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STG3684AQTR

STMicroelectronics

STG3684AQTR by STMicroelectronics

STG3684AQTR by STMicroelectronics is a CMOS SPDT switch with a max on-state resistance of 0.7Ω and operates b/w 1.65V to 4.3V. It features a compact 3mm x 3mm package, ideal for space-constrained applications. With military-grade temp range (-55 °C to 125 °C), it's perfect for demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,754 parts In-Stock

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7,754

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Digiode

USA . 3,110 parts In-Stock

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3,110

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Anansix

USA . 1,280 parts In-Stock

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1,280

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 219 parts In-Stock

1+ parts

$1.648

100+ parts

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219

$1.648

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AZTECH Wire

Italy . 317 parts In-Stock

1+ parts

$16.750

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317

$16.750

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IDEA Electronic Components Group

UK . 716 parts In-Stock

1+ parts

$20.144

100+ parts

-

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$18.130

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716

$20.144

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$18.130

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MKK Technologies

India . 1,461 parts In-Stock

1+ parts

$37.880

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1,461

$37.880

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DigiPath Technology Company

USA . 1,461 parts In-Stock

1+ parts

$37.880

100+ parts

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1,461

$37.880

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Corphita

USA . 4,352 parts In-Stock

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4,352

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Parana Technologies

USA . 1,310 parts In-Stock

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$24.086

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1,310

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$24.086

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Overview

Experience unparalleled reliability and performance with the STG3684AQTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This versatile multiplexer enhances signal integrity in demanding applications, thanks to its robust design and military-grade reliability. With low on-state resistance and fast switching times, it’s perfect for automotive, industrial, and consumer electronics. Empower your designs with quality you can depend on!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for efficient use of PCB space and facilitates automated assembly.

No. of Functions: 2

Having two functions enables versatile applications, accommodating different signal paths in a compact module.

Package Shape: SQUARE

The square package shape optimizes the use of board real estate, enhancing layout flexibility.

Nominal Supply Voltage (Vsup): 2.3 V

A nominal supply voltage of 2.3 V aligns well with low-power electronic designs, reducing energy consumption.

Power Supplies (V): 1.8/3.3

Support for multiple power supply voltages (1.8V and 3.3V) increases compatibility with various systems.

No. of Terminals: 16

With 16 terminals, this product offers ample connection points for complex circuits while remaining compact.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile design aids in thermal management and space saving, making it suitable for high-density applications.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C supports use in high-temperature environments, ensuring reliability.

Minimum Operating Temperature: -55 °C

The wide operating temperature range from -55 °C to 125 °C makes this device suitable for military and industrial applications.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and prevents oxidation, improving performance in assembly.

Terminal Position: QUAD

Quad terminal positioning allows for easy and efficient routing on the PCB, simplifying design layout.

Output (V): SEPARATE OUTPUT

Separate outputs facilitate independent signal handling, enhancing design flexibility.

Maximum Seated Height: 1 mm

The low seated height of 1 mm contributes to a compact design, perfect for space-constrained applications.

Width: 3 mm

A width of 3 mm keeps the product sleek, making it suitable for high-density PCB designs.

Other IC type: SPDT

The SPDT configuration allows for effective switching of signals, providing a reliable performance.

Minimum Supply Voltage (Vsup): 1.65 V

Support for a low minimum supply voltage ensures compatibility with a variety of low-voltage systems.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds allows for flexibility during soldering processes without compromising integrity.

Peak Reflow Temperature (°C): 260

The high peak reflow temperature accommodates modern soldering techniques, ensuring robust connections.

Maximum On-state Resistance (Ron): 0.7 ohm

A maximum on-state resistance of 0.7 ohm minimizes signal loss and power dissipation during operation.

Maximum Switch-on Time: 85 ns

Fast switch-on time of 85 ns enables high-speed signal processing, catering to dynamic applications.

Length: 3 mm

A length of 3 mm maintains a compact size, advantageous for tightly packed electronic assemblies.

Maximum Switch-off Time: 30 ns

A quick switch-off time of 30 ns enhances performance in applications requiring rapid signal transitions.

Temperature Grade: MILITARY

The military-grade temperature tolerance ensures reliable performance in extreme environments.

Technology: CMOS

CMOS technology provides low power consumption and high integration, making it ideal for battery-operated devices.

Terminal Form: NO LEAD

No-lead design contributes to a more compact footprint, enhancing thermal performance and minimizing parasitic inductance.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for denser packing of components on PCBs, ideal for compact designs.

Maximum Supply Voltage (Vsup): 4.3 V

The ability to operate at up to 4.3 V ensures versatility for various application requirements.

Nominal Off-state Isolation: 66 dB

A nominal off-state isolation of 66 dB ensures minimal signal interference, enhancing overall system performance.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature prevents short circuits, ensuring safe operation in circuits.

Nominal On-state Resistance Match: 0.1 ohm

A nominal on-state resistance match of 0.1 ohm allows for high efficiency operation with minimal loss.

Technical Specifications

Multiplexers & Switches STG3684AQTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Additional Features:

2-CHANNEL MUX/DEMUX

Other IC type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

16

Nominal Off-state Isolation:

66 dB

Nominal On-state Resistance Match:

.1 ohm

Maximum On-state Resistance (Ron):

.7 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Maximum Switch-off Time:

30 ns

Maximum Switch-on Time:

85 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

STG3684AQTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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