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STG3220QTR

STMicroelectronics

STG3220QTR by STMicroelectronics

STG3220QTR by STMicroelectronics is a CMOS SPDT switch with a max on-state resistance of 7Ω and operates b/w 1.8V to 4V. It features a compact chip carrier package with 10 terminals, suitable for industrial applications. Its robust design supports -40 °C to 85 °C temp range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,426 parts In-Stock

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6,426

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Anansix

USA . 2,505 parts In-Stock

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2,505

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Digiode

USA . 1,574 parts In-Stock

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1,574

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 285 parts In-Stock

1+ parts

$9.900

100+ parts

-

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285

$9.900

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IDEA Electronic Components Group

UK . 323 parts In-Stock

1+ parts

$20.811

100+ parts

-

1k+ parts

$18.730

10k+ parts

-

323

$20.811

-

$18.730

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AZTECH Wire

Italy . 60 parts In-Stock

1+ parts

$22.160

100+ parts

-

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60

$22.160

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MKK Technologies

India . 1,710 parts In-Stock

1+ parts

$39.134

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1,710

$39.134

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DigiPath Technology Company

USA . 1,710 parts In-Stock

1+ parts

$39.134

100+ parts

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1,710

$39.134

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Component Stockers USA

USA . 495 parts In-Stock

1+ parts

$99.990

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495

$99.990

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Perfect Parts

USA . 5,075 parts In-Stock

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5,075

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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A-Z Elektronik GmbH

Germany . 1,754 parts In-Stock

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1,754

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Corphita

USA . 1,534 parts In-Stock

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1,534

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Parana Technologies

USA . 389 parts In-Stock

1+ parts

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100+ parts

$24.883

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389

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$24.883

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Overview

Unlock the potential of your designs with the STG3220QTR from STMicroelectronics, a leader in innovative semiconductor solutions. This advanced multiplexer offers exceptional reliability and flexibility, making it ideal for a wide range of applications—from consumer electronics to industrial systems. With its robust performance across temperature extremes and efficient power handling, you can trust this component to enhance your projects while reducing design complexity and boosting overall efficiency. Experience the superior quality that only STMicroelectronics can deliver!

Feature Benefit Bullets

Surface Mount: YES

This product's surface mount design allows for easy integration into compact electronic devices, saving space on PCBs.

No. of Functions: 2

With two functions, this multiplexer provides flexibility in routing signals, making it a versatile choice for various applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient layout options on circuit boards, enhancing design adaptability.

Power Supplies (V): 1.8/4

The wide power supply range allows the product to operate in different systems, accommodating various voltage levels.

No. of Terminals: 10

Having 10 terminals enhances connectivity and signal routing capability, enabling more complex configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides reliable protection and mounting for the IC, enhancing durability in electronic environments.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is suitable for industrial applications that experience higher thermal conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures that the product is reliable in extreme climates, making it ideal for outdoor or harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent corrosion resistance and reliable conductivity, ensuring long-term performance.

Terminal Position: QUAD

The quad terminal position optimizes space utilization on the PCB, allowing for compact and efficient circuit design.

Output (V): SEPARATE OUTPUT

Separate output configuration enhances signal integrity and allows for distinct signal pathways, reducing the risk of interference.

Other IC type: SPDT

Being an SPDT (Single Pole Double Throw) type offers versatility in switching applications, allowing for effective signal management.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds ensures compatibility with standard soldering processes, simplifying assembly.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, this product can withstand typical soldering conditions used in assembly.

Maximum On-state Resistance (Ron): 7 ohm

A low on-state resistance of 7 ohms minimizes power loss, enhancing overall efficiency in signal transmission.

Maximum Switch-on Time: 23 ns

A fast switch-on time of 23 nanoseconds enables quick signal processing, making it suitable for high-speed applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies reliability and robustness, making it suitable for demanding industrial environments.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high speed, making it an excellent choice for modern electronics.

Terminal Form: NO LEAD

The no-lead design aids in reducing footprint and improving thermal performance, while also complying with RoHS standards.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm allows for dense layout designs, catering to compact devices without sacrificing performance.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching feature prevents short circuits during operation, ensuring safer and more reliable signal routing.

Technical Specifications

Multiplexers & Switches STG3220QTR attributes and parameters. Explore more Multiplexers & Switches devices from STMicroelectronics

Specs

Other IC type:

JESD-30 Code:

R-XQCC-N10

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

10

Maximum On-state Resistance (Ron):

7 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC10,.06X.07,16

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/4

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

23 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

STG3220QTR Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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