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STD70NH02LT4

STMicroelectronics

STD70NH02LT4 by STMicroelectronics

STD70NH02LT4 from STMicroelectronics is a high-performance N-channel FET designed for efficient switching applications. It features a max drain current of 60 A, a breakdown voltage of 24 V, and operates at up to 175 °C. Ideal for power management in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,797 parts In-Stock

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Digiode

USA . 1,012 parts In-Stock

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Anansix

USA . 274 parts In-Stock

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IDEA Electronic Components Group

UK . 1,769 parts In-Stock

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$1.080

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-

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$0.972

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1,769

$1.080

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$0.972

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MKK Technologies

India . 945 parts In-Stock

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$2.031

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945

$2.031

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DigiPath Technology Company

USA . 945 parts In-Stock

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$2.031

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945

$2.031

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AZTECH Wire

Italy . 486 parts In-Stock

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$8.610

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486

$8.610

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Component Stockers USA

USA . 423 parts In-Stock

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$99.990

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423

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Kepictronics

USA . 20,000 parts In-Stock

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Corphita

USA . 2,692 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,242 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 33 parts In-Stock

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$1.291

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$1.291

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Overview

Unlock unparalleled performance with the STD70NH02LT4 from STMicroelectronics, a trusted leader in power solutions. This robust N-Channel FET is designed for efficient switching applications, providing exceptional durability and reliability under demanding conditions. With its compact design and built-in diode, it ensures seamless integration into your projects, maximizing efficiency and reducing energy costs. Elevate your innovations with ST's renowned quality and experience the advantage of cutting-edge technology that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This lightweight and durable thermal-resistant material ensures longevity and reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer lower on-resistance and higher efficiency, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier integration and protection against back EMF, enhancing circuit reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle high-speed operations efficiently.

Surface Mount: YES

Surface-mount technology (SMT) allows for a compact design, saving space on PCB while simplifying assembly processes.

Minimum DS Breakdown Voltage: 24 V

A minimum breakdown voltage of 24 V provides strong protection against over-voltage conditions, ensuring circuit safety.

Package Shape: RECTANGULAR

The rectangular shape is ideal for systematic layout on PCBs, providing consistent mounting and high-density configurations.

Terminal Form: GULL WING

Gull wing terminals provide better soldering connections and allow for reliable electrical performance in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode enhances performance by allowing the transistor to remain off until a specified gate voltage is applied, preventing power waste.

Maximum Pulsed Drain Current (IDM): 240 A

The ability to handle pulsed currents up to 240 A ensures excellent performance in demanding applications.

Avalanche Energy Rating (EAS): 360 mJ

This rating indicates robust tolerance to transient events, making this FET suitable for harsh operating environments.

Maximum Drain Current (Abs) (ID): 60 A

A maximum drain current of 60 A allows for high power applications without compromising performance.

No. of Terminals: 2

With only 2 terminals, this FET design simplifies the circuit layout, reducing complexity and space requirements.

Maximum Power Dissipation (Abs): 70 W

A high power dissipation capability of 70 W allows the FET to perform efficiently without overheating in demanding applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style optimizes space for compact circuit designs, making it suitable for various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, enhancing overall circuit efficiency.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can perform reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon as the element material offers excellent electrical properties and reliability for high-performance applications.

Terminal Finish: MATTE TIN

Matte tin offers good corrosion resistance and solderability, ensuring reliable connections and long-term performance.

Maximum Drain Current (ID): 60 A

The ability to sustain a drain current of 60 A allows it to manage significant loads, essential for power management.

Maximum Drain-Source On Resistance: 0.008 ohm

A low on-resistance figure of 0.008 ohms minimizes power loss and heat generation, making it efficient for high-current applications.

Terminal Position: SINGLE

A single terminal position simplifies the layout and design, easing the integration into various circuits.

Case Connection: DRAIN

A drain connection type ensures consistent performance and is critical for effective power management within the circuit.

Technical Specifications

Power Field Effect Transistors (FET) STD70NH02LT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Avalanche Energy Rating (EAS):

360 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD70NH02LT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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