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STD75N3LLH6

STMicroelectronics

STD75N3LLH6 by STMicroelectronics

STD75N3LLH6 by STMicroelectronics is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 75A Drain Current. It is used for SWITCHING applications, operates in ENHANCEMENT MODE, and has a max power dissipation of 60W. Ideal for high-power switching circuits requiring efficient performance.

Median Price

$1.219

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Dan-Mar Components

USA . 55,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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55,000

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-

-

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Bristol Electronics

USA . 52,500 parts In-Stock

1+ parts

-

100+ parts

$1.219

1k+ parts

$0.682

10k+ parts

$0.643

52,500

-

$1.219

$0.682

$0.643

Anansix

USA . 2,354 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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2,354

-

-

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Vyrian

USA . 2,123 parts In-Stock

1+ parts

-

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2,123

-

-

-

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Euro-Tech

UK . 1,700 parts In-Stock

1+ parts

-

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1,700

-

-

-

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Digiode

USA . 1,128 parts In-Stock

1+ parts

-

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1,128

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-

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Nova Conductors

Japan . 32 parts In-Stock

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-

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32

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 125 parts In-Stock

1+ parts

$0.358

100+ parts

-

1k+ parts

-

10k+ parts

-

125

$0.358

-

-

-

Aztec Data Supply Inc.

USA . 12,948 parts In-Stock

1+ parts

$1.070

100+ parts

-

1k+ parts

-

10k+ parts

-

12,948

$1.070

-

-

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IDEA Electronic Components Group

UK . 1,230 parts In-Stock

1+ parts

$1.286

100+ parts

-

1k+ parts

$1.158

10k+ parts

-

1,230

$1.286

-

$1.158

-

MKK Technologies

India . 1,337 parts In-Stock

1+ parts

$2.419

100+ parts

-

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-

10k+ parts

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1,337

$2.419

-

-

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DigiPath Technology Company

USA . 1,337 parts In-Stock

1+ parts

$2.419

100+ parts

-

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-

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1,337

$2.419

-

-

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AZTECH Wire

Italy . 665 parts In-Stock

1+ parts

$14.434

100+ parts

-

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665

$14.434

-

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Semicontronic

India . 1,198 parts In-Stock

1+ parts

$57.050

100+ parts

$55.624

1k+ parts

$55.338

10k+ parts

-

1,198

$57.050

$55.624

$55.338

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Ampacity Inc.

Singapore . 189 parts In-Stock

1+ parts

$61.050

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189

$61.050

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Lixinc

USA . 11,807 parts In-Stock

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11,807

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Alle Elektronik GmbH

Germany . 3,765 parts In-Stock

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3,765

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Corphita

USA . 2,813 parts In-Stock

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2,813

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A-Z Elektronik GmbH

Germany . 2,565 parts In-Stock

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2,565

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Argo Parts USA

USA . 2,281 parts In-Stock

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2,281

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Continental Prestige Electronics

USA . 2,006 parts In-Stock

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2,006

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Perfect Parts

USA . 916 parts In-Stock

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916

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Kepictronics

USA . 630 parts In-Stock

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630

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Parana Technologies

USA . 121 parts In-Stock

1+ parts

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$1.538

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121

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$1.538

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Aranea Global

USA . 50 parts In-Stock

1+ parts

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50

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Overview

Unlock the power of innovation with the STD75N3LLH6 from STMicroelectronics. Designed with precision and expertise, this N-CHANNEL Power FET is a game-changer in the realm of switching applications. With a maximum drain current of 75A and a low on-resistance, this transistor delivers unmatched performance and reliability. Whether you're looking to optimize efficiency or enhance functionality, this product offers the value and benefits you need to stay ahead in today's competitive market. Elevate your projects with the STD75N3LLH6 and experience the difference that superior quality and advanced technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, ensuring the longevity of the product.

Polarity or Channel Type: N-CHANNEL

Enhances efficiency in switching applications and allows for better control over current flow.

Transistor Application: SWITCHING

Optimized for efficient switching operations, making it suitable for a wide range of applications.

Minimum DS Breakdown Voltage: 30 V

Offers reliable performance in handling high voltage applications.

Operating Mode: ENHANCEMENT MODE

Facilitates easier control over the transistor's operation, allowing for enhanced efficiency.

Maximum Pulsed Drain Current (IDM): 300 A

Supports high current applications, making it suitable for demanding tasks.

Maximum Power Dissipation (Abs): 60 W

Able to handle high power levels, ensuring stable and reliable performance under various conditions.

Maximum Operating Temperature: 175 °C

Withstands high temperature environments, making it suitable for a wide range of operational conditions.

Maximum Drain-Source On Resistance: 0.008 ohm

Low resistance allows for efficient current flow and reduced power loss.

Technical Specifications

Power Field Effect Transistors (FET) STD75N3LLH6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

300 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD75N3LLH6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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