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FSA4157L6X

Onsemi

FSA4157L6X by Onsemi

FSA4157L6X by Onsemi is a SPDT switch with 6 terminals, operating at -40 to 85°C. It features a max on-state resistance of 1.15 ohm and break-before-make switching at supply voltages ranging from 1.65V to 5.5V. This CMOS technology-based switch is ideal for industrial applications requiring high isolation levels and fast switching times.

Median Price

$0.343

Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

1k+

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Nova Conductors

Japan . 550 parts In-Stock

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Semtec, LLC

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Bristol Electronics

USA . 755 parts In-Stock

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Prism Electronics

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Corohmni

South Africa . 369 parts In-Stock

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Aranea Global

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Continental Prestige Electronics

USA . 2,205 parts In-Stock

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Argo Parts USA

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Aztec Data Supply Inc.

USA . 2,084 parts In-Stock

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Semicontronic

India . 124,589 parts In-Stock

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Overview

Discover the FSA4157L6X by Onsemi, a high-quality multiplexer/switch that offers exceptional value and performance. With Onsemi's reputation for reliability and innovation, this versatile product is perfect for a wide range of applications. Whether you need precise signal routing or efficient power management, the FSA4157L6X delivers with its fast switching times and low on-state resistance. Experience seamless operation and peace of mind knowing you have chosen a trusted brand for your electronic needs. Elevate your projects with the FSA4157L6X from Onsemi today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability for long-term use.

Surface Mount: YES

Allows for easy and efficient installation on a PCB.

Nominal Supply Voltage (Vsup): 4.5 V

Optimal voltage for stable operation of the multiplexer.

Maximum Operating Temperature: 85 °C

Can handle high temperature environments without damage.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Technical Specifications

Multiplexers & Switches FSA4157L6X attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

70 dB

Nominal On-state Resistance Match:

.06 ohm

Maximum On-state Resistance (Ron):

1.15 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8/5

Qualification:

Not Qualified

Maximum Seated Height:

.55 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

4.5 V

Surface Mount:

YES

Maximum Switch-off Time:

30 ns

Maximum Switch-on Time:

60 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Gold/Nickel (Au/Ni)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1 mm

Trade Compliance

FSA4157L6X Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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