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PSD835G2V-12UI

STMicroelectronics

PSD835G2V-12UI by STMicroelectronics

PSD835G2V-12UI by STMicroelectronics is a versatile parallel I/O port with 52 I/O lines and operates at a nominal voltage of 3.3 V. It features a compact flatpack design, ideal for industrial applications requiring reliable performance in extreme temperatures (-40 °C to 85°C). With a max access time of just 120 ns, it ensures efficient data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,432 parts In-Stock

1+ parts

-

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6,432

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Anansix

USA . 2,326 parts In-Stock

1+ parts

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2,326

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Digiode

USA . 1,713 parts In-Stock

1+ parts

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1,713

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 164 parts In-Stock

1+ parts

$10.440

100+ parts

-

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-

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-

164

$10.440

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Microchip USA

USA . 150 parts In-Stock

1+ parts

$25.137

100+ parts

-

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150

$25.137

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Corohmni

South Africa . 707 parts In-Stock

1+ parts

$60.632

100+ parts

-

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707

$60.632

-

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IDEA Electronic Components Group

UK . 1,581 parts In-Stock

1+ parts

$68.601

100+ parts

-

1k+ parts

$61.741

10k+ parts

-

1,581

$68.601

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$61.741

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Component Stockers USA

USA . 702 parts In-Stock

1+ parts

$99.990

100+ parts

-

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702

$99.990

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MKK Technologies

India . 629 parts In-Stock

1+ parts

$128.999

100+ parts

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629

$128.999

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DigiPath Technology Company

USA . 629 parts In-Stock

1+ parts

$128.999

100+ parts

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629

$128.999

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QUARKTWIN TECHNOLOGY LTD

USA . 7,996 parts In-Stock

1+ parts

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7,996

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Corphita

USA . 4,549 parts In-Stock

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4,549

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Parana Technologies

USA . 191 parts In-Stock

1+ parts

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$82.023

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191

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$82.023

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Overview

Unlock exceptional performance with the PSD835G2V-12UI from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality parallel I/O port is designed for reliability in industrial applications, ensuring robust operation even in extreme temperatures. With its compact design and superior build, it maximizes efficiency while minimizing energy consumption—perfect for your next project. Experience unmatched value, enhanced productivity, and peace of mind with ST's trusted excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material contributes to the durability and robustness of the component, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for a compact design and easy integration into modern PCB layouts, enhancing the efficiency of assembly processes.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of devices, allowing for versatile use in different electronic systems.

Package Shape: SQUARE

The square package shape facilitates efficient use of PCB space, enabling better layout designs.

Power Supplies (V): 3.3

With a standard operating voltage of 3.3 V, this part can integrate easily with common digital circuits, providing flexibility in design.

No. of Terminals: 80

The high number of terminals (80) allows for multiple connections, making it useful for complex applications requiring extensive I/O capabilities.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The flatpack, thin profile, and fine pitch design contribute to high-density mounting and efficient space usage on the PCB.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V provides flexibility in power supply options, suitable for various applications requiring lower voltages.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this component is reliable for industrial applications, ensuring performance in elevated temperature environments.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures functionality in harsh and extreme climate conditions, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish enhances corrosion resistance and improves the reliability and longevity of connections.

Ultraviolet Erasable: N

Not being ultraviolet erasable is beneficial for applications where data integrity is paramount and reprogrammability is not needed.

Terminal Position: QUAD

The quad terminal position allows for efficient signal routing and better performance in multi-channel applications.

No. of Ports: 7

Having 7 ports increases its versatility, allowing multiple parallel connections for enhanced data transfer capabilities.

Maximum Seated Height: 1.2 mm

A maximum seated height of 1.2 mm helps in achieving a low-profile design, critical in space-constrained applications.

Width: 12 mm

The 12 mm width aids in fitting within common PCB layouts without requiring additional modifications.

Length: 12 mm

The 12 mm length complements standard design practices, allowing easy integration into existing systems.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates that the product is designed for reliable operation in demanding conditions, suitable for industrial applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, this component supports a wide range of applications, making it versatile and adaptable.

ROM Bits Size: 4456448 Bits

The significant ROM bit size indicates ample memory space, facilitating complex data handling and storage requirements.

Technology: CMOS

Using CMOS technology ensures low power consumption and high speed, making this product efficient for modern electronic applications.

Terminal Form: GULL WING

The gull wing terminal form enhances soldering capabilities, ensuring reliable connections during the assembly process.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V is standard in many applications, offering compatibility across various devices.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density mounting, suitable for compact PCB designs.

Maximum Standby Current: 0.0001 Amp

The low maximum standby current of 0.0001 Amp contributes to energy efficiency, making it ideal for power-sensitive applications.

Maximum Access Time: 0.00000012 ns

An exceptionally low maximum access time of 0.00000012 ns ensures fast data transfer rates, enhancing overall system performance.

No. of I/O Lines: 52

With 52 I/O lines, this product supports extensive parallel communication capabilities, making it ideal for high-performance applications.

Technical Specifications

Parallel I/O Ports PSD835G2V-12UI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000012 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

No. of I/O Lines:

52

No. of Ports:

7

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

4456448 Bits

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

12 mm

Peripheral IC Type:

Trade Compliance

PSD835G2V-12UI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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