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STD70NH02L-1

STMicroelectronics

STD70NH02L-1 by STMicroelectronics

STD70NH02L-1 from STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 60 A, a breakdown voltage of 24 V, and operates at up to 175 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,147 parts In-Stock

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Digiode

USA . 2,381 parts In-Stock

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2,381

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Anansix

USA . 1,794 parts In-Stock

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1,794

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 161 parts In-Stock

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$0.490

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-

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$0.441

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161

$0.490

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$0.441

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MKK Technologies

India . 204 parts In-Stock

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$0.922

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204

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DigiPath Technology Company

USA . 204 parts In-Stock

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$0.922

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204

$0.922

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A-Z Elektronik GmbH

Germany . 5,258 parts In-Stock

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Corphita

USA . 2,217 parts In-Stock

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Parana Technologies

USA . 606 parts In-Stock

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$0.586

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Metaverse IC Inc.

Canada . 425 parts In-Stock

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Overview

Elevate your designs with the STD70NH02L-1 from STMicroelectronics, a trusted leader in high-performance power solutions. This N-channel FET delivers unparalleled efficiency and reliability, making it ideal for demanding switching applications. With exceptional thermal management and robust capabilities, it ensures your projects run smoothly under pressure. Experience the perfect blend of quality and innovation that only STMicroelectronics can provide, empowering you to push boundaries and achieve remarkable results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable housing, enhancing the overall reliability of the FET in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them a preferred choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides additional protection against back EMF, increasing reliability in switching applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET can handle rapid on/off states, making it ideal for power management in electronic devices.

Minimum DS Breakdown Voltage: 24 V

With a minimum breakdown voltage of 24V, this FET is suitable for a wide range of applications, ensuring safe operation under various conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on circuit boards and provides ease of integration into existing designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal design provides strong mechanical connections and is ideal for applications requiring robust mounting in challenging environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides high efficiency and decreased power consumption, making it a great choice for battery-operated devices.

Maximum Pulsed Drain Current (IDM): 240 A

The high pulsed drain current capability allows the FET to handle high transient loads, perfect for demanding applications.

Avalanche Energy Rating (EAS): 360 mJ

With a high avalanche energy rating, this component can withstand voltage spikes and protect circuit integrity, enhancing durability.

Maximum Drain Current (Abs): 60 A

The ability to handle a maximum drain current of 60A makes this FET effective for high-power applications, improving performance even under stress.

No. of Terminals: 3

Three terminals provide a versatile layout for various configurations, facilitating easier circuit design and connections.

Maximum Power Dissipation (Abs): 70 W

With a maximum power dissipation of 70W, this FET can efficiently manage thermal energy, vital for reliable operation in high-performance applications.

Package Style (Meter): IN-LINE

The in-line package style is compact and space-efficient, suitable for modern electronic applications where size constraints are critical.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing MOS technology provides high speed and low power loss, making it ideal for high-frequency switching applications.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature of 175 °C allows for use in extreme conditions, providing flexibility in diverse environmental applications.

Transistor Element Material: SILICON

Silicon as the transistor material ensures compatibility with existing semiconductor technology and enhances performance, reliability, and longevity.

Terminal Finish: TIN

The tin terminal finish offers good solderability and corrosion resistance, ensuring reliable connections in the assembly process.

Maximum Drain Current (ID): 60 A

This FET supports a maximum drain current of 60A, ensuring it can effectively manage high current loads without overheating.

Maximum Drain-Source On Resistance: 0.008 ohm

With an exceptionally low on-resistance, the FET minimizes energy losses during operation, enhancing overall efficiency in power applications.

Terminal Position: SINGLE

A single terminal position simplifies circuit design while maintaining a compact footprint, making it easier to integrate into existing systems.

Case Connection: DRAIN

The case connection to the drain ensures optimal thermal performance and helps in effective heat dissipation during operation.

Technical Specifications

Power Field Effect Transistors (FET) STD70NH02L-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Avalanche Energy Rating (EAS):

360 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

24 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.008 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD70NH02L-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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