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PSD813F2A-90M

STMicroelectronics

PSD813F2A-90M by STMicroelectronics

PSD813F2A-90M by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 4.5V and 5.5V. It features a compact flatpack design with a max temp of 70 °C and offers fast access time of just 90 ns, ideal for general-purpose applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,118 parts In-Stock

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8,118

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Digiode

USA . 2,831 parts In-Stock

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2,831

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Zilex Electronics Inc.

Canada . 748 parts In-Stock

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748

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Anansix

USA . 184 parts In-Stock

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184

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Chip Stock

USA . 175 parts In-Stock

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175

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Distributors (Availability)

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AZTECH Wire

Italy . 410 parts In-Stock

1+ parts

$8.120

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410

$8.120

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Microchip USA

USA . 163 parts In-Stock

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$25.206

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163

$25.206

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IDEA Electronic Components Group

UK . 1,175 parts In-Stock

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$56.460

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$50.814

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1,175

$56.460

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$50.814

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Corohmni

South Africa . 821 parts In-Stock

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$78.965

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821

$78.965

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Component Stockers USA

USA . 657 parts In-Stock

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$99.990

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657

$99.990

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MKK Technologies

India . 1,815 parts In-Stock

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$106.170

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1,815

$106.170

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DigiPath Technology Company

USA . 1,815 parts In-Stock

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$106.170

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1,815

$106.170

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Corphita

USA . 4,914 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,860 parts In-Stock

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Parana Technologies

USA . 420 parts In-Stock

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$67.507

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Unlock the potential of your designs with the PSD813F2A-90M from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics delivers unparalleled reliability in parallel I/O solutions. This versatile device is perfect for applications ranging from consumer electronics to industrial automation. Enjoy superior performance, energy efficiency, and seamless integration, empowering your projects with the durability and cutting-edge technology you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures longevity and stability, making this component suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, saving space on PCBs and enhancing assembly efficiency.

Maximum Supply Voltage: 5.5 V

This maximum voltage rating provides flexibility in circuit design, ensuring compatibility with a wide range of devices.

Package Shape: SQUARE

The square shape helps in optimal space utilization on the circuit board.

Power Supplies (V): 5

Designed for standard 5V operation, this component is ideal for common digital circuits.

No. of Terminals: 52

A higher number of terminals enables connections to multiple devices and enhances functionality.

Package Style (Meter): FLATPACK

Flatpack design facilitates easier handling and mounting on circuit boards.

Minimum Supply Voltage: 4.5 V

The lower supply voltage requirement allows for energy-efficient operation in low-power applications.

Maximum Operating Temperature: 70 °C

With a high operating temperature range, this component is suitable for demanding environments.

Minimum Operating Temperature: 0 °C

Operational capability from 0 °C ensures reliable performance in standard conditions.

Terminal Finish: MATTE TIN

Matte tin finish enhances wire bonding capabilities and ensures better solderability.

Ultraviolet Erasable: N

Non-ultraviolet erasable design simplifies the use-case scenario without additional complexities.

Terminal Position: QUAD

Quad terminal positioning allows for efficient electrical connections and layout versatility.

No. of Ports: 4

Four ports provide expanded connectivity options for peripherals and other components.

Maximum Seated Height: 2.35 mm

A low seated height allows for space-saving designs in compact applications.

Width: 10 mm

Compact width aids in fitting into space-constrained designs.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures compatibility with standard reflow soldering processes, making manufacturing easier.

Peak Reflow Temperature: 260 C

High temperature tolerance ensures robust performance during assembly processes.

Length: 10 mm

The length complements its width, resulting in a square design that fits efficiently in compact spaces.

Temperature Grade: COMMERCIAL

Commercial grade classification ensures suitability for a variety of general-purpose applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it is versatile for different application needs.

ROM Bits Size: 1310720 Bits

Larger ROM size allows for more data storage, supporting complex functionalities.

Technology: CMOS

CMOS technology ensures low power consumption and greater efficiency, making this product energy-friendly.

Terminal Form: GULL WING

Gull wing terminals enhance surface mount assembly and solderability.

Nominal Supply Voltage: 5 V

The nominal 5V supply voltage is commonly used in many applications, enhancing compatibility.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch strikes a balance between space-saving and easy interconnections.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates reasonable moisture sensitivity, which can be managed with standard precautions during assembly.

Maximum Standby Current: 0.0002 Amp

Low standby current ensures power efficiency, particularly in battery-operated devices.

Maximum Access Time: 0.00000009 ns

Fast access time provides high speed operation, making it suitable for time-sensitive applications.

No. of I/O Lines: 27

A higher number of I/O lines enables better interfacing with multiple components, enhancing the device's functionality.

Technical Specifications

Parallel I/O Ports PSD813F2A-90M attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.52SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

2.35 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Ultraviolet Erasable:

N

Width:

10 mm

Peripheral IC Type:

Trade Compliance

PSD813F2A-90M Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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