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STG3384DTR

STMicroelectronics

STG3384DTR by STMicroelectronics

STG3384DTR by STMicroelectronics is a CMOS SPST switch with a max on-state resistance of 2.5Ω and operates b/w 1.4V to 4.3V. It features dual functions in a compact, thin profile package, ideal for military applications requiring high reliability. With fast switching times of 60ns (on) and 30ns (off), it ensures efficient signal management.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,644 parts In-Stock

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4,644

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Digiode

USA . 4,098 parts In-Stock

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4,098

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Anansix

USA . 1,689 parts In-Stock

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1,689

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 441 parts In-Stock

1+ parts

$2.510

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-

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441

$2.510

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AZTECH Wire

Italy . 297 parts In-Stock

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$20.270

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297

$20.270

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IDEA Electronic Components Group

UK . 1,545 parts In-Stock

1+ parts

$21.402

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$19.262

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1,545

$21.402

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$19.262

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MKK Technologies

India . 1,627 parts In-Stock

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$40.245

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1,627

$40.245

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DigiPath Technology Company

USA . 1,627 parts In-Stock

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$40.245

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1,627

$40.245

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Parana Technologies

USA . 1,416 parts In-Stock

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$25.589

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$25.589

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Corphita

USA . 517 parts In-Stock

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Overview

Elevate your designs with the STG3384DTR from STMicroelectronics, a leader in innovative semiconductor solutions. This ultra-thin, high-performance multiplexer delivers exceptional reliability across a wide range of applications, from consumer electronics to industrial systems. With its low power requirements and robust temperature range, it ensures optimal performance in even the most demanding environments. Experience the unmatched quality and support that only STMicroelectronics can provide!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space.

No. of Functions: 2

Having two functions provides flexibility for various applications while simplifying design requirements.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and facilitates easier arrangement of components.

Nominal Supply Voltage (Vsup): 1.65 V

A low nominal supply voltage is energy-efficient, making it suitable for battery-operated devices.

Power Supplies (V): 1.4/4.3

Wide power supply range supports various applications, enhancing versatility.

No. of Terminals: 10

Ten terminals allow for various connections, enabling more complex circuit designs.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The very thin profile is advantageous for space-constrained applications and enables high-density layouts.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures reliability in demanding environments.

Minimum Operating Temperature: -55 °C

Capable of functioning in very low temperatures, suitable for military and outdoor applications.

Terminal Position: DUAL

Dual terminal position enhances flexibility in design and layout options on the PCB.

Output (V): SEPARATE OUTPUT

Separate output design minimizes interference, improving signal clarity.

Maximum Seated Height: 0.6 mm

A low seated height is key for compact designs, allowing for slimmer electronic devices.

Width: 1.4 mm

Slim width is optimal for space-efficient designs, enabling more compact boards.

Other IC type: SPST

SPST configuration is reliable and commonly used, making it easy to integrate into existing designs.

Minimum Supply Voltage (Vsup): 1.4 V

A low minimum supply voltage enhances power efficiency, beneficial for battery-powered applications.

Maximum On-state Resistance (Ron): 2.5 ohm

Low on-state resistance minimizes power loss, improving energy efficiency during operation.

Maximum Switch-on Time: 60 ns

Fast switch-on time enhances performance in high-speed applications, improving overall efficiency.

Length: 2.5 mm

A compact length aids in high-density configurations, making it suitable for miniaturized devices.

Maximum Switch-off Time: 30 ns

Quick switch-off times contribute to improved responsiveness in electronic circuits.

Temperature Grade: MILITARY

Designed for military applications, ensuring robustness and reliability even in extreme conditions.

Technology: CMOS

CMOS technology offers high efficiency and low power consumption, making it ideal for modern applications.

Terminal Form: NO LEAD

No lead terminals enhance durability and reliability, especially in high-frequency applications.

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for tighter component placement on PCBs, optimizing space usage.

Maximum Supply Voltage (Vsup): 4.3 V

High maximum supply voltage accommodates a variety of applications, providing design flexibility.

Normal Position (V): NC

Normal closed position is useful for default signal states, enhancing design predictability.

Nominal Off-state Isolation: 90 dB

High off-state isolation ensures minimal signal crosstalk, preserving signal integrity in multi-channel applications.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make switching prevents short circuits, enhancing operational safety in electronic circuits.

Nominal On-state Resistance Match: 0.6 ohm

Low on-state resistance match provides consistent performance, essential for high-speed applications.

Technical Specifications

Multiplexers & Switches STG3384DTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Additional Features:

MULTIPLE CLOSURE SWITCH ARRAY

Other IC type:

JESD-30 Code:

R-PDSO-N10

Length:

2.5 mm

Normal Position (V):

NC

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

10

Nominal Off-state Isolation:

90 dB

Nominal On-state Resistance Match:

.6 ohm

Maximum On-state Resistance (Ron):

2.5 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.4/4.3

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Maximum Switch-off Time:

30 ns

Maximum Switch-on Time:

60 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.4 mm

Trade Compliance

STG3384DTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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