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FSA4157P6

Onsemi

FSA4157P6 by Onsemi

FSA4157P6 by Onsemi is a SPDT switch with 1.15 ohm Ron, 65 ns switch-on time, and 70 dB off-state isolation. It operates at -40 to 85 °C for industrial applications requiring a compact 0.65 mm terminal pitch multiplexer in a small outline package.

Median Price

$0.660

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,891 parts In-Stock

1+ parts

-

100+ parts

$0.647

1k+ parts

$0.537

10k+ parts

$0.479

1,891

-

$0.647

$0.537

$0.479

Verical

USA . 1,650 parts In-Stock

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$0.672

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$0.599

1,650

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$0.672

$0.599

Distributors (In-Stock)

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Digiode

USA . 2,046 parts In-Stock

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$0.504

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2,046

$0.504

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Nova Conductors

Japan . 1,000 parts In-Stock

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$0.542

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$0.542

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Chip Stock

USA . 45,894 parts In-Stock

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Vyrian

USA . 1,600 parts In-Stock

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QIE Inc.

USA . 289 parts In-Stock

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Prism Electronics

USA . 200 parts In-Stock

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Classic Components Corporation

USA . 60 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,718 parts In-Stock

1+ parts

$0.451

100+ parts

$0.440

1k+ parts

$0.437

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-

1,718

$0.451

$0.440

$0.437

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Ampacity Inc.

Singapore . 1,394 parts In-Stock

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$0.451

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$0.451

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Corphita

USA . 1,366 parts In-Stock

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$0.478

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Corohmni

South Africa . 322 parts In-Stock

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$0.531

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322

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Argo Parts USA

USA . 3,254 parts In-Stock

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$0.542

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$0.526

3,254

$0.542

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$0.526

Continental Prestige Electronics

USA . 1,571 parts In-Stock

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$0.542

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$0.531

1,571

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$0.531

Netroflash

USA . 500 parts In-Stock

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$0.542

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$0.515

10k+ parts

$0.504

500

$0.542

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$0.515

$0.504

Component Stockers USA

USA . 1,716 parts In-Stock

1+ parts

$0.550

100+ parts

$0.520

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$0.470

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QUARKTWIN TECHNOLOGY LTD

USA . 17,107 parts In-Stock

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Kulean Microsystems

USA . 7,481 parts In-Stock

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TANS Electronics

Latvia . 5,831 parts In-Stock

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SupplyDigital Components

Austria . 5,414 parts In-Stock

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Metaverse IC Inc.

Canada . 5,045 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 1,950 parts In-Stock

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Supply Digital

USA . 1,445 parts In-Stock

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UHIMA Technologies

Türkiye . 214 parts In-Stock

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Problanco Electronics

Mexico . 149 parts In-Stock

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iodParts Technologies Inc.

India . 120 parts In-Stock

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Overview

Elevate your electronic designs with the FSA4157P6 by Onsemi. As a top-tier manufacturer in the industry, Onsemi delivers quality and reliability in every product. The FSA4157P6 falls under the Multiplexers & Switches category, offering versatile applications for a variety of projects. With a compact package and advanced technology, this switch provides seamless performance and efficiency. Trust Onsemi to bring you the best in innovation and value for all your electronics needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY as the package body material makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable makes it easy to integrate the multiplexer or switch into a circuit board, saving space and increasing efficiency.

Nominal Supply Voltage (Vsup): 4.5 V

The nominal supply voltage of 4.5V is a common and versatile voltage level, making it compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions.

Technology: CMOS

The use of CMOS technology in the product results in low power consumption and high noise immunity, making it efficient and reliable.

Technical Specifications

Multiplexers & Switches FSA4157P6 attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

70 dB

Nominal On-state Resistance Match:

.06 ohm

Maximum On-state Resistance (Ron):

1.15 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

40 ns

Maximum Switch-on Time:

65 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.25 mm

Trade Compliance

FSA4157P6 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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