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M93S56-WBN6P

STMicroelectronics

M93S56-WBN6P by STMicroelectronics

M93S56-WBN6P by STMicroelectronics is a 2048-bit EEPROM with a synchronous operating mode and supports both 3V and 5V power supplies. It features a max clock frequency of 2 MHz, ensuring fast data access, and offers hardware/software write protection for enhanced reliability. Ideal for industrial applications, it operates in temperatures from -40 °C to 85 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,492 parts In-Stock

1+ parts

-

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7,492

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Digiode

USA . 3,358 parts In-Stock

1+ parts

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3,358

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Anansix

USA . 1,825 parts In-Stock

1+ parts

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1,825

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,904 parts In-Stock

1+ parts

$3.651

100+ parts

-

1k+ parts

$3.286

10k+ parts

-

1,904

$3.651

-

$3.286

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MKK Technologies

India . 1,029 parts In-Stock

1+ parts

$6.865

100+ parts

-

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-

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-

1,029

$6.865

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DigiPath Technology Company

USA . 1,029 parts In-Stock

1+ parts

$6.865

100+ parts

-

1k+ parts

-

10k+ parts

-

1,029

$6.865

-

-

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AZTECH Wire

Italy . 278 parts In-Stock

1+ parts

$21.010

100+ parts

-

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278

$21.010

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Microchip USA

USA . 189 parts In-Stock

1+ parts

$46.828

100+ parts

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189

$46.828

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Component Stockers USA

USA . 522 parts In-Stock

1+ parts

$99.990

100+ parts

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522

$99.990

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Parana Technologies

USA . 853 parts In-Stock

1+ parts

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$4.365

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853

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$4.365

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Corphita

USA . 516 parts In-Stock

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516

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Overview

Unlock limitless possibilities with the M93S56-WBN6P EEPROM from STMicroelectronics, a leader in innovation and reliability. This high-quality memory solution ensures exceptional performance in diverse applications, from industrial automation to consumer electronics. With robust data retention and flexible voltage options, it empowers your designs while enhancing durability. Choose STMicroelectronics for trusted performance, and experience unmatched value that propels your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight construction ensures longevity and reliability in various environments.

Package Shape: RECTANGULAR

Compact form factor optimizes space on the PCB, allowing for high-density designs.

Operating Mode: SYNCHRONOUS

Enabled fast data transfer and efficient operation, making the device ideal for high-speed applications.

Nominal Supply Voltage / Vsup: 5 V

Standard voltage compatibility ensures easy integration into existing systems.

Power Supplies (V): 3/5

Flexible supply voltage range provides versatility for various applications.

No. of Terminals: 8

Sufficient I/O pins for connectivity without overwhelming space on the PCB.

Package Style (Meter): IN-LINE

Facilitates straightforward mounting and soldering process.

Maximum Operating Temperature: 85 °C

Suitable for high-temperature environments, ensuring reliable performance under severe conditions.

Organization: 128X16

Logical arrangement enhances data access efficiency, optimizing read and write operations.

Minimum Operating Temperature: -40 °C

Designed for extremes, making it an excellent choice for industrial applications.

Terminal Finish: MATTE TIN

Provides excellent solderability and corrosion resistance for improved reliability.

Terminal Position: DUAL

Allows for easier connections and more flexible circuit design.

Write Protection: HARDWARE/SOFTWARE

Offers flexible write protection mechanisms, enhancing data integrity and security.

Maximum Seated Height: 5.33 mm

Low-profile design enables use in compact applications, saving space on the PCB.

Maximum Clock Frequency (fCLK): 2 MHz

High clock speed ensures rapid data processing and retrieval, increasing system performance.

Width: 7.62 mm

Optimal width allows for easy integration into dense circuit designs.

Minimum Supply Voltage: 2.5 V

Ability to operate at lower voltages supports power-sensitive applications.

Length: 9.27 mm

Compact length perfect for space-limited applications without compromising performance.

Temperature Grade: INDUSTRIAL

Designed for industrial use, ensuring durability and reliability in tough environments.

Technology: CMOS

Energy-efficient technology leads to lower power consumption and enhanced performance.

Parallel or Serial: SERIAL

Serial communication interface simplifies board design and reduces pin count.

Terminal Form: THROUGH-HOLE

Robust attachment method provides strong mechanical support and reliability.

Maximum Supply Current: 2 mA

Low current draw is ideal for battery-operated devices, extending operational life.

No. of Words: 128 words

Sufficient storage capacity for a wide range of applications while maintaining compact size.

Memory Width: 16

Wide memory width enables efficient data handling and faster data access.

Minimum Data Retention Time: 40 years

Long data retention ensures reliability and peace of mind for critical applications.

Terminal Pitch: 2.54 mm

Standard pitch facilitates ease of handling and integration into various circuit designs.

No. of Words Code: 128

Well-defined memory allocation allows for organized data storage and easy access.

Maximum Supply Voltage (Vsup): 5.5 V

Higher voltage tolerance provides flexibility in design and compatibility with various circuits.

Endurance: 1,000,000 Write/Erase Cycles

High endurance rating makes it suitable for applications requiring frequent updates.

Serial Bus Type: MICROWIRE

Established communication protocol simplifies integration and enhances performance.

Maximum Write Cycle Time (tWC): 5 ms

Quick write cycle time improves data logging and real-time applications.

Memory Density: 2048 bit

Sufficient memory density for diverse applications, ensuring data storage efficiency.

Memory IC Type: EEPROM

Non-volatile memory type ensures data retention without power, ideal for critical applications.

Maximum Standby Current: 0.000005 Amp

Extremely low standby current enhances overall power efficiency, perfect for portable devices.

Technical Specifications

EEPROM M93S56-WBN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

2 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

8

No. of Words:

128 words

No. of Words Code:

128

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128X16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

MICROWIRE

Maximum Standby Current:

.000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

M93S56-WBN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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