions, including military and aerospace applications.

Terminal Position: QUAD

The quad terminal position simplifies the layout and allows for efficient routing on the PCB.

Output (V): SEPARATE OUTPUT

Separate outputs make this device suitable for applications requiring independent control of multiple signals.

Maximum Seated Height: 1 mm

A maximum seated height of 1 mm allows for low-profile designs, perfect for portable devices.

Width: 3 mm

The compact width facilitates integration into space-restricted applications, making it an excellent choice for modern devices.

Other IC type: SPDT

The SPDT configuration is advantageous for applications requiring single-pole, double-throw switching, providing flexibility.

Minimum Supply Voltage (Vsup): 1.65 V

This low minimum supply voltage enhances compatibility with a wider range of low-power devices.

Maximum On-state Resistance (Ron): 0.5 ohm

A maximum on-state resistance of 0.5 ohm minimizes power loss during operation, improving overall efficiency.

Length: 3 mm

The compact length is ideal for high-density layouts, contributing to thinner and lighter device designs.

Temperature Grade: MILITARY

Military-grade components are designed for robustness and reliability, suitable for critical applications in harsh conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing performance in dynamic circuits.

Terminal Form: NO LEAD

No-lead terminals reduce the overall footprint and improve soldering reliability, ideal for automated assembly.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density PCB designs, accommodating more connections in less space.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6 V provides flexibility for powering from higher voltage sources when required.

Normal Position (V): NO/NC

The option for normally open/closed positions allows for versatile switching configurations tailored to specific needs.

Nominal Off-state Isolation: 64 dB

High off-state isolation of 64 dB ensures minimal signal interference between channels, improving overall signal integrity.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make switching ensures safe switching behavior, preventing momentary short circuits between outputs.

Nominal On-state Resistance Match: 0.06 ohm

A low nominal on-state resistance match minimizes signal loss and improves the efficiency of signal transmission.

Technical Specifications

Multiplexers & Switches STG3690QTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Normal Position (V):

NO/NC

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

64 dB

Nominal On-state Resistance Match:

.06 ohm

Maximum On-state Resistance (Ron):

.5 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width (mm):

3 mm

Trade Compliance

STG3690QTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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