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STG3689DTR

STMicroelectronics

STG3689DTR by STMicroelectronics

STG3689DTR by STMicroelectronics is a CMOS SPDT switch with a compact 2.5mm x 1.4mm footprint, ideal for space-constrained applications. It operates b/w 1.4V and 4.3V, featuring low on-state resistance of 0.6Ω and fast switching times (60ns on, 30ns off). Designed for military use, it withstands extreme temperatures from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,108 parts In-Stock

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3,108

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Anansix

USA . 2,836 parts In-Stock

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Vyrian

USA . 2,338 parts In-Stock

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2,338

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IDEA Electronic Components Group

UK . 292 parts In-Stock

1+ parts

$6.075

100+ parts

-

1k+ parts

$5.467

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292

$6.075

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$5.467

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Microchip USA

USA . 482 parts In-Stock

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$7.046

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482

$7.046

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MKK Technologies

India . 1,404 parts In-Stock

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$11.423

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1,404

$11.423

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DigiPath Technology Company

USA . 1,404 parts In-Stock

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$11.423

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1,404

$11.423

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AZTECH Wire

Italy . 423 parts In-Stock

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$20.290

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423

$20.290

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Corphita

USA . 4,480 parts In-Stock

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Parana Technologies

USA . 184 parts In-Stock

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$7.263

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184

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$7.263

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Overview

Elevate your design with the STG3689DTR from STMicroelectronics, a trusted leader in innovation. This high-performance multiplexer offers exceptional flexibility and reliability for demanding applications, operating seamlessly across a wide temperature range. With its ultra-thin profile and low on-state resistance, you'll enjoy enhanced efficiency and reduced power consumption. Experience superior quality and engineering excellence that empowers your next project to excel!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact design and efficient manufacturing, making it ideal for modern electronic devices.

No. of Functions: 2

Having two functions provides versatility, enabling the device to handle multiple tasks while saving space on the PCB.

Package Shape: RECTANGULAR

The rectangular package shape allows for easier integration into various circuit layouts and makes optimal use of board space.

Nominal Supply Voltage (Vsup): 2.7 V

A nominal supply voltage of 2.7 V supports low-power applications, enhancing energy efficiency in battery-operated devices.

Power Supplies (V): 1.8/3.3

Compatibility with both 1.8 V and 3.3 V power supplies allows for flexible integration into a variety of systems.

No. of Terminals: 10

With 10 terminals, this device provides ample connection points, facilitating various configurations in circuit designs.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile make this product suitable for space-constrained applications, enhancing design flexibility.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125 °C ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -55 °C

The capability to operate at -55 °C makes this device well-suited for extreme applications, such as aerospace and military use.

Terminal Position: DUAL

Dual terminal positioning allows for versatile routing options, enhancing the product's adaptability in various designs.

Output (V): SEPARATE OUTPUT

Separate outputs provide greater control over functionality and flexibility in circuit designs.

Maximum Seated Height: 0.6 mm

A low seated height of 0.6 mm contributes to a sleek profile, beneficial for slimline electronic designs.

Width (mm): 1.4 mm

A compact width of 1.4 mm enhances design possibilities for space-sensitive applications.

Other IC type: SPDT

As a Single-Pole Double-Throw device, it provides effective signal routing options, making it a valuable addition to any circuitry.

Minimum Supply Voltage (Vsup): 1.4 V

A low minimum supply voltage of 1.4 V broadens the range of voltages the device can operate under, increasing design flexibility.

Maximum Time At Peak Reflow Temperature (s): 40

The capability to withstand up to 40 seconds at peak reflow temperature aids in reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

A high peak reflow temperature of 260 °C ensures compatibility with modern soldering techniques, enhancing manufacturing efficiency.

Maximum On-state Resistance (Ron): 0.9 ohm

With a maximum on-state resistance of 0.9 ohm, this product ensures low signal loss, contributing to higher efficiency in performance.

Maximum Switch-on Time: 60 ns

A fast maximum switch-on time of 60 ns allows for rapid signal switching, suitable for high-speed applications.

Length: 2.5 mm

At 2.5 mm in length, this device maintains a compact form factor, favorable for miniaturized electronic systems.

Maximum Switch-off Time: 30 ns

With a maximum switch-off time of 30 ns, the device supports quick signal termination, enhancing overall circuit responsiveness.

Temperature Grade: MILITARY

The military-grade temperature rating ensures robustness and reliability in harsh conditions, ensuring longevity and performance.

Technology: CMOS

Utilizing CMOS technology provides low power consumption, resulting in energy efficiency and prolonging battery life in portable devices.

Terminal Form: NO LEAD

No-lead terminals enhance the device's environmental friendliness and allow for lower-profile designs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm is suitable for high-density designs, enabling more components to fit within the same board space.

Maximum Supply Voltage (Vsup): 4.3 V

The ability to operate up to 4.3 V allows for flexible integration with higher voltage systems, broadening its application range.

Nominal Off-state Isolation: 90 dB

A high nominal off-state isolation of 90 dB minimizes crosstalk and interference between channels, ensuring signal integrity.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching arrangement prevents potential short circuits, enhancing safety and reliability in operation.

Nominal On-state Resistance Match: 0.6 ohm

With a nominal on-state resistance match of 0.6 ohm, this ensures consistency in performance, improving overall circuit reliability.

Technical Specifications

Multiplexers & Switches STG3689DTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Additional Features:

2-CHANNEL MUX/DEMUX

Other IC type:

JESD-30 Code:

R-XDSO-N10

Length:

2.5 mm

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

10

Nominal Off-state Isolation:

90 dB

Nominal On-state Resistance Match:

.6 ohm

Maximum On-state Resistance (Ron):

.9 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC10,.06,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Maximum Switch-off Time:

30 ns

Maximum Switch-on Time:

60 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

1.4 mm

Trade Compliance

STG3689DTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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