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PSD834F2V-20MI

STMicroelectronics

PSD834F2V-20MI by STMicroelectronics

PSD834F2V-20MI by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 3.0 to 3.6 V and temperatures from -40 °C to 85°C. It features a compact flatpack design with a max access time of just 200 ns. Ideal for industrial applications requiring reliable data handling in space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,635 parts In-Stock

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9,635

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Digiode

USA . 2,761 parts In-Stock

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2,761

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Anansix

USA . 2,442 parts In-Stock

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2,442

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J2 Sourcing AB

Sweden . 1 parts In-Stock

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-

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 259 parts In-Stock

1+ parts

$15.010

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-

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259

$15.010

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Microchip USA

USA . 188 parts In-Stock

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$20.137

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-

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188

$20.137

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IDEA Electronic Components Group

UK . 1,978 parts In-Stock

1+ parts

$49.075

100+ parts

-

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$44.167

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1,978

$49.075

-

$44.167

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Corohmni

South Africa . 3,173 parts In-Stock

1+ parts

$77.124

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3,173

$77.124

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MKK Technologies

India . 1,396 parts In-Stock

1+ parts

$92.282

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1,396

$92.282

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DigiPath Technology Company

USA . 1,396 parts In-Stock

1+ parts

$92.282

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1,396

$92.282

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 1,098 parts In-Stock

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1,098

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Parana Technologies

USA . 973 parts In-Stock

1+ parts

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$58.676

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973

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$58.676

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Perfect Parts

USA . 237 parts In-Stock

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Kepictronics

USA . 62 parts In-Stock

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Overview

Elevate your designs with the PSD834F2V-20MI from STMicroelectronics, a leader in innovative semiconductor solutions. This robust parallel I/O port boasts exceptional reliability and efficiency for diverse applications, from industrial automation to consumer electronics. With STMicroelectronics' commitment to quality and performance, experience unmatched value that ensures seamless integration and long-lasting operation. Choose the PSD834F2V-20MI and empower your projects with cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and is ideal for automated assembly, reducing manufacturing costs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V ensures compatibility with a wide range of low-voltage applications.

Package Shape: SQUARE

The square package shape facilitates efficient space utilization on PCBs, allowing for enhanced layout flexibility.

Power Supplies (V): 3.3

This product operates at a nominal supply voltage of 3.3 V, common in many modern digital circuits, ensuring broad compatibility.

No. of Terminals: 52

With 52 terminals, it provides ample connectivity options, making it suitable for complex applications requiring multiple inputs and outputs.

Package Style (Meter): FLATPACK

Flatpack style contributes to reduced height profiles, allowing for integration into compact devices without sacrificing performance.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V enables stable operation in various power supply scenarios, enhancing design flexibility.

Maximum Operating Temperature: 85 °C

Operating effectively at temperatures up to 85 °C makes this product suitable for industrial applications exposed to elevated temperatures.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C ensures reliability in extreme cold environments, making it ideal for outdoor and automotive applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish offers excellent corrosion resistance and conductivity, ensuring long-term reliability and low connection resistance.

Ultraviolet Erasable: NO

This specification implies that the product is designed for stability, sticking to conventional memory types that do not require UV erasure.

Terminal Position: QUAD

The quad terminal position provides a compact footprint while facilitating multiple interconnections, further enhancing design versatility.

No. of Ports: 4

Having 4 ports allows for multi-device connectivity, making it suitable for applications that require connecting several peripherals.

Maximum Seated Height: 2.35 mm

A maximum seated height of 2.35 mm is ideal for space-constrained designs, maintaining a low-profile footprint.

Width: 9.95 mm

The compact width of 9.95 mm allows for efficient PCB layout, making it an ideal choice for space-limited designs.

Length: 9.95 mm

The equal length and width contribute to a neat, symmetrical design, aiding in consistent board layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures that the component is robust and suitable for demanding environments.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general purpose parallel I/O port, this IC is versatile, suitable for various applications ranging from consumer electronics to industrial controls.

ROM Bits Size: 2359296 Bits

A large ROM bits size indicates ample storage capacity for complex data and control applications, enabling powerful functionality.

Technology: CMOS

CMOS technology provides low power consumption, making it ideal for battery-operated devices while ensuring high-speed operation.

Terminal Form: GULL WING

Gull wing terminals offer excellent solderability and mechanical strength, ensuring secure connections and enhanced reliability.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V ensures compatibility with modern digital circuits and helps in energy-efficient designs.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for a compact design while maintaining ease of soldering and assembly.

Maximum Standby Current: 0.0001 Amp

A low maximum standby current is ideal for energy-efficient designs, prolonging battery life in portable applications.

Maximum Access Time: 0.0000002 ns

Extremely fast access time ensures that the product can handle high-speed data transfer, crucial for performance-critical applications.

No. of I/O Lines: 27

With 27 I/O lines, this product supports rich connectivity for data transfer, making it suitable for various communication protocols.

Technical Specifications

Parallel I/O Ports PSD834F2V-20MI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.0000002 ns

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

9.95 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.52SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

2359296 Bits

Maximum Seated Height:

2.35 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

9.95 mm

Peripheral IC Type:

Trade Compliance

PSD834F2V-20MI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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