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PSD835G2-70U

STMicroelectronics

PSD835G2-70U by STMicroelectronics

PSD835G2-70U by STMicroelectronics is a versatile parallel I/O port with 52 I/O lines and operates at a nominal voltage of 5V. It features a compact flatpack design, ideal for space-constrained applications. With a max operating temp of 70 °C, it's perfect for commercial use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,597 parts In-Stock

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7,597

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Digiode

USA . 4,652 parts In-Stock

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4,652

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Anansix

USA . 2,298 parts In-Stock

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2,298

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Benley Electronics

USA . 4 parts In-Stock

1+ parts

$1.750

100+ parts

-

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-

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-

4

$1.750

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AZTECH Wire

Italy . 174 parts In-Stock

1+ parts

$21.670

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-

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174

$21.670

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Corohmni

South Africa . 274 parts In-Stock

1+ parts

$24.387

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-

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274

$24.387

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IDEA Electronic Components Group

UK . 1,727 parts In-Stock

1+ parts

$72.065

100+ parts

-

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$64.859

10k+ parts

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1,727

$72.065

-

$64.859

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Component Stockers USA

USA . 406 parts In-Stock

1+ parts

$99.990

100+ parts

-

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406

$99.990

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MKK Technologies

India . 1,545 parts In-Stock

1+ parts

$135.514

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1,545

$135.514

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DigiPath Technology Company

USA . 1,545 parts In-Stock

1+ parts

$135.514

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1,545

$135.514

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Kepictronics

USA . 7,980 parts In-Stock

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7,980

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Perfect Parts

USA . 1,551 parts In-Stock

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1,551

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Parana Technologies

USA . 1,372 parts In-Stock

1+ parts

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$86.165

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1,372

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$86.165

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Microchip USA

USA . 424 parts In-Stock

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424

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Corphita

USA . 394 parts In-Stock

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394

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Overview

Unlock limitless possibilities with the PSD835G2-70U from STMicroelectronics, a trusted leader in innovative semiconductor solutions. Designed for versatility and high performance, this parallel I/O port enhances your applications with exceptional reliability and efficiency. Perfect for consumer electronics, industrial automation, and communication systems, it ensures seamless connectivity while reducing power consumption. Elevate your projects and experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures long-lasting performance and reliability in various environments, making it suitable for commercial applications.

Surface Mount: YES

Surface mount technology allows for easier integration into modern circuit boards, saving space and improving overall product design.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for usage in various electronic circuits that require stable voltage supply.

Package Shape: SQUARE

The square package shape permits efficient layout on PCB and optimizes space utilization for compact designs.

Power Supplies (V): 5

Standard 5V supply compatibility makes it ideal for common electronics, reducing the need for additional components.

No. of Terminals: 80

With a total of 80 terminals, this product enables extensive connectivity options for multiple devices and ports.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

The thin profile and fine pitch design cater to modern, high-density circuit board requirements, enabling efficient use of space.

Minimum Supply Voltage: 4.5 V

A range from 4.5 V to 5.5 V ensures the component can operate in diverse power supply conditions, enhancing its versatility.

Maximum Operating Temperature: 70 °C

An elevated maximum operating temperature of 70 °C allows for reliable performance in warmer environments, broadening application areas.

Minimum Operating Temperature: 0 °C

Ability to function from 0 °C ensures suitability for various applications, including those in cooler environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium nickel palladium gold finish enhances electrical conductivity and provides excellent resistance to corrosion.

Ultraviolet Erasable: N

Not being ultraviolet erasable means that this product is suited for permanent applications where reprogramming is not required.

Terminal Position: QUAD

Quad terminal positioning allows for improved signal integrity and helps in managing higher data rates.

No. of Ports: 7

Seven ports provide extensive connection capabilities, suitable for a variety of different peripherals.

Maximum Seated Height: 1.2 mm

Low seated height supports compact designs, facilitating integration in space-constrained applications.

Width: 12 mm

A manageable width of 12 mm is versatile for varying board layouts, making it adaptable for different designs.

Length: 12 mm

At 12 mm in length, this component can easily fit in small electronic designs while still providing ample port connections.

Temperature Grade: COMMERCIAL

Being commercial-grade, this product is designed for reliable performance in standard operating conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it is versatile, suitable for numerous applications, enhancing system flexibility.

ROM Bits Size: 4456448 Bits

A significant ROM size caters to applications requiring substantial data handling, improving functional capabilities.

Technology: CMOS

The CMOS technology supports low power consumption while providing high-speed operation, making it energy efficient.

Terminal Form: GULL WING

Gull wing terminals offer easy soldering and ensure reliable electrical contact, enhancing the durability of assemblies.

Nominal Supply Voltage: 5 V

Standard nominal voltage of 5 V ensures compatibility with a wide range of existing designs, simplifying integration.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm allows for higher density connections, supporting compact electronic designs.

Maximum Standby Current: 0.0002 Amp

Low standby current enhances energy efficiency, reducing power consumption when the device is not in active use.

Maximum Access Time: 0.00000007 ns

An extremely fast access time of 70 picoseconds enables high-speed data transfer, suitable for performance-critical applications.

No. of I/O Lines: 52

Having 52 I/O lines provides abundant data channels, supporting complex operations and numerous peripheral connections.

Technical Specifications

Parallel I/O Ports PSD835G2-70U attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

No. of I/O Lines:

52

No. of Ports:

7

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

4456448 Bits

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

12 mm

Peripheral IC Type:

Trade Compliance

PSD835G2-70U Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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