Loading...

STD7N52DK3

STMicroelectronics

STD7N52DK3 by STMicroelectronics

STD7N52DK3 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 6.2A, a breakdown voltage of 525V, and operates at up to 150 °C. Ideal for power management in compact electronic devices.

Median Price

$0.786

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TME

Poland . 15 parts In-Stock

1+ parts

$0.260

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$0.260

-

-

-

Pegasus Components GmbH

Germany . 7,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,400

-

-

-

-

Bristol Electronics

USA . 3,070 parts In-Stock

1+ parts

-

100+ parts

$1.313

1k+ parts

$0.735

10k+ parts

$0.693

3,070

-

$1.313

$0.735

$0.693

Dan-Mar Components

USA . 3,070 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,070

-

-

-

-

Vyrian

USA . 2,526 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,526

-

-

-

-

ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

Digiode

USA . 2,275 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,275

-

-

-

-

Anansix

USA . 2,002 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,002

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

590

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,035 parts In-Stock

1+ parts

$0.294

100+ parts

-

1k+ parts

$0.265

10k+ parts

-

2,035

$0.294

-

$0.265

-

Component Stockers USA

USA . 446 parts In-Stock

1+ parts

$0.440

100+ parts

$0.370

1k+ parts

-

10k+ parts

-

446

$0.440

$0.370

-

-

MKK Technologies

India . 770 parts In-Stock

1+ parts

$0.554

100+ parts

-

1k+ parts

-

10k+ parts

-

770

$0.554

-

-

-

DigiPath Technology Company

USA . 770 parts In-Stock

1+ parts

$0.554

100+ parts

-

1k+ parts

-

10k+ parts

-

770

$0.554

-

-

-

AZTECH Wire

Italy . 327 parts In-Stock

1+ parts

$14.980

100+ parts

-

1k+ parts

-

10k+ parts

-

327

$14.980

-

-

-

Metaverse IC Inc.

Canada . 90,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

90,000

-

-

-

-

Perfect Parts

USA . 11,155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,155

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,876 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,876

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 6,666 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,666

-

-

-

-

Alle Elektronik GmbH

Germany . 4,673 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,673

-

-

-

-

Corphita

USA . 3,656 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,656

-

-

-

-

Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Parana Technologies

USA . 521 parts In-Stock

1+ parts

-

100+ parts

$0.352

1k+ parts

-

10k+ parts

-

521

-

$0.352

-

-

Overview

Elevate your designs with the STD7N52DK3 from STMicroelectronics—your go-to solution for efficient power management. Known for their commitment to quality and innovation, STMicroelectronics delivers high-performance N-channel FETs ideal for switching applications. With robust thermal stability and built-in diode capabilities, this versatile component ensures reliability across various sectors, maximizing performance while minimizing energy loss. Unlock new possibilities in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material choice ensures reliability and protection, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, which enhances performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides added protection and reverse current handling, making it versatile for various applications.

Transistor Application: SWITCHING

Optimized for switching purposes, this FET achieves fast switching times, ideal for power management applications.

Surface Mount: YES

Surface mount design allows for compact circuit designs, facilitating space-saving layouts and automated assembly.

Minimum DS Breakdown Voltage: 525 V

High breakdown voltage enhances device durability and makes it suitable for high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape is advantageous for efficient heat dissipation and better PCB space utilization.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and robust connections, enhancing manufacturing efficiency.

Operating Mode: ENHANCEMENT MODE

In enhancement mode, the device offers high efficiency and low power consumption, making it ideal for low-voltage applications.

Maximum Pulsed Drain Current (IDM): 24 A

The capability to handle 24 A pulsed current allows for robust performance in dynamic load conditions.

Avalanche Energy Rating (EAS): 100 mJ

A high avalanche energy rating increases reliability against transient voltage spikes and enhances robustness.

Maximum Drain Current (Abs) (ID): 6.2 A

Supports a maximum continuous current of 6.2 A, making it suitable for various applications requiring substantial current flow.

No. of Terminals: 2

The simple 2-terminal design simplifies integration and PCB routing, making it easier to work with in designs.

Maximum Power Dissipation (Abs): 90 W

High power dissipation capability ensures reliable operation even under heavy load conditions.

Package Style (Meter): SMALL OUTLINE

Small outline package style contributes to space efficiency, making it ideal for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides excellent switching and amplification characteristics, which are essential for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows this FET to function reliably in demanding thermal environments.

Transistor Element Material: SILICON

Silicon as a base material delivers optimal electrical performance, versatility, and a broad range of application compatibility.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and helps prevent corrosion, ensuring long-term reliability of the connections.

Maximum Drain Current (ID): 6 A

Capable of handling up to 6 A of continuous current ensures solid performance across various applications.

Maximum Drain-Source On Resistance: 1.15 ohm

Low on-resistance value minimizes power loss and heat generation during operation, increasing efficiency.

Terminal Position: SINGLE

A single terminal position simplifies the design and mounting process, enabling easier integration into circuits.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures safe thermal handling during soldering processes.

Peak Reflow Temperature °C: 260

A high maximum reflow temperature of 260 °C makes it compatible with modern soldering techniques, ensuring reliable assembly.

Technical Specifications

Power Field Effect Transistors (FET) STD7N52DK3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Avalanche Energy Rating (EAS):

100 mJ

Minimum DS Breakdown Voltage:

525 V

Maximum Drain Current (Abs) (ID):

6.2 A

Maximum Drain Current (ID):

6 A

Maximum Drain-Source On Resistance:

1.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

24 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD7N52DK3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19