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STG3693QTR

STMicroelectronics

STG3693QTR by STMicroelectronics

STG3693QTR by STMicroelectronics is a CMOS SPDT switch with a max on-state resistance of 6.5Ω and operates b/w 1.65V to 4.3V. It features a very thin profile, ideal for compact applications, and withstands temperatures from -55 °C to 125°C. With separate outputs and fast switching times (26ns on, 6ns off), it's perfect for military-grade electronics.

Median Price

$1.242

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 31 parts In-Stock

1+ parts

$1.242

100+ parts

$1.061

1k+ parts

$0.818

10k+ parts

$0.818

31

$1.242

$1.061

$0.818

$0.818

Chip1Stop

Japan . 31 parts In-Stock

1+ parts

$1.280

100+ parts

$1.132

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-

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31

$1.280

$1.132

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Verical

USA . 360,000 parts In-Stock

1+ parts

-

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10k+ parts

$0.462

360,000

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$0.462

Distributors (In-Stock)

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Digiode

USA . 470 parts In-Stock

1+ parts

$0.184

100+ parts

-

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470

$0.184

-

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Vyrian

USA . 562 parts In-Stock

1+ parts

$0.194

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-

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562

$0.194

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Martec Srl

Italy . 366,000 parts In-Stock

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366,000

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Chip Stock

USA . 180,273 parts In-Stock

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180,273

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Cogito LLC

Ukraine . 18,000 parts In-Stock

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18,000

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Netsource Technology, Inc.

USA . 2,484 parts In-Stock

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2,484

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Anansix

USA . 522 parts In-Stock

1+ parts

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522

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ComSIT Distribution GmbH

Germany . 69 parts In-Stock

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69

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Bristol Electronics

USA . 45 parts In-Stock

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45

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Prism Electronics

USA . 2 parts In-Stock

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2

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,321 parts In-Stock

1+ parts

$0.175

100+ parts

-

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4,321

$0.175

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Continental Prestige Electronics

USA . 2,447 parts In-Stock

1+ parts

$1.690

100+ parts

$1.220

1k+ parts

$0.869

10k+ parts

-

2,447

$1.690

$1.220

$0.869

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IDEA Electronic Components Group

UK . 2,339 parts In-Stock

1+ parts

$4.663

100+ parts

-

1k+ parts

$4.196

10k+ parts

-

2,339

$4.663

-

$4.196

-

MKK Technologies

India . 1,185 parts In-Stock

1+ parts

$8.768

100+ parts

-

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1,185

$8.768

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DigiPath Technology Company

USA . 1,185 parts In-Stock

1+ parts

$8.768

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1,185

$8.768

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Perfect Parts

USA . 79,876 parts In-Stock

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79,876

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A-Z Elektronik GmbH

Germany . 6,794 parts In-Stock

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6,794

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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QUARKTWIN TECHNOLOGY LTD

USA . 4,513 parts In-Stock

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4,513

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Metaverse IC Inc.

Canada . 3,028 parts In-Stock

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3,028

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Parana Technologies

USA . 1,655 parts In-Stock

1+ parts

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$5.575

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1,655

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$5.575

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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1,000

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GreenTree Electronics

Israel . 760 parts In-Stock

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760

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Overview

Unlock unparalleled performance with the STG3693QTR from STMicroelectronics, a trusted leader in innovation. This ultra-compact multiplexer delivers exceptional reliability across diverse applications, from telecommunications to automotive systems. Designed for extreme conditions, it ensures seamless operation while minimizing power consumption. Experience swift switching and remarkable signal integrity, empowering your designs to thrive in any environment. Elevate your projects with STMicroelectronics' quality and expertise!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for smaller and more efficient PCB layouts, enabling compact electronic designs.

Package Shape: RECTANGULAR

The rectangular package shape facilitates optimized placement on PCBs, improving space utilization and signal routing.

Nominal Supply Voltage (Vsup): 3 V

The 3 V nominal supply voltage is standard for many low-power applications, balancing performance and energy efficiency.

Power Supplies (V): 1.6/4

This wide power supply voltage range ensures compatibility with various power systems, providing flexibility in design.

No. of Terminals: 16

Having 16 terminals allows for multiple input/output connections, increasing functionality in compact applications.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The very thin profile chip carrier style is ideal for high-density applications, supporting advanced miniaturization.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliability in harsh environments, making it suitable for military and industrial applications.

Minimum Operating Temperature: -55 °C

Operating effectively in temperatures as low as -55 °C makes this product reliable for extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish enhances corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: QUAD

The quad terminal position optimizes layout efficiency, enhancing connectivity options in tight spaces.

Output (V): SEPARATE OUTPUT

Separate output capability provides versatility in circuit design, allowing for independent operation of signal paths.

Maximum Seated Height: 0.55 mm

The low seated height allows for low-profile designs, which is crucial in space-constrained applications.

Width: 1.8 mm

A narrow width contributes to compact designs, accommodating modern demands for smaller, lighter electronic devices.

Other IC type: SPDT

The SPDT configuration allows for versatile switching applications, enhancing the product's adaptability.

Minimum Supply Voltage (Vsup): 1.65 V

Starts operation at a low supply voltage of 1.65 V, making it suitable for battery-powered devices.

Maximum On-state Resistance (Ron): 6.5 ohm

A low on-state resistance of 6.5 ohms reduces power loss during operation, improving efficiency.

Maximum Switch-on Time: 26 ns

Rapid switching capability ensures high-speed performance, crucial for high-frequency applications.

Length: 2.6 mm

The compact length supports high-density arrangements on PCBs, essential for modern electronics.

Maximum Switch-off Time: 6 ns

Quick switch-off time contributes to higher precision and more responsive circuit designs.

Temperature Grade: MILITARY

Designed to military specifications, ensuring high reliability and durability in critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration, ideal for energy-efficient designs.

Terminal Form: NO LEAD

No lead design simplifies PCB assembly and aligns with modern manufacturing trends for environmentally friendly processes.

Terminal Pitch: 0.4 mm

A narrow terminal pitch allows for denser packing of components, maximizing space on PCBs.

Maximum Supply Voltage (Vsup): 4.3 V

Supports a higher maximum supply voltage, enhancing versatility for varying power supply needs.

Nominal Off-state Isolation: 79 dB

High off-state isolation ensures minimal signal interference, crucial for maintaining signal integrity in electronic circuits.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching mechanism prevents short circuits, ensuring safer operation in critical applications.

Nominal On-state Resistance Match: 0.3 ohm

A low nominal on-state resistance match ensures consistent performance across multiple switches, enhancing reliability.

Technical Specifications

Multiplexers & Switches STG3693QTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e4

Length:

2.6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

79 dB

Nominal On-state Resistance Match:

.3 ohm

Maximum On-state Resistance (Ron):

6.5 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.07X.1,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Power Supplies (V):

1.6/4

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Maximum Switch-off Time:

6 ns

Maximum Switch-on Time:

26 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width (mm):

1.8 mm

Trade Compliance

STG3693QTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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