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ST10F269DIETR

STMicroelectronics

ST10F269DIETR by STMicroelectronics

ST10F269DIETR microcontroller from STMicroelectronics features a 16-bit architecture, operates at a max clock frequency of 64 MHz, and supports up to 16 ADC channels. With a supply voltage range of 4.5-5.5 V, it's ideal for automotive applications requiring robust performance in extreme temperatures (-40 °C to 125°C). Its extensive I/O lines (111) and integrated peripherals like PWM and RTC enhance versatility in embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,015 parts In-Stock

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Vyrian

USA . 2,644 parts In-Stock

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Anansix

USA . 877 parts In-Stock

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AZTECH Wire

Italy . 1,106 parts In-Stock

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$21.270

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Microchip USA

USA . 1,149 parts In-Stock

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$25.905

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$25.905

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IDEA Electronic Components Group

UK . 2,277 parts In-Stock

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$64.992

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$58.493

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Component Stockers USA

USA . 310 parts In-Stock

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$99.990

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310

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MKK Technologies

India . 446 parts In-Stock

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$122.214

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DigiPath Technology Company

USA . 446 parts In-Stock

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$122.214

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QUARKTWIN TECHNOLOGY LTD

USA . 27,530 parts In-Stock

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Corphita

USA . 3,337 parts In-Stock

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Parana Technologies

USA . 1,279 parts In-Stock

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$77.708

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Overview

Unlock the potential of your next project with the ST10F269DIETR microcontroller from STMicroelectronics! Renowned for their commitment to quality and innovation, STMicroelectronics delivers exceptional performance in rugged environments. This versatile microcontroller is ideal for automotive applications, featuring robust connectivity options and efficient processing capabilities. Elevate your designs with reliability and precision, all while enjoying the benefits of proven technology!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact design and efficient use of PCB space, making this microcontroller suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a wide range of power supply options, making it versatile for different applications.

Address Bus Width: 24

With a 24-bit address bus width, this microcontroller can effectively manage larger memory capacities, enhancing its performance in complex applications.

Package Shape: RECTANGULAR

The rectangular package shape is suitable for efficient layout in various electronic designs, facilitating easier integration into existing systems.

Bit Size: 16

Being a 16-bit microcontroller, it strikes a balance between processing power and resource efficiency, suitable for a variety of control applications.

Package Style (Meter): UNCASED CHIP

An uncased chip design allows for greater flexibility in custom packaging and integration options, catering to specialized requirements.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V allows operation in environments with varying supply conditions, making it reliable in less stable power situations.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C enables this microcontroller to perform reliably in harsh environments, such as automotive and industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for extreme conditions, ensuring consistent performance in demanding environments.

ADC Channels: YES

The presence of ADC channels enhances the microcontroller's ability to interface with analog sensors, making it ideal for applications requiring mixed-signal processing.

Terminal Position: UPPER

Upper terminal positioning facilitates ease of access and connections on the PCB, simplifying assembly and maintenance.

ROM Words: 262144

With 262,144 ROM words, the microcontroller offers substantial program storage, enabling complex applications and rich functionality.

External Data Bus Width: 16

A 16-bit external data bus width enhances data throughput with peripheral devices, improving overall system performance.

Peripherals: PWM(4), RTC, TIMER(2), WDT

A rich set of peripherals, including multiple PWM channels and timers, make it suitable for real-time control applications in robotics and automation.

Maximum Clock Frequency: 64 MHz

Running at a maximum clock frequency of 64 MHz allows for high-speed processing, boosting performance for demanding applications.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, it meets strict temperature and reliability standards, making it suitable for use in vehicles.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates processing power and peripherals in one chip, simplifying designs and reducing component count.

RAM Bytes: 12288

With 12,288 bytes of RAM, this microcontroller can handle complex calculations and data processing tasks effectively.

Technology: CMOS

Using CMOS technology offers low power consumption and high noise immunity, extending battery life in portable applications.

Terminal Form: NO LEAD

No lead design minimizes environmental impact while providing a robust and reliable connection in critical applications.

Analog To Digital Converters: 16-Ch 10-Bit

The 16-channel, 10-bit ADC enables accurate and simultaneous data acquisition from multiple sensors, ideal for complex monitoring systems.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V is standard in many electronics, ensuring widespread compatibility with other components.

PWM Channels: YES

Support for PWM channels provides versatility in controlling motors and lighting, enhancing the microcontroller's usability in various applications.

Connectivity: ASC, CAN(2), SSC

Multiple connectivity options including CAN make it ideal for networking, especially in automotive and industrial systems.

ROM Programmability: FLASH

Flash programmability allows for easy updates and flexibility in application development, making it suitable for iterative design processes.

Speed: 32 rpm

Designed to function at a speed of 32 rpm, the microcontroller can efficiently manage slow-moving applications and processes.

On Chip Program ROM Width: 8

An 8-bit program ROM width provides adequate instruction to optimize operations while maintaining efficient use of resources.

No. of I/O Lines: 111

With 111 I/O lines, the microcontroller offers extensive interfacing capabilities, allowing for complex systems with multiple input and output devices.

Technical Specifications

Microcontrollers ST10F269DIETR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

16

Maximum Clock Frequency:

64 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

R-XUUC-N

No. of I/O Lines:

111

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

DIE

Package Shape:

Package Style (Meter):

UNCASED CHIP

Qualification:

Not Qualified

RAM Bytes:

12288

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

32 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

UPPER

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ASC, CAN(2), SSC

Peripherals:

PWM(4), RTC, TIMER(2), WDT

Analog To Digital Convertors:

16-Ch 10-Bit

Trade Compliance

ST10F269DIETR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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