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PSD813F1-A-90MI

STMicroelectronics

PSD813F1-A-90MI by STMicroelectronics

PSD813F1-A-90MI by STMicroelectronics is a CMOS parallel I/O port with 27 I/O lines, operating b/w 4.5V and 5.5V. It features a compact flatpack design with a max temp of 85 °C, ideal for industrial applications requiring reliable data handling. Its high access speed of 90 ns ensures efficient performance in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 12,533 parts In-Stock

1+ parts

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12,533

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Digiode

USA . 3,564 parts In-Stock

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3,564

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Anansix

USA . 349 parts In-Stock

1+ parts

-

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-

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349

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LIBRA Elektronik GmbH

Germany . 3 parts In-Stock

1+ parts

-

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 913 parts In-Stock

1+ parts

$10.250

100+ parts

-

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-

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-

913

$10.250

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Corohmni

South Africa . 10 parts In-Stock

1+ parts

$26.042

100+ parts

-

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10

$26.042

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IDEA Electronic Components Group

UK . 1,809 parts In-Stock

1+ parts

$71.376

100+ parts

-

1k+ parts

$64.239

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1,809

$71.376

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$64.239

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MKK Technologies

India . 1,103 parts In-Stock

1+ parts

$134.219

100+ parts

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1,103

$134.219

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DigiPath Technology Company

USA . 1,103 parts In-Stock

1+ parts

$134.219

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1,103

$134.219

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Microchip USA

USA . 5,735 parts In-Stock

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5,735

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Corphita

USA . 4,386 parts In-Stock

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4,386

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Parana Technologies

USA . 951 parts In-Stock

1+ parts

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100+ parts

$85.341

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951

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$85.341

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Overview

Unlock unmatched performance with the PSD813F1-A-90MI from STMicroelectronics, a leader in innovation and quality. This versatile parallel I/O port solution offers seamless integration for a variety of applications, ensuring reliability in even the harshest environments. With its robust design and efficient power management, it delivers exceptional value, empowering your projects to achieve greater efficiency and longevity. Experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount technology (SMT) allows for reduced PCB space and enables high-density circuit designs.

Maximum Supply Voltage: 5.5 V

This provides flexibility in power supply options, ensuring compatibility with various systems.

Package Shape: SQUARE

The square package shape is efficient for PCB layout, optimizing space usage.

Power Supplies (V): 5

Operating on a standard 5V power supply makes this product versatile and easy to integrate.

No. of Terminals: 52

A higher number of terminals allows for more connections, enhancing functionality and versatility.

Package Style (Meter): FLATPACK

Flatpack design facilitates easier mounting and is ideal for compact applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage ensures stable operation even in low-power scenarios.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product is suitable for industrial applications that experience heat.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes the product reliable under extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The gold-plated terminal finish reduces oxidation and improves electrical conductivity.

Ultraviolet Erasable: N

Not being ultraviolet erasable means it is designed for reliable, long-term applications without frequent reprogramming.

Terminal Position: QUAD

Quad terminal positions enhance connectivity options and layout organization.

No. of Ports: 4

Four ports provide versatile connectivity options for various peripheral devices.

Maximum Seated Height: 2.35 mm

The low seated height allows for a compact design, which is beneficial for space-constrained applications.

Width: 10 mm

The 10 mm width is ideal for compact board designs, allowing for efficient use of space.

Length: 10 mm

This length complements the width for a perfect square shape, optimizing layout and fitting in tight spaces.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates suitability for harsh environments and longevity.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, this IC can be applied in numerous applications, providing flexibility.

ROM Bits Size: 1310720 Bits

A substantial ROM size allows for ample data storage and more flexible programming options.

Technology: CMOS

CMOS technology ensures low power consumption and high speed, promoting efficient operation.

Terminal Form: GULL WING

Gull wing terminals enhance soldering reliability and make assembly easier on PCBs.

Nominal Supply Voltage: 5 V

Operating nominally at 5V aligns with many electronic devices, simplifying integration.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for fine pitch designs, supporting high-density PCB layouts.

Maximum Standby Current: 0.0002 Amp

The minimal standby current indicates low power consumption, making it energy efficient.

Maximum Access Time: 0.00000009 ns

Ultra-fast access time ensures high-speed operation, critical for performance-intensive applications.

No. of I/O Lines: 27

With 27 I/O lines, this product supports multiple data pathways, increasing versatility in applications.

Technical Specifications

Parallel I/O Ports PSD813F1-A-90MI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

JESD-30 Code:

S-PQFP-G52

JESD-609 Code:

e4

Length:

10 mm

No. of I/O Lines:

27

No. of Ports:

4

No. of Terminals:

52

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP52,.52SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

1310720 Bits

Maximum Seated Height:

2.35 mm

Maximum Standby Current:

.0002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

10 mm

Peripheral IC Type:

Trade Compliance

PSD813F1-A-90MI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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