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STD70N03L-1

STMicroelectronics

STD70N03L-1 by STMicroelectronics

STD70N03L-1 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 70 A, a breakdown voltage of 30 V, and operates at up to 175 °C. Ideal for high-power circuits, it ensures reliable performance with low on-resistance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,733 parts In-Stock

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Anansix

USA . 1,629 parts In-Stock

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Digiode

USA . 1,436 parts In-Stock

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1,436

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IDEA Electronic Components Group

UK . 1,659 parts In-Stock

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$1.468

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$1.321

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MKK Technologies

India . 97 parts In-Stock

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$2.761

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97

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DigiPath Technology Company

USA . 97 parts In-Stock

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$2.761

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97

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AZTECH Wire

Italy . 634 parts In-Stock

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$9.870

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634

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 13,723 parts In-Stock

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Alle Elektronik GmbH

Germany . 2,000 parts In-Stock

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2,000

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Corphita

USA . 995 parts In-Stock

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995

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Parana Technologies

USA . 782 parts In-Stock

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$1.756

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Overview

Elevate your projects with the STD70N03L-1 from STMicroelectronics, a trusted leader in semiconductor technology. This high-performance N-channel power FET is perfect for efficient switching applications, offering remarkable reliability and durability. With its low on-resistance and robust design, it ensures superior energy efficiency and thermal management, making it ideal for automotive, industrial, and consumer electronics. Experience unmatched quality and performance that drives your innovations forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides excellent durability and thermal properties, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs are known for higher electron mobility, allowing faster switching speeds and better performance in applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The inclusion of a built-in diode enhances circuit protection and simplifies design, allowing for efficient switching applications.

Transistor Application: SWITCHING

Designed specifically for switching, this FET excels in power conversion applications, contributing to improved efficiency.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V ensures robustness against voltage spikes in applications, enhancing reliability.

Package Shape: RECTANGULAR

The rectangular package shape helps with effective space utilization on PCBs, making it versatile for various designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals facilitate reliable connections and ease of assembly in various equipment, providing stability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for minimal power loss and improved efficiency, making it suitable for low-power applications.

Maximum Pulsed Drain Current (IDM): 280 A

A high pulsed drain current capacity enables this FET to handle demanding transient loads with ease, enhancing performance.

Avalanche Energy Rating (EAS): 300 mJ

With a high avalanche energy rating, this FET offers protection against transient voltage spikes, improving durability.

Maximum Drain Current (Abs) (ID): 70 A

The ability to handle 70 A ensures robust performance in high current applications, making it a reliable choice.

No. of Terminals: 3

Having three terminals simplifies connections and provides flexibility for different circuit configurations.

Maximum Power Dissipation (Abs): 70 W

The capability to dissipate 70 W ensures that it can handle significant power without overheating, ensuring safety.

Package Style (Meter): IN-LINE

An in-line packaging style is convenient for mounting and integration into circuits, making it user-friendly.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high efficiency and fast switching capabilities, making this FET suitable for modern applications.

Maximum Operating Temperature: 175 °C

Withstands high temperatures up to 175 °C, making it suitable for high-temperature environments and applications.

Transistor Element Material: SILICON

Silicon material offers excellent electrical characteristics and reliability, key for efficient power management.

Terminal Finish: TIN

Tin finishing provides good solderability and corrosion resistance, enhancing the lifespan of the component.

Maximum Drain-Source On Resistance: 0.013 ohm

A low on-resistance minimizes power loss during operation, improving overall efficiency and thermal performance.

Terminal Position: SINGLE

Single terminal position is beneficial for space-constrained designs, ensuring easy integration into compact circuits.

Case Connection: DRAIN

Direct connection to the drain enables efficient control of the device in circuit designs, optimizing performance.

Technical Specifications

Power Field Effect Transistors (FET) STD70N03L-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

LOW THRESHOLD

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

70 A

Maximum Drain Current (ID):

70 A

Maximum Drain-Source On Resistance:

.013 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

280 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD70N03L-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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