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AP2822AKATR-G1

Bcd Semiconductor Manufacturing

AP2822AKATR-G1 by Bcd Semiconductor Manufacturing

SPST; Temperature Grade: INDUSTRIAL; No. of Terminals: 5; Package Code: LSSOP; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$0.159

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$0.159

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Chip Stock

USA . 48,064 parts In-Stock

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VNN

France . 3,266 parts In-Stock

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Vyrian

USA . 1,395 parts In-Stock

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Argo Parts USA

USA . 3,989 parts In-Stock

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$0.159

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$0.154

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Continental Prestige Electronics

USA . 2,621 parts In-Stock

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$0.156

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Netroflash

USA . 100 parts In-Stock

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$0.159

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$0.151

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$0.148

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$0.162

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$0.162

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Semicontronic

India . 1,427 parts In-Stock

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$4.500

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$4.388

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$4.365

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Ampacity Inc.

Singapore . 1,048 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 855 parts In-Stock

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$10.329

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Aztec Data Supply Inc.

USA . 2,915 parts In-Stock

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$12.390

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Corohmni

South Africa . 503 parts In-Stock

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$14.373

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Modulus Dynamics

Lithuania . 491 parts In-Stock

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$15.738

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Microchip USA

USA . 4,117 parts In-Stock

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$16.510

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Perfect Parts

USA . 191,766 parts In-Stock

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Futuretech Components

Singapore . 24,000 parts In-Stock

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RC Electronics

USA . 9,275 parts In-Stock

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Lixinc

USA . 4,810 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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GreenTree Electronics

Israel . 220 parts In-Stock

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iodParts Technologies Inc.

India . 44 parts In-Stock

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Technical Specifications

Multiplexers & Switches AP2822AKATR-G1 attributes and parameters. Explore more Multiplexers & Switches devices from Bcd Semiconductor Manufacturing

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G5

JESD-609 Code:

e3

Length:

2.92 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

5

Maximum On-state Resistance (Ron):

.11 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width (mm):

1.6 mm

Trade Compliance

AP2822AKATR-G1 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Bcd Semiconductor Manufacturing

Diodes Incorporated to Acquire BCD Semiconductor Manufacturing Limited December 26, 2012 | Plano, Texas Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application specific standard products within the broad discrete, logic and analog semiconductor markets, and BCD Semiconductor Manufacturing Limited ("BCD Semiconductor" or "BCD") (Nasdaq: BCDS), a leading analog integrated device manufacturer incorporated in the Cayman Islands, today announced that Diodes has entered into an Agreement and Plan of Merger to acquire BCD. BCD Semiconductor Manufacturing Limited (BCD Semi) is a leading analog integrated device manufacturer, or IDM, based in Greater China, specializing in the design, manufacture and sale of power management integrated circuits, or ICs. The company's broad portfolio of power management ICs primarily targets rapidly growing, high volume markets such as mobile phones, portable media players, LCD televisions and monitors, personal computers, adapters and chargers and other electronics products. As an IDM, BCD Semi integrates product design and process technology to optimize product performance and cost. The company offers system-level solutions with the quality, performance and reliability required by our customers. Our Greater China-based operations provide proximity to the rapidly growing electronics industry in Asia, enabling us to align our product development effort with customers and market trends and to provide timely and effective technical support to its customers.

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