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PSD813F2VA-15M

STMicroelectronics

PSD813F2VA-15M by STMicroelectronics

PSD813F2VA-15M by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating at 3.0-3.6V and a max temp of 70 °C. It features a compact flatpack design with 52 terminals for efficient integration in various applications. Ideal for general-purpose use in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,915 parts In-Stock

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12,915

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Anansix

USA . 2,235 parts In-Stock

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2,235

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Digiode

USA . 618 parts In-Stock

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618

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Connector Distribution Corp

USA . 12 parts In-Stock

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12

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Right Parts Inc.

USA . 12 parts In-Stock

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12

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 886 parts In-Stock

1+ parts

$17.970

100+ parts

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886

$17.970

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Microchip USA

USA . 450 parts In-Stock

1+ parts

$19.649

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450

$19.649

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IDEA Electronic Components Group

UK . 981 parts In-Stock

1+ parts

$37.304

100+ parts

-

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$33.574

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981

$37.304

-

$33.574

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MKK Technologies

India . 2,164 parts In-Stock

1+ parts

$70.148

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2,164

$70.148

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DigiPath Technology Company

USA . 2,164 parts In-Stock

1+ parts

$70.148

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2,164

$70.148

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Corohmni

South Africa . 1,164 parts In-Stock

1+ parts

$83.523

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1,164

$83.523

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Component Stockers USA

USA . 598 parts In-Stock

1+ parts

$99.990

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598

$99.990

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Corphita

USA . 1,446 parts In-Stock

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1,446

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Parana Technologies

USA . 54 parts In-Stock

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$44.603

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54

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$44.603

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Overview

Unlock the potential of your designs with the PSD813F2VA-15M from STMicroelectronics—a leader in semiconductor innovation. This versatile Parallel I/O Port solution offers unparalleled reliability and efficiency, making it ideal for a range of applications from consumer electronics to industrial automation. With its compact design and robust performance, you can streamline your projects while enjoying the peace of mind that comes from working with a trusted manufacturer. Elevate your next project with unmatched quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures lightweight construction and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for higher density circuit designs, which is ideal for modern compact electronic devices.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6V provides flexibility in integration into various systems while ensuring reliability.

Package Shape: SQUARE

The square package shape aids in efficient use of board space and allows for optimal thermal management.

Power Supplies (V): 3.3

Operating at 3.3V is favorable for low-power applications, making it energy-efficient and suitable for battery-operated devices.

No. of Terminals: 52

With 52 terminals, this component can handle a substantial amount of connectivity, enhancing its versatility in complex circuits.

Package Style (Meter): FLATPACK

The flatpack style optimizes surface area on PCBs, offering a better fit in applications with tight space constraints.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V allows for operation in a variety of voltage environments, increasing compatibility.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C allows the product to be used in various environments, including those that experience higher temperatures.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, it ensures reliable performance in conditions approaching freezing.

Terminal Finish: MATTE TIN

Matte tin terminal finish improves solderability during assembly, enhancing reliability and reducing manufacturing defects.

Terminal Position: QUAD

Quad terminal positioning enables easier routing on PCB layouts, enhancing design flexibility.

No. of Ports: 4

Having 4 ports allows for simultaneous data transfer, making it suitable for multitasking applications.

Maximum Seated Height: 2.35 mm

A low seated height minimizes the overall profile of the device, contributing to slim device designs.

Width: 10 mm

A compact width of 10mm is ideal for space-constrained applications, ensuring efficient PCB usage.

Maximum Time At Peak Reflow Temperature (s): 30

This time threshold is conducive to effective soldering processes, resulting in reliable bonding during manufacturing.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C ensures compatibility with standard soldering processes, enhancing manufacturability.

Length: 10 mm

A length of 10mm contributes to a balanced footprint, allowing for efficient usage in various designs.

Temperature Grade: COMMERCIAL

Being commercially rated offers a good range of operational stability for general-purpose applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

This classification supports diverse applications, making it suitable for a wide range of devices including consumer electronics.

ROM Bits Size: 1310720 Bits

With 1310720 bits of ROM, it provides significant data handling capacity for applications requiring storage.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making it ideal for modern electronics.

Terminal Form: GULL WING

Gull wing terminals provide good solder joint stability and ease of assembly, reducing manufacturing risks.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3V ensures reduced thermal issues and power draw, enhancing efficiency.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65mm allows for compact designs while maintaining adequate spacing for soldering.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring standard precautions during handling, which is manageable in production.

Maximum Standby Current: 0.0001 Amp

A low maximum standby current ensures minimal power loss when idle, making it a great choice for energy-conscious designs.

Maximum Access Time: 0.00000015 ns

Extremely fast access time promotes high-speed data processing, making it suitable for performance-sensitive applications.

No. of I/O Lines: 27

Having 27 I/O lines provides ample connection options for various peripherals, enhancing its utility in complex systems.

Technical Specifications

Parallel I/O Ports PSD813F2VA-15M attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.52SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

2.35 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Ultraviolet Erasable:

N

Width:

10 mm

Peripheral IC Type:

Trade Compliance

PSD813F2VA-15M Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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