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FSA4157AL6X

Onsemi

FSA4157AL6X by Onsemi

FSA4157AL6X by Onsemi is a SPDT switch with 1.15 ohm Ron, 70 dB isolation, and 0.06 ohm resistance match. It operates at -40 to 85 °C for industrial applications requiring fast switching times of 65 ns on and 30 ns off. The small outline package with 0.55 mm height makes it suitable for compact designs in various electronic systems.

Median Price

$0.675

Lifecycle Status

EOL

Suppliers In-Stock

13

In-Stock Inventory

1k+

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Arrow

USA . 5,000 parts In-Stock

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$0.562

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$0.562

Chip1Stop

Japan . 5,000 parts In-Stock

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$0.675

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Verical

USA . 5,000 parts In-Stock

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$0.675

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$0.675

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Nova Conductors

Japan . 10 parts In-Stock

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$0.442

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$0.442

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Chip Stock

USA . 23,500 parts In-Stock

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Vyrian

USA . 4,541 parts In-Stock

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Semtec, LLC

USA . 3,857 parts In-Stock

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Digiode

USA . 3,058 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,824 parts In-Stock

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Prism Electronics

USA . 278 parts In-Stock

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ComSIT Distribution GmbH

Germany . 243 parts In-Stock

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Sunrise Surplus Inc.

USA . 125 parts In-Stock

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NexGen Digital

USA . 9 parts In-Stock

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Corohmni

South Africa . 391 parts In-Stock

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$0.433

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Continental Prestige Electronics

USA . 4,661 parts In-Stock

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$0.442

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$0.433

4,661

$0.442

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$0.433

Argo Parts USA

USA . 1,963 parts In-Stock

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$0.442

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$0.429

1,963

$0.442

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$0.429

Netroflash

USA . 50 parts In-Stock

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$0.442

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Semicontronic

India . 4,914 parts In-Stock

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$0.478

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$0.466

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$0.464

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$0.478

$0.466

$0.464

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Aztec Data Supply Inc.

USA . 277 parts In-Stock

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$11.680

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GreenTree Electronics

Israel . 535,000 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

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TANS Electronics

Latvia . 7,782 parts In-Stock

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Kulean Microsystems

USA . 5,352 parts In-Stock

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Assy Fe

Spain . 4,860 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Problanco Electronics

Mexico . 3,506 parts In-Stock

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Supply Digital

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Microchip USA

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Corphita

USA . 1,280 parts In-Stock

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SupplyDigital Components

Austria . 1,123 parts In-Stock

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Kepictronics

USA . 300 parts In-Stock

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UHIMA Technologies

Türkiye . 49 parts In-Stock

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Overview

Experience superior performance and reliability with the FSA4157AL6X multiplexer from Onsemi. Known for their high-quality products, Onsemi delivers cutting-edge solutions that cater to a wide range of applications. This versatile device offers exceptional value, providing customers with seamless switching capabilities and efficient power management. With its compact design and industrial-grade components, the FSA4157AL6X is the perfect choice for your electronic projects. Upgrade to Onsemi and elevate your experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and reducing overall footprint.

Nominal Supply Voltage (Vsup): 4.5 V

The nominal supply voltage of 4.5V makes it compatible with a wide range of applications, providing flexibility in system design.

Power Supplies (V): 3/5

The availability of power supplies at 3V and 5V allows for compatibility with various systems and voltage requirements.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this product is suitable for industrial applications where temperature can vary.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the product reliable and efficient.

Technical Specifications

Multiplexers & Switches FSA4157AL6X attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

70 dB

Nominal On-state Resistance Match:

.06 ohm

Maximum On-state Resistance (Ron):

1.15 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

30 ns

Maximum Switch-on Time:

65 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1 mm

Trade Compliance

FSA4157AL6X Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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