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PSD835G2-90UI

STMicroelectronics

PSD835G2-90UI by STMicroelectronics

PSD835G2-90UI by STMicroelectronics is a versatile parallel I/O port with 52 I/O lines, operating b/w 4.5V and 5.5V. It features a compact flatpack design and operates in extreme temperatures from -40 °C to 85°C, ideal for industrial applications. With a max access time of just 90 ns, it ensures rapid data processing.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,248 parts In-Stock

1+ parts

-

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3,248

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Anansix

USA . 1,847 parts In-Stock

1+ parts

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-

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1,847

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Digiode

USA . 440 parts In-Stock

1+ parts

-

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-

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440

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 773 parts In-Stock

1+ parts

$12.970

100+ parts

-

1k+ parts

-

10k+ parts

-

773

$12.970

-

-

-

IDEA Electronic Components Group

UK . 1,831 parts In-Stock

1+ parts

$14.530

100+ parts

-

1k+ parts

$13.077

10k+ parts

-

1,831

$14.530

-

$13.077

-

MKK Technologies

India . 1,803 parts In-Stock

1+ parts

$27.322

100+ parts

-

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1,803

$27.322

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DigiPath Technology Company

USA . 1,803 parts In-Stock

1+ parts

$27.322

100+ parts

-

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1,803

$27.322

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-

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Microchip USA

USA . 101 parts In-Stock

1+ parts

$31.498

100+ parts

-

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101

$31.498

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Corohmni

South Africa . 995 parts In-Stock

1+ parts

$72.085

100+ parts

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995

$72.085

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Parana Technologies

USA . 1,706 parts In-Stock

1+ parts

-

100+ parts

$17.372

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1,706

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$17.372

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Corphita

USA . 910 parts In-Stock

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910

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Overview

Unlock unparalleled performance and reliability with the PSD835G2-90UI from STMicroelectronics, a leader in innovative technology. Designed for versatility in industrial applications, this advanced parallel I/O port enhances your device’s efficiency while ensuring robust operation under extreme conditions. Experience the superior quality that comes with ST's legacy, empowering your projects with seamless integration and exceptional durability. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction provides durability and resistance to environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Utilizing surface mount technology allows for a compact design and efficient use of PCB space, enabling higher-density circuit layouts.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a range of power supply voltages, enhancing versatility in applications.

Package Shape: SQUARE

The square shape facilitates efficient use of PCB real estate, optimizing component placement and layout.

Power Supplies (V): 5

The standard 5V power supply is widely available, simplifying integration into existing systems.

No. of Terminals: 80

With 80 terminals, this device supports significant connectivity and expands design possibilities for complex applications.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

A flatpack, thin profile design with fine pitch enables efficient packing on PCBs, catering to modern design requirements.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage expands usability in battery-operated devices, enhancing portable application options.

Maximum Operating Temperature: 85 °C

A high operating temperature rating means reliability in demanding environments, making the device suitable for industrial use.

Minimum Operating Temperature: -40 °C

This wide temperature range ensures functionality in extreme conditions, ideal for outdoor or harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish improves corrosion resistance and ensures reliable electrical connections, enhancing durability.

Ultraviolet Erasable: N

Not being ultraviolet erasable adds to the product's reliability and stability in fixed applications, ensuring consistent performance.

Terminal Position: QUAD

The quad terminal position enhances the routing options and ease of PCB layout, improving overall design efficiency.

No. of Ports: 7

Seven ports provide significant interface options, accommodating various peripheral devices for flexible system design.

Maximum Seated Height: 1.2 mm

A low seated height supports high-density designs and maintains compactness in electronic assemblies.

Width: 12 mm

Compact width of 12 mm facilitates integration into tight spaces, benefiting modern design constraints.

Length: 12 mm

The short length contributes to a smaller footprint on PCBs, allowing for more efficient design layouts.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this device is engineered for reliability and performance in challenging conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, this IC is flexible across various applications, simplifying component selection.

ROM Bits Size: 4456448 Bits

The substantial ROM bits size enables complex data operations, making this product suitable for demanding applications.

Technology: CMOS

CMOS technology provides low power consumption and high efficiency, making it ideal for power-sensitive designs.

Terminal Form: GULL WING

Gull wing terminals facilitate automated assembly processes, reducing production time and costs.

Nominal Supply Voltage: 5 V

Operating at a nominal 5V enhances compatibility with other standard components, streamlining integration.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high density of connections, accommodating compact electronic designs.

Maximum Standby Current: 0.0002 Amp

A low maximum standby current contributes to energy efficiency, which is especially advantageous in battery-powered applications.

Maximum Access Time: 0.00000009 ns

Rapid access time ensures high performance and quick response in data processing, crucial for real-time applications.

No. of I/O Lines: 52

With 52 I/O lines, this product provides ample connectivity for diverse applications, accommodating complex interfacing needs.

Technical Specifications

Parallel I/O Ports PSD835G2-90UI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

No. of I/O Lines:

52

No. of Ports:

7

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

4456448 Bits

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

12 mm

Peripheral IC Type:

Trade Compliance

PSD835G2-90UI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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