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STG3690TTR

STMicroelectronics

STG3690TTR by STMicroelectronics

STG3690TTR by STMicroelectronics is a CMOS SPDT switch with 4 functions, ideal for low-power applications. It operates b/w 1.65V and 3.6V, featuring a max on-state resistance of 0.5Ω and excellent isolation at 64 dB. Its compact design suits military-grade environments with extreme temperatures from -55 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,320 parts In-Stock

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3,320

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Anansix

USA . 1,576 parts In-Stock

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1,576

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Digiode

USA . 684 parts In-Stock

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684

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 407 parts In-Stock

1+ parts

$18.018

100+ parts

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1k+ parts

$16.216

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407

$18.018

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$16.216

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MKK Technologies

India . 1,907 parts In-Stock

1+ parts

$33.882

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1,907

$33.882

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DigiPath Technology Company

USA . 1,907 parts In-Stock

1+ parts

$33.882

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1,907

$33.882

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Corphita

USA . 3,391 parts In-Stock

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3,391

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Parana Technologies

USA . 2,102 parts In-Stock

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$21.544

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2,102

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$21.544

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Overview

Elevate your designs with the STG3690TTR from STMicroelectronics, a leader in innovation and quality. This versatile multiplexer delivers exceptional performance across diverse applications, ensuring reliability even in extreme conditions. With its compact size and low on-state resistance, it enhances efficiency while reducing power consumption. Count on STMicroelectronics for cutting-edge solutions that drive your projects forward, empowering you to achieve unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and resistance to environmental factors, ensuring reliable performance.

Surface Mount: YES

The surface mount feature allows for smaller circuit board designs and easier assembly processes.

No. of Functions: 4

Having multiple functions increases versatility in applications, enabling more complex circuit designs.

Package Shape: RECTANGULAR

Rectangular packaging optimizes space on PCBs, facilitating efficient layouts and component placement.

Nominal Supply Voltage (Vsup): 3 V

Operating at a nominal voltage of 3V makes it suitable for low-power applications, enhancing energy efficiency.

Power Supplies (V): 1.8/3.3

Support for multiple voltage levels provides flexibility in integration with various systems.

No. of Terminals: 16

With 16 terminals, it allows for a higher number of connections, improving functionality in multiplexing applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact design helps save space on circuit boards, making it ideal for modern electronic devices.

Maximum Operating Temperature: 125 °C

This high temperature tolerance ensures reliable operation in harsh environments.

Minimum Operating Temperature: -55 °C

The ability to function in extreme cold makes it suitable for applications in challenging climates.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning increases design flexibility and simplifies integration into various PCB layouts.

Output (V): SEPARATE OUTPUT

Separate outputs enhance control and functionality in circuit operations.

Maximum Seated Height: 1.2 mm

A low seated height improves compatibility with low-profile designs, facilitating compact builds.

Width: 4.4 mm

Compact width ensures efficient space utilization on PCBs.

Other IC type: SPDT

As a Single Pole Double Throw (SPDT) switch, it provides versatile circuit switching options.

Minimum Supply Voltage (Vsup): 1.65 V

Lower supply voltage capability enhances versatility in various low-power applications.

Maximum On-state Resistance (Ron): 0.5 ohm

Low on-state resistance minimizes power loss and heat generation during operation.

Length: 5 mm

Short length ensures minimal space requirement on PCBs, ideal for compact applications.

Temperature Grade: MILITARY

Military-grade temperature qualifications indicate reliability in extreme operational conditions.

Technology: CMOS

CMOS technology supports low power consumption and high-speed performance.

Terminal Form: GULL WING

Gull wing terminals provide a reliable solder joint and ease of mounting on PCBs.

Terminal Pitch: 0.65 mm

This finer pitch allows for denser placement of components, making it suitable for compact designs.

Maximum Supply Voltage (Vsup): 3.6 V

Offers flexibility in voltage supply, enabling compatibility with various electronic systems.

Normal Position (V): NO/NC

Support for both normally open and normally closed configurations increases versatility in circuit design.

Nominal Off-state Isolation: 64 dB

High off-state isolation provides excellent signal integrity and reduces crosstalk in sensitive applications.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching prevents short circuits during operation, enhancing device safety.

Nominal On-state Resistance Match: 0.06 ohm

Extremely low on-state resistance ensures minimal voltage drop and power loss, optimizing performance.

Technical Specifications

Multiplexers & Switches STG3690TTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Normal Position (V):

NO/NC

No. of Channels:

1

No. of Functions:

4

No. of Terminals:

16

Nominal Off-state Isolation:

64 dB

Nominal On-state Resistance Match:

.06 ohm

Maximum On-state Resistance (Ron):

.5 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

STG3690TTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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