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ST10F273M-4Q3

STMicroelectronics

ST10F273M-4Q3 by STMicroelectronics

ST10F273M-4Q3 microcontroller from STMicroelectronics features a 16-bit CPU with a max clock frequency of 64 MHz, supporting up to 144 terminals. It operates within -40 °C to 125°C and includes peripherals like PWM and ADC channels. Ideal for automotive applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,688 parts In-Stock

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5,688

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Digiode

USA . 3,933 parts In-Stock

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3,933

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Anansix

USA . 1,351 parts In-Stock

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1,351

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Distributors (Availability)

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AZTECH Wire

Italy . 381 parts In-Stock

1+ parts

$9.470

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381

$9.470

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IDEA Electronic Components Group

UK . 1,875 parts In-Stock

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$47.319

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$42.587

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1,875

$47.319

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$42.587

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Microchip USA

USA . 994 parts In-Stock

1+ parts

$56.268

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994

$56.268

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MKK Technologies

India . 1,641 parts In-Stock

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$88.981

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1,641

$88.981

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DigiPath Technology Company

USA . 1,641 parts In-Stock

1+ parts

$88.981

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1,641

$88.981

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Corphita

USA . 1,788 parts In-Stock

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1,788

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Parana Technologies

USA . 1,701 parts In-Stock

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$56.577

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1,701

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$56.577

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Overview

Elevate your designs with the ST10F273M-4Q3 microcontroller from STMicroelectronics, a trusted leader in semiconductor innovation. Renowned for high-quality and reliability, this versatile MCU excels in automotive applications, offering robust performance under diverse conditions. With advanced connectivity options and integrated peripherals, it streamlines your development process, ensuring faster time-to-market and enhanced product longevity. Choose STMicroelectronics for unparalleled quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, this material enhances reliability in various operating conditions.

Surface Mount: YES

Allows for compact designs and efficient space utilization in modern electronics.

Maximum Supply Voltage: 5.5 V

Provides a wide voltage range, making it compatible with many applications.

Address Bus Width: 24

Enables addressing a larger memory space, ideal for complex applications.

Package Shape: SQUARE

Facilitates easier integration into PCB layouts.

Bit Size: 16

Offers a good balance between performance and power consumption for various applications.

Power Supplies (V): 5

Standard voltage supply, simplifying the design and integration process.

No. of Terminals: 144

Provides numerous I/O options, enhancing the versatility of the microcontroller.

Package Style (Meter): FLATPACK

Enables flat mounting on PCBs, promoting a streamlined design.

Minimum Supply Voltage: 4.5 V

Allows for low-voltage operation, helping to extend battery life in portable applications.

Maximum Operating Temperature: 125 °C

Suitable for high-temperature environments, making it robust for automotive and industrial applications.

CPU Family: ST10

Reliable performance driven by established architecture, beneficial for embedded systems.

Minimum Operating Temperature: -40 °C

Ensures functionality in extreme cold conditions, critical for automotive applications.

Terminal Finish: MATTE TIN

Improves solderability and combats corrosion, enhancing longevity.

ADC Channels: YES

Facilitates analog signal processing, making it versatile for various applications.

Terminal Position: QUAD

Allows for efficient routing on PCB, reducing design complexity.

ROM Words: 131072

Provides ample onboard memory for storing program code and data.

Maximum Seated Height: 4.07 mm

Low-profile design helps in space-constrained applications.

Width: 28 mm

Standard width that fits well in many electronic device designs.

External Data Bus Width: 16

Allows efficient data handling and communications with peripherals.

Peripherals: PWM(8), RTC, TIMER(5), WDT

Rich peripheral set enhances functionality for numerous applications.

Maximum Clock Frequency: 64 MHz

High performance for demanding applications while maintaining power efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

Compatible with modern PCB assembly processes, ensuring reliability post-manufacturing.

Peak Reflow Temperature °C: 245

High tolerance for manufacturing processes, reducing the risk of thermal damage.

Length: 28 mm

Standard length enhances compatibility with existing PCB designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive standards, ensuring reliability under challenging conditions.

Peripheral IC Type: MICROCONTROLLER

Specialized for control-oriented applications, providing targeted functionality.

RAM Bytes: 36864

Generous RAM for efficient processing and performance in applications.

Technology: CMOS

Offers low power consumption and high integration capabilities.

Terminal Form: GULL WING

Enables easy soldering and reliable connections on PCBs.

Analog To Digital Converters: 24-Ch 10-Bit

Facilitates high-resolution data acquisition from analog signals.

Nominal Supply Voltage: 5 V

Standardized operating voltage simplifies system design.

PWM Channels: YES

Allows for efficient control of motors and other actuators in embedded systems.

Connectivity: ASC(2), CAN(2), I2C, SSC(2)

Versatile communication options enhance integration with various components.

ROM Programmability: FLASH

Easy upgradability and reprogramming make it cost-effective for developers.

Terminal Pitch: 0.65 mm

Fine pitch design allows for densely packed electronic designs.

Moisture Sensitivity Level (MSL): 3

Reasonable MSL ensures reliability during board assembly and usage.

Speed: 64 rpm

Adequate speed for various control applications ensuring smooth operation.

On Chip Program ROM Width: 32

Allows for efficient data manipulation and improves performance capabilities.

No. of I/O Lines: 111

High number of I/O lines increases flexibility in interfacing with other devices.

Technical Specifications

Microcontrollers ST10F273M-4Q3 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

CPU Family:

ST10

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

111

No. of Terminals:

144

On Chip Program ROM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

36864

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

4.07 mm

Speed:

64 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

28 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC(2), CAN(2), I2C, SSC(2)

Peripherals:

PWM(8), RTC, TIMER(5), WDT

Analog To Digital Convertors:

24-Ch 10-Bit

Trade Compliance

ST10F273M-4Q3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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