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STG3159DTR

STMicroelectronics

STG3159DTR by STMicroelectronics

STG3159DTR by STMicroelectronics is a compact SPDT switch with a max operating temp of 125 °C and low on-state resistance of 2.3Ω. It operates b/w 1.65V to 4.5V, making it ideal for military applications requiring reliable performance in tight spaces. Its fast switching times enhance efficiency in electronic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,786 parts In-Stock

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5,786

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Digiode

USA . 2,465 parts In-Stock

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2,465

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Anansix

USA . 824 parts In-Stock

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824

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Distributors (Availability)

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AZTECH Wire

Italy . 743 parts In-Stock

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$8.100

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743

$8.100

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Microchip USA

USA . 383 parts In-Stock

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$8.200

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383

$8.200

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IDEA Electronic Components Group

UK . 2,287 parts In-Stock

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$16.210

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$14.589

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2,287

$16.210

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$14.589

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MKK Technologies

India . 2,091 parts In-Stock

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$30.483

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2,091

$30.483

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DigiPath Technology Company

USA . 2,091 parts In-Stock

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$30.483

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2,091

$30.483

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A-Z Elektronik GmbH

Germany . 5,891 parts In-Stock

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Corphita

USA . 2,238 parts In-Stock

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Perfect Parts

USA . 1,680 parts In-Stock

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1,680

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Parana Technologies

USA . 1,640 parts In-Stock

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$19.382

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$19.382

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Overview

Unlock unmatched performance with the STG3159DTR from STMicroelectronics—a leader in innovation and quality. This ultra-compact SPDT switch excels in precision, reliability, and thermal resilience, making it ideal for a range of applications, from aerospace to consumer electronics. Experience superior signal integrity and minimal power loss, empowering your designs with efficiency and cutting-edge technology that stands the test of time. Choose STMicroelectronics for excellence you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and longevity in various applications.

Surface Mount: YES

Allows for efficient space utilization and automated assembly in modern devices.

Package Shape: RECTANGULAR

Compact shape contributes to a minimal footprint on the PCB, ideal for space-constrained designs.

Nominal Supply Voltage (Vsup): 1.8 V

Standard voltage supply helps to maintain compatibility with low-voltage digital circuits.

Power Supplies (V): 1.8/4

Versatile supply range accommodates applications requiring different voltage levels.

No. of Terminals: 6

Sufficient terminals for various configurations and applications while ensuring simplicity.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Thin profile promotes high-density PCB designs, suitable for portable electronics.

Maximum Operating Temperature: 125 °C

High temperature tolerance enables use in demanding environments, enhancing reliability.

Minimum Operating Temperature: -55 °C

Low temperature rating allows operation in extreme conditions, suitable for military and aerospace applications.

Terminal Finish: TIN

Tin finish enhances solderability and ensures secure connections on the PCB.

Terminal Position: DUAL

Dual terminal positioning facilitates flexible routing options on the PCB.

Maximum Seated Height: 0.55 mm

Low seated height enhances fit in tight spaces and improves overall device design.

Width: 1 mm

Narrow width supports compact designs and helps integrate into smaller devices.

Other IC type: SPDT

Single-pole, double-throw functionality provides versatility in signal routing.

Minimum Supply Voltage (Vsup): 1.65 V

Allows compatibility with a wide range of low-voltage applications.

Maximum On-state Resistance (Ron): 2.3 ohm

Low on-state resistance minimizes power loss and improves energy efficiency.

Maximum Switch-on Time: 32 ns

Fast switch-on time is critical for high-speed applications and ensures minimal propagation delay.

Length: 1.2 mm

Compact length supports high-density circuit designs while maintaining performance.

Maximum Switch-off Time: 27 ns

Rapid switch-off time enhances performance in dynamic signal routing applications.

Temperature Grade: MILITARY

Designed to meet military specifications ensures reliability in challenging environments.

Technology: CMOS

CMOS technology provides low power consumption and high integration, making it ideal for portable devices.

Terminal Form: NO LEAD

No-lead design reduces PCB space requirements and improves thermal performance.

Terminal Pitch: 0.4 mm

Fine pitch enables high-density layouts, allowing more components to fit within a limited area.

Maximum Supply Voltage (Vsup): 4.5 V

Supports higher voltage operations for various applications beyond basic logic levels.

Nominal Off-state Isolation: 80 dB

High isolation minimizes cross-talk between channels, enhancing signal integrity.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make functionality prevents short circuits during switching, ensuring safe operation.

Nominal On-state Resistance Match: 0.06 ohm

Excellent resistance matching ensures consistent performance across multiple switches.

Technical Specifications

Multiplexers & Switches STG3159DTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.2 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

80 dB

Nominal On-state Resistance Match:

.06 ohm

Maximum On-state Resistance (Ron):

2.3 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Power Supplies (V):

1.8/4

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

1.8 V

Surface Mount:

YES

Maximum Switch-off Time:

27 ns

Maximum Switch-on Time:

32 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width (mm):

1 mm

Trade Compliance

STG3159DTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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