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PSD834F2V-15J

STMicroelectronics

PSD834F2V-15J by STMicroelectronics

PSD834F2V-15J by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 3.0V and 3.6V. It features a compact square package (19.1mm) and supports high-speed access times of 150ns. Ideal for general-purpose applications in commercial environments, it operates within -0 °C to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,480 parts In-Stock

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8,480

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Digiode

USA . 2,716 parts In-Stock

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2,716

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Anansix

USA . 162 parts In-Stock

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162

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LIBRA Elektronik GmbH

Germany . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 49 parts In-Stock

1+ parts

$11.330

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49

$11.330

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Microchip USA

USA . 404 parts In-Stock

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$17.591

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404

$17.591

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IDEA Electronic Components Group

UK . 1,431 parts In-Stock

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$18.550

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-

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$16.695

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1,431

$18.550

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$16.695

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Corohmni

South Africa . 2,915 parts In-Stock

1+ parts

$30.961

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2,915

$30.961

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MKK Technologies

India . 1,440 parts In-Stock

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$34.882

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1,440

$34.882

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DigiPath Technology Company

USA . 1,440 parts In-Stock

1+ parts

$34.882

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1,440

$34.882

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Parana Technologies

USA . 816 parts In-Stock

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$22.179

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$22.179

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Corphita

USA . 493 parts In-Stock

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493

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Perfect Parts

USA . 7 parts In-Stock

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Overview

Unlock the potential of your designs with the PSD834F2V-15J from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality parallel I/O port offers remarkable flexibility and efficiency for diverse applications, from consumer electronics to industrial automation. With its compact surface-mount package and low power consumption, it enhances performance while simplifying integration. Trust in STMicroelectronics' commitment to excellence and elevate your projects with reliable, cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and longevity in various environments.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration onto PCBs.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage provides flexibility for different voltage applications and configurations.

Package Shape: SQUARE

A square package shape facilitates efficient layout and routing on circuit boards.

Power Supplies (V): 3.3

Optimized for 3.3 V power supply, ensuring compatibility with modern low-power applications.

No. of Terminals: 52

With 52 terminals, it offers ample connectivity for various input and output configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier style is effective for thermal dissipation and provides robust mechanical support.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V makes this product suitable for battery-operated devices.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in moderately warm environments.

Minimum Operating Temperature: 0 °C

The ability to operate from 0 °C allows it to function in a variety of ambient conditions.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and offers excellent corrosion resistance.

Ultraviolet Erasable: N

Not ultraviolet erasable, which may simplify design choices for certain applications where data retention is needed.

Terminal Position: QUAD

Quad terminal position supports organized connections and simplified routing in complex circuits.

No. of Ports: 4

Four ports allow for simultaneous connections to multiple devices, enhancing versatility.

Maximum Seated Height: 4.57 mm

The compact maximum seated height is ideal for space-constrained applications.

Width: 19.1 mm

A width of 19.1 mm allows for efficient placement on circuit boards without wasting space.

Length: 19.1 mm

With a length equal to its width, it offers a balanced form factor for uniform integration.

Temperature Grade: COMMERCIAL

Commercial temperature grade guarantees performance under standard operating conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Designed as a general-purpose parallel I/O port IC, it is versatile for various applications.

ROM Bits Size: 2359296 Bits

A substantial ROM bit size provides ample memory for data storage and processing tasks.

Technology: CMOS

CMOS technology ensures low power consumption, which is vital for energy-efficient designs.

Terminal Form: J BEND

J bend terminal form provides secure mounting and reliable electrical connection.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V offers optimal performance while reducing power consumption.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for a dense arrangement of connections without compromising integrity.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current minimizes energy consumption, making it ideal for battery-powered devices.

Maximum Access Time: 0.00000015 ns

Exceptional access time enhances performance in high-speed applications, ensuring data is processed rapidly.

No. of I/O Lines: 27

With 27 I/O lines, it provides the ability to handle multiple input/output tasks simultaneously, improving overall efficiency.

Technical Specifications

Parallel I/O Ports PSD834F2V-15J attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQCC-J52

JESD-609 Code:

e3

Length:

19.1 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

2359296 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

19.1 mm

Peripheral IC Type:

Trade Compliance

PSD834F2V-15J Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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