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STG3684QTR

STMicroelectronics

STG3684QTR by STMicroelectronics

STG3684QTR by STMicroelectronics is a CMOS SPDT switch with a max on-state resistance of 0.5Ω and operates b/w 1.65V to 3.6V. It features a compact, no-lead design suitable for military applications, functioning effectively in extreme temps (-55 °C to 125 °C). Ideal for multiplexing signals in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,134 parts In-Stock

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Anansix

USA . 2,183 parts In-Stock

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Digiode

USA . 1,148 parts In-Stock

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Cyclops Electronics Ltd

UK . 200 parts In-Stock

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LWI Electronics Inc

India . 3 parts In-Stock

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Microchip USA

USA . 365 parts In-Stock

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$3.378

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365

$3.378

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AZTECH Wire

Italy . 182 parts In-Stock

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$9.270

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$9.270

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IDEA Electronic Components Group

UK . 1,789 parts In-Stock

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$19.193

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$17.274

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$19.193

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MKK Technologies

India . 728 parts In-Stock

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$36.091

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728

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DigiPath Technology Company

USA . 728 parts In-Stock

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$36.091

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A-Z Elektronik GmbH

Germany . 5,601 parts In-Stock

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Parana Technologies

USA . 2,135 parts In-Stock

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$22.948

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Corphita

USA . 1,636 parts In-Stock

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Kepictronics

USA . 200 parts In-Stock

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Perfect Parts

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Overview

Elevate your designs with the STG3684QTR from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile multiplexer and switch enhance performance across various applications, from automotive to industrial control systems. With exceptional reliability and a wide operating temperature range, it ensures seamless functionality. Embrace efficiency, reduced power consumption, and superior signal integrity—transforming your projects into success stories with this premium component.

Feature Benefit Bullets

Surface Mount: YES

This surface mount design allows for efficient use of PCB space and simplifies the assembly process.

No. of Functions: 2

Having multiple functions in one device increases design flexibility and reduces component count.

Package Shape: SQUARE

The square package shape optimizes layout and signal integrity on the PCB.

Nominal Supply Voltage (Vsup): 2.7 V

An ideal nominal supply voltage makes it suitable for various low-voltage applications.

Power Supplies (V): 1.8/3.3

Supporting both 1.8V and 3.3V power supplies increases compatibility with diverse electronic systems.

No. of Terminals: 16

A generous number of terminals enables complex routing and more versatile connections.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style ensures effective thermal management while maintaining a low profile for space-constrained applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this device suitable for demanding environments.

Minimum Operating Temperature: -55 °C

Supports operation in extreme low-temperature conditions, ideal for military and aerospace applications.

Terminal Finish: MATTE TIN

MATTE TIN finish enhances surface solderability and reduces oxidation.

Terminal Position: QUAD

The quad terminal arrangement provides a compact and efficient design layout.

Output (V): SEPARATE OUTPUT

Separate output functionality allows for more flexible circuit designs.

Maximum Seated Height: 1 mm

A low seated height is ideal for applications with tight height restrictions.

Width: 3 mm

Compact width allows for dense PCB layouts and flexibility in design.

Other IC type: SPDT

As an SPDT type, this device can effectively switch between multiple signals, enhancing functionality.

Minimum Supply Voltage (Vsup): 1.65 V

This low minimum supply voltage allows operation in battery-powered and energy-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

A controlled peak reflow time ensures reliability during the assembly process.

Peak Reflow Temperature °C: 260

The ability to withstand high temperatures during soldering increases manufacturing robustness.

Maximum On-state Resistance (Ron): 0.5 ohm

Low on-state resistance contributes to minimal power loss and heat generation during operation.

Maximum Switch-on Time: 50 ns

Fast switch-on time allows for high-speed applications where timing is critical.

Length: 3 mm

A small length contributes to a reduced footprint, beneficial for compact designs.

Temperature Grade: MILITARY

MILITARY grade ensures high reliability and performance in harsh environments.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: NO LEAD

No lead design contributes to reduced weight and enhances reliability by minimizing mechanical stress.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for denser interconnections, crucial in high-density applications.

Maximum Supply Voltage (Vsup): 3.6 V

A higher maximum supply voltage range allows compatibility with various modern devices.

Normal Position (V): NO/NC

The NO/NC configuration provides enhanced versatility in circuit design.

Nominal Off-state Isolation: 64 dB

High off-state isolation minimizes crosstalk between channels, crucial for signal integrity.

Switching (V): BREAK-BEFORE-MAKE

This switching characteristic prevents unintended short circuits, enhancing circuit safety.

Nominal On-state Resistance Match: 0.06 ohm

Excellent on-state resistance matching ensures consistent performance across multiple devices.

Technical Specifications

Multiplexers & Switches STG3684QTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO/NC

No. of Channels:

1

No. of Functions:

2

No. of Terminals:

16

Nominal Off-state Isolation:

64 dB

Nominal On-state Resistance Match:

.06 ohm

Maximum On-state Resistance (Ron):

.5 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

2.7 V

Surface Mount:

YES

Maximum Switch-on Time:

50 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

STG3684QTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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